JPH01191020A - Automatic measuring method for coating amount of solder cream at the time of printing screen - Google Patents
Automatic measuring method for coating amount of solder cream at the time of printing screenInfo
- Publication number
- JPH01191020A JPH01191020A JP1663888A JP1663888A JPH01191020A JP H01191020 A JPH01191020 A JP H01191020A JP 1663888 A JP1663888 A JP 1663888A JP 1663888 A JP1663888 A JP 1663888A JP H01191020 A JPH01191020 A JP H01191020A
- Authority
- JP
- Japan
- Prior art keywords
- conveyor
- solder cream
- substrate
- screen printing
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 41
- 239000006071 cream Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims description 8
- 239000011248 coating agent Substances 0.000 title abstract description 10
- 238000000576 coating method Methods 0.000 title abstract description 10
- 238000007639 printing Methods 0.000 title description 8
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000005303 weighing Methods 0.000 claims description 21
- 238000007650 screen-printing Methods 0.000 claims description 19
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 230000002950 deficient Effects 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Artificial Filaments (AREA)
- Laminated Bodies (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はスクリーン印刷機を用いてハイブリッド丁Ｃ基
板上にソルダークリームを塗布する際、該ソルダークリ
ームの塗布量を自動計測する方法として利用される。Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention provides a method for automatically measuring the amount of solder cream applied when applying the solder cream onto a hybrid C board using a screen printing machine. It is used as a method to
（従来の技術）
ハイブリッドＩＣ（以降ＨＩＣ）と呼称する）は、ＨＩ
Ｇ基板上にソルダークリームをスクリーン印刷にて塗布
し、そこへチップ素子を実装した後、リフロー炉に入れ
はんだを溶融させて、チップをはんだ付することにより
作られる。その中でソルダークリームの塗布量は、はん
だ付強度に大きく影響し、少ないと強度不足、多過ぎる
と隣のはんだとブリッジ現象を起す。したがって塗布量
の管理はＨＩＣ製作上の重要なファクターになる。(Prior art) Hybrid IC (hereinafter referred to as HIC) is a
It is made by applying solder cream on the G board by screen printing, mounting the chip element thereon, then placing it in a reflow oven to melt the solder and soldering the chip. The amount of solder cream applied greatly affects the soldering strength; too little will cause insufficient strength, and too much will cause bridging with the neighboring solder. Therefore, controlling the coating amount is an important factor in HIC production.
ところで、従来、ソルダークリームの塗布量は、全数管
理しておらず、単にスクリーン印刷条件（印圧力、傾き
等）の設定と、印刷状態の目視判断とで管理を行ってい
る。By the way, conventionally, the amount of solder cream applied has not been totally managed, but has been managed simply by setting screen printing conditions (printing force, inclination, etc.) and visual judgment of the printing state.
（発明が解決しようとする課り
しかし、上記の方法によると一印刷状態の良否は目視判
断によるため、塗布量の多い、少ないに対して正確に判
定することは困難であり、信軌性という点で十分な保証
がされていなかった。(Issues that the invention seeks to solve) However, according to the above method, the quality of the printing condition is judged visually, so it is difficult to accurately judge whether the coating amount is large or small, and There was no sufficient guarantee in that respect.
本発明は上記問題にかんがみ、ソルダークリームの塗布
量を、目視判断にゆだめることなく、計量値で且つ正確
に計測できるようにすることを、その技術的課題とする
ものである。In view of the above-mentioned problems, the technical object of the present invention is to enable the amount of solder cream to be applied to be accurately measured using a measured value without relying on visual judgment.
（課題を解決するための手段）
上記技術的課題を解決するために講じた技術的手段は、
コンベアによって搬送されてきた基板にスクリーン印刷
機にてソルダークリームが塗布されるスクリーン印刷に
おいて、前記スクリーン印刷機の上流側と下流側とに前
記コンベアの下面に近接して電子天秤を載置した第１．
第２の計量ステーションと、該第１．第２の計量ステー
ションに載置された電子天秤に接続された制御装置とを
設け、前記コンベアによって搬送されてきた基板が前記
第１．第２計量ステーションへきたとき、前記コンベア
が停止および降下して前記電子天秤上にのせられ、該電
子天秤によってソルダークリーム塗布前、塗布後の夫々
の重量が計測されると共に、前記制御装置により、ソル
ダークリームの塗布量が自動計算され、あらかじめ設定
された数値と比較判定される、ソルダークリームのスク
リーン印刷時の塗布量自動計測方法である。(Means to solve the problem) The technical measures taken to solve the above technical problem are:
In screen printing, in which solder cream is applied by a screen printing machine to a board conveyed by a conveyor, electronic balances are placed close to the bottom surface of the conveyor on the upstream and downstream sides of the screen printing machine. 1.
a second weighing station; a control device connected to an electronic balance placed on the second weighing station, and the substrate transported by the conveyor is transferred to the first weighing station. When reaching the second weighing station, the conveyor stops and descends to be placed on the electronic balance, and the electronic balance measures the weight before and after applying the solder cream, and the control device This is an automatic method for measuring the amount of solder cream applied during screen printing, in which the amount of solder cream applied is automatically calculated and compared with a preset value.
（作用）
上記技術的手段によって、基板のソルダークリーム−塗
布量は、電子天秤および制御装置によりソルダークリー
ム塗布後と塗布前との重量差でもって計算され、且つ塗
布量が判明すると同時に制御装置に記憶された設定値と
比較して設定値以外の場合は不良品となり、良品のみア
ウトプットされる。したがって、従来の目視判断に代っ
て、正確に良否の判定が行うことができ、従来の問題は
解消される。(Function) With the above technical means, the amount of solder cream applied to the board is calculated by the electronic balance and the control device based on the weight difference between after and before application of the solder cream, and as soon as the amount of solder cream is determined, the amount of solder cream applied to the board is calculated by the control device. When compared with the stored set value, if the value is not the set value, the product is considered defective, and only good products are output. Therefore, instead of the conventional visual judgment, it is possible to accurately judge whether the product is good or bad, and the conventional problems are solved.
（実施例） 以下、本発明の実施例について図面に基づき説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図〜第２図において、コンベア１の上面には基板２
が載置され、基板２はコンベア１によって搬送される。1 and 2, the upper surface of the conveyor 1 has a substrate 2
is placed thereon, and the substrate 2 is transported by the conveyor 1.
コンベア１の中央部には基板２にソルダークリームを塗
布するスクリーン印刷機３が配置され、該スクリーン印
刷機３の本体３ａはコンベアｌの下面側に、印刷機の型
枠部３ｂはコンベア１の上面側に位置し、本体３ａの上
面には治具４がセットされている。A screen printing machine 3 for applying solder cream to the substrate 2 is arranged in the center of the conveyor 1. The main body 3a of the screen printing machine 3 is on the bottom side of the conveyor 1, and the formwork part 3b of the printing machine is on the bottom side of the conveyor 1. A jig 4 is located on the upper surface side and is set on the upper surface of the main body 3a.
スクリーン印刷機３の上流側および下流側には、第１計
量ステーション５．第２計量ステーショ、ン６がコンベ
ア１の下面側に近接して設けられており、該第１計量ス
テーション５．第２計量ステーション６には電子天秤７
．８が夫々配置され、電子天秤７．８は制御装置９に接
続されている。Upstream and downstream of the screen printing machine 3 there are first weighing stations 5. A second weighing station 6 is provided adjacent to the bottom side of the conveyor 1, and the first weighing station 5. The second weighing station 6 has an electronic balance 7.
．． 8 are arranged respectively, and the electronic balances 7.8 are connected to the control device 9.
電子天秤７．８は、コンベア１によって搬送されてきた
基板２のソルダークリーム塗布前および塗布後の重量を
計測するものであり、基板２が第１計量ステーション５
．第２ステーション６にきたとき、第３図〜第４図に示
すようにコンベア１が自動的に停止すると共に、第１計
量ステーション５．第２計量ステーション６に対応する
コンベア１の一部分が降下してコンベアｌ上にあった基
板２が電子天秤７，８上にのせられ、電子天秤７゜８は
ソルダークリーム塗布前、塗布後の基板２の重量を計測
する。また電子天秤７，８は、制御装置９に接続されて
おり、電子天秤７．８によって計測された基板２のソル
ダークリーム塗布前、および塗布後の重量は制御装置９
にインプットされ、インプットされたデータは、制御装
置９に記憶されると共に、ソルダークリーム塗布前の基
板２の重量および塗布後の基板２の重量との差を計算し
て、その塗布量があらかじめ設定された範囲内（最大値
と最小値）であれば、良品、塗布量が範囲外であれば不
良品として判定され、不良品が発生するとコンベア１は
自動的に停止するようになっている。The electronic balance 7.8 measures the weight of the board 2 transported by the conveyor 1 before and after applying solder cream, and the board 2 is placed at the first weighing station 5.
．． When the conveyor 1 reaches the second weighing station 6, the conveyor 1 automatically stops as shown in FIGS. A portion of the conveyor 1 corresponding to the second weighing station 6 descends, and the substrate 2 that was on the conveyor 1 is placed on the electronic balances 7 and 8. Measure the weight of 2. Further, the electronic balances 7 and 8 are connected to a control device 9, and the weight of the board 2 before and after applying the solder cream measured by the electronic balance 7.8 is calculated by the control device 9.
The input data is stored in the control device 9, and the application amount is set in advance by calculating the difference between the weight of the board 2 before applying the solder cream and the weight of the board 2 after applying the solder cream. If the coating amount is within the specified range (maximum value and minimum value), it is determined to be a good product, and if the coating amount is outside the range, it is determined to be a defective product. When a defective product occurs, the conveyor 1 is automatically stopped.
上記構成により、基板２がコンベア１によって搬送され
、第１計量ステーション５へきたとき、コンベア１が停
止すると同時にコンベア１の一部分が降下し、コンベア
１上にあった基板２は電子天秤７上にのせられ、電子天
秤７は基板２のソルダークリーム塗布前の重量を計測し
、そのデータは制御装置９によって記憶される。With the above configuration, when the substrate 2 is conveyed by the conveyor 1 and reaches the first weighing station 5, a part of the conveyor 1 descends at the same time as the conveyor 1 stops, and the substrate 2 that was on the conveyor 1 is placed on the electronic balance 7. The electronic balance 7 measures the weight of the board 2 before applying the solder cream, and the data is stored by the control device 9.
次に第１計量ステーション５での計測が終了するとコン
ベア１は降下していた一部分が元の位置へ復帰し、基板
２はスクリーン印刷機３のところ迄搬送され、ここでス
クリーン印刷機３によって基板２にソルダークリームを
印刷して塗布が行われる。Next, when the measurement at the first weighing station 5 is completed, the lowered part of the conveyor 1 returns to its original position, and the substrate 2 is conveyed to the screen printing machine 3, where the screen printing machine 3 2, solder cream is printed and applied.
次にコンベア１によって基板２を搬送し第２計量ステー
ション６へきたとき、コンベア１が停止すると同時にコ
ンベア１の一部分が降下し、コンヘア１上にあった基板
２は電子天秤８上にのせられ、電子天秤８は基板２のソ
ルダークリーム塗布後の重量を計測し、そのデータは制
御装置９によって記憶され、更に第１計量ステーション
５と第２計量ステーション６とで計測された基板２の重
量差を制御装置９によって計算され、計算された値がソ
ルダークリームの塗布量となる。この塗布量は、あらか
じめ制御装置５に塗布量の範囲が設定してあり、設定値
の範囲内ならば良品、範囲外ならば不良品となり、不良
品発生の場合には、コンベア１は自動的に停、止する。Next, when the substrate 2 is transported by the conveyor 1 and reaches the second weighing station 6, at the same time as the conveyor 1 stops, a part of the conveyor 1 descends, and the substrate 2 that was on the conveyor 1 is placed on the electronic balance 8. The electronic balance 8 measures the weight of the board 2 after applying the solder cream, and the data is stored by the control device 9. Furthermore, the electronic balance 8 measures the weight difference of the board 2 measured at the first weighing station 5 and the second weighing station 6. It is calculated by the control device 9, and the calculated value becomes the amount of solder cream to be applied. The coating amount range is set in advance in the control device 5, and if it is within the set value, it will be a good product, and if it is outside the range, it will be a defective product. If a defective product occurs, the conveyor 1 will automatically stop, stop.
第２計量ステーションでの計測が終了するとコンベア１
の降下していた一部分は元の位置へ復帰し、ソルダーク
リーム塗布後の基板２はコンベア１によって後工程へ搬
送される。When the measurement at the second weighing station is completed, the conveyor 1
The lowered part returns to its original position, and the substrate 2 coated with solder cream is conveyed to a subsequent process by the conveyor 1.
以上一連の動作によって基板２に対するソルダークリー
ムの塗布量は自動計測管理ができる。Through the above series of operations, the amount of solder cream applied to the substrate 2 can be automatically measured and managed.
なお、スクリーン印刷機３へのデータフィードバックに
より、印圧（印刷圧力）をステッピングモータによりフ
ィードバックし、自動調節することも可能である。In addition, by feeding back data to the screen printing machine 3, it is also possible to feed back the printing pressure (printing pressure) by a stepping motor and automatically adjust it.
以上の如く、電子天秤によってソルダークリーム塗布前
、塗布後の基板重量を計測し、その前後の差でソルダー
クリームの重量を計測し、制御装置によって良否の判定
を行うようにしたことから、ソルダークリームの塗布量
は目視判断にゆだねることなく、計量値でもって正確に
判定することができ、品質保証はもとより、スクリーン
印刷機の印刷条件調整による塗布量の増減調整が的確に
行うことができる。As described above, the electronic balance measures the weight of the board before and after applying the solder cream, and the difference between before and after is used to measure the weight of the solder cream, and the control device determines the quality of the solder cream. The amount of coating can be determined accurately using measured values without relying on visual judgment, and it is possible not only to ensure quality but also to accurately increase or decrease the amount of coating by adjusting the printing conditions of the screen printing machine.
第１図は本発明実施例によるソルダークリーム計測方法
の概要を示す説明図、第２図は第１図の平面図、第３図
〜第４図はコンベアが停止および降下したときの状態を
示す説明図である。
１・・・コンベア、２・・・基板。
３・・・スクリーン印刷機。
５・・・第１１ステーション。
６・・・第２計量ステーション。
７．８・・・電子天秤、９・・・制御装置。Fig. 1 is an explanatory diagram showing an overview of the solder cream measuring method according to an embodiment of the present invention, Fig. 2 is a plan view of Fig. 1, and Figs. 3 to 4 show the state when the conveyor stops and descends. It is an explanatory diagram. 1... Conveyor, 2... Board. 3...Screen printing machine. 5...11th station. 6...Second weighing station. 7.8...Electronic balance, 9...Control device.
Claims (1)
刷機にてソルダークリームが塗布されるスクリーン印刷
において、前記スクリーン印刷機の上流側と下流側とに
前記コンベアの下面に近接して電子天秤を載置した第１
、第２の計量ステーションと、該第１、第２の計量ステ
ーションに載置された前記電子天秤に接続される制御装
置とを設け、前記コンベアによつて搬送されてきた基板
が前記第１、第２計量ステーションへきたとき、前記コ
ンベアが停止および降下して前記電子天秤上にのせられ
、該電子天秤によつてソルダークリーム塗布前、塗布後
の夫々の重量が計測されると共に、前記制御装置により
、ソルダークリームの塗布量が自動計算され、あらかじ
め設定された数値と比較判定される、ソルダークリーム
のスクリーン印刷時の塗布量自動計測方法。In screen printing, in which solder cream is applied to a board conveyed by a conveyor using a screen printing machine, electronic scales are placed close to the bottom surface of the conveyor on the upstream and downstream sides of the screen printing machine. The first
, a second weighing station, and a control device connected to the electronic balance placed on the first and second weighing stations, and the substrate conveyed by the conveyor is When it comes to the second weighing station, the conveyor stops and descends to be placed on the electronic balance, and the electronic balance measures the weight before and after applying the solder cream, and the control device A method for automatically measuring the amount of solder cream applied during screen printing, in which the amount of solder cream applied is automatically calculated and compared with a preset value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1663888A JPH01191020A (en) | 1988-01-27 | 1988-01-27 | Automatic measuring method for coating amount of solder cream at the time of printing screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1663888A JPH01191020A (en) | 1988-01-27 | 1988-01-27 | Automatic measuring method for coating amount of solder cream at the time of printing screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01191020A true JPH01191020A (en) | 1989-08-01 |
Family
ID=11921902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1663888A Pending JPH01191020A (en) | 1988-01-27 | 1988-01-27 | Automatic measuring method for coating amount of solder cream at the time of printing screen |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01191020A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014217420A (en) * | 2013-05-01 | 2014-11-20 | 前嶋 洋左右 | Folding device with function for inspecting texture of cloth product |
-
1988
- 1988-01-27 JP JP1663888A patent/JPH01191020A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014217420A (en) * | 2013-05-01 | 2014-11-20 | 前嶋 洋左右 | Folding device with function for inspecting texture of cloth product |
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