JPH01192121A - Semiconductor wafer - Google Patents

Abstract

PURPOSE:To enable the sliced position of a wafer to be indicated easily and accurately by a method wherein an ingot is provided with a slit on the side thereof while notches indicating the positions sliced from the ingot by the slit are formed on the peripheral part of semiconductor wafers formed by slicing the ingot. CONSTITUTION:When orientation flats 2, 3 are machined on a cylindrical ingot, a slit 4 is cut in the diagonal direction on the flat 2. Next, the ingot 1 is sliced to manufacture wafers 5A, 5B. Notch parts 6A, 6B are formed on the flat 2 surface corresponding to the slit 4. Through these procedures, a wafer with the notch part 6A formed on the left side of the flat 2 surface indicates that it is sliced, e.g., from the seed side of the ingot 1 while another wafer with the notch part 6B formed on the right side indicates that it is sliced from the tail side of the ingot 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for displaying slice positions when a semiconductor wafer, particularly an ingot, is sliced.

[Prior Art] When slicing an ingot in a semiconductor wafer, especially a compound semiconductor wafer, various effects may occur, such as changes in gearia concentration characteristics or crystal characteristics depending on the slicing position. .

Therefore, when manufacturing devices using these wafers, it is necessary to adjust the manufacturing conditions in consideration of the position taken out from the ingot. Therefore, during manufacturing, it is important to control the order in which wafers are sliced, and for this reason, wafers are managed by assigning numbers (Nα) to them.

When numbering wafers, number the seed side of the ingot (
The wafers are recorded by arranging them in the order in which they were sliced from either the seed crystal side) or the sol side, but recently, as an alternative to this, a method has been used that uses a laser beam to mark the wafer and display it. .

[Problems to be solved by the invention] As mentioned above, wafers sliced from an ingot are numbered and managed, but in this case, this number is not displayed on the wafer itself, but on the wafer itself. It will be displayed on the case where it is stored. Therefore, when the wafers are taken out of the case and transferred to another location, the arrangement order may sometimes be incorrect. Since such errors cannot be corrected again, a great deal of effort is required to ensure accuracy when managing wafer numbers.

In the method of marking the wafer using a laser beam, it is easy to peel it off even if there is a mistake in the arrangement order, but the equipment is very expensive, and the process from slicing to marking the wafer still The order must be controlled and there is still a risk of making mistakes.

An object of the present invention is to provide a semiconductor wafer that easily and reliably displays the slice position of the wafer.

[Means for Solving the Problems] The present invention provides a semiconductor wafer formed by slicing an ingot into one wafer, in which the ingot has a slit on the side surface, and a semiconductor wafer formed by slicing the ingot. The wafer is characterized in that a notch is provided at the periphery to indicate the position where the ingot has been sliced based on the slit, so that the slicing position of the wafer can be easily determined to achieve the purpose. be.

[Function] In the semiconductor wafer of the present invention, in order to determine characteristics such as which part of the ingot the wafer sliced out from the ingot corresponds to and which number the wafer was sliced, for example, Orientation: Cut a slit diagonally downward from the f direction on the flat surface,
Since the wafer is sliced and taken out in this state, a notch corresponding to the above-mentioned slit will be formed in the orientation flat portion of the sliced wafer. In other words, if all the sliced wafers are stacked together, diagonal slits will appear as in the case of ingots, so by assigning numbers to these notches for each wafer and examining them, you can determine where this wafer is located. Necessary data such as the number of items listed can be easily determined.

[Examples] Examples of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of an ingot showing an embodiment of the semiconductor wafer of the present invention, and FIG. 2 shows the wafer. FIG. Shows when sliced.

In each figure, 1 indicates an ingot, 2.3 indicates an orientation flat surface, and 4 indicates a slit.

5A and 5B are wafers, and 6A and 6B are notches.

In the case of a semiconductor wafer according to this embodiment, an orientation flat surface (hereinafter referred to as a flat surface) 2.3 is formed on a cylindrical ingot 1, and then a slit 4 is cut in the flat surface 2 in an oblique direction.

Next, this ingot 1 is sliced to produce wafers 5A and 5B as shown in FIG. Notches 6A and 6B are formed on the flat surface to correspond to the slits 4.

In the case of the figure, the notch 6A that occurs on the left side of the flat surface 2 represents, for example, a wafer that has been placed on the seed side of the ingot 1, and the one where the notch 6B occurs on the right side represents the tail of the ingot 1. This indicates that the wafer is sliced from the side.

That is, by examining the positions of the notches 6A and 6B, the position and order in which the wafer was sliced can be clearly determined.

In this embodiment, the slits 4 are formed as diagonal lines that are ground from the upper left to the lower right of the flat surface 2 (Fig. 1), but the slits 4 may be made in plural or may be ground on the curved surface of the ingot 1. Moreover, the direction may be changed, and by combining these, it becomes possible to determine the type of ingot and the cutting direction.

As described above, by using this embodiment, the following effects can be obtained.

1. The position and order of wafers sliced from an ingot can be clearly displayed.

2. Wafers can be easily stored and stored, and management costs can be significantly reduced.

[Effects of the Invention] According to the present invention, it is possible to provide a semiconductor wafer that easily and reliably displays the slice position of the wafer.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an ingot including an embodiment of the semiconductor wafer of the present invention, and FIG. 2 is a plan view of the wafer. 1: Ingot, 2.3: Orientation flat surface, 4: Screw
Rit, 5A, 5B: wafer, 6A, 6B: cut section. Day i 6A, 6δ: The sword (Mourning iz + Illusion)

Claims (1)

[Claims] 1. In a semiconductor wafer obtained by slicing an ingot, a slit extending diagonally is formed on the orientation flat surface provided on the side surface of the ingot, and by slicing the ingot, the slits are formed at the periphery of the semiconductor wafer. A semiconductor wafer characterized in that a notch is provided to indicate a position where the ingot is sliced based on the slit.