JPH05190437A - Semiconductor manufacturing apparatus - Google Patents
Semiconductor manufacturing apparatusInfo
- Publication number
- JPH05190437A JPH05190437A JP439492A JP439492A JPH05190437A JP H05190437 A JPH05190437 A JP H05190437A JP 439492 A JP439492 A JP 439492A JP 439492 A JP439492 A JP 439492A JP H05190437 A JPH05190437 A JP H05190437A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- amount
- manufacturing apparatus
- value
- semiconductor manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は半導体基板(ウェーハ)
を製造するフォトレジスト塗布工程に使用される半導体
製造装置に関する。FIELD OF THE INVENTION The present invention relates to a semiconductor substrate (wafer).
The present invention relates to a semiconductor manufacturing apparatus used in a photoresist coating process for manufacturing a semiconductor.
【0002】[0002]
【従来の技術】従来のレジスト滴下量の調整は、図2の
構成図に示すように、人間がメスシリンダー11を用い
てレジスト吐出ノズル1から滴下されたレジストの量を
測定し、その値が規格より外れた場合にレジスト吐出ポ
ンプ4の調整を行っている。また、この調整を行った
後、再度滴下量の測定を行い、その値が規格の内外であ
るかを判断し、もし規格に入っていなければ前記の調整
をやり直すという繰り返し作業を実施している。2. Description of the Related Art In the conventional adjustment of the resist dropping amount, a person measures the amount of the resist dropped from the resist discharge nozzle 1 using a measuring cylinder 11 as shown in the configuration diagram of FIG. When it is out of the standard, the resist discharge pump 4 is adjusted. In addition, after making this adjustment, the drop amount is measured again, it is judged whether the value is inside or outside the standard, and if it is not within the standard, the above adjustment is repeated and the repeated work is carried out. .
【0003】[0003]
【発明が解決しようとする課題】この従来のレジスト滴
下量測定及び調整作業は、人間によって行なわれる為、
測定誤差が生じ製品への悪影響を及ぼすことと、レジス
ト吐出機構の調整の際、調整時間にばらつきが生じ、ま
た長時間を費すという問題点があった。Since the conventional resist dropping amount measurement and adjustment work is performed by a human,
There are problems that a measurement error may occur, which may adversely affect the product, that the adjustment time may vary during adjustment of the resist ejection mechanism, and that it may take a long time.
【0004】[0004]
【課題を解決するための手段】本発明の半導体製造装置
における滴下自動調整機構は、滴下されたレジストの量
を測定し、その重量を電圧に変換するアナログ出力付計
量器と、これより出力された信号と設定値(量)を比較
判断する比較判定回路と、このデータを処理し調整量等
を設定する演算回路、及びその信号によりレジストの吐
出量を調整する為のモーター駆動部を備えている。An automatic drop adjusting mechanism in a semiconductor manufacturing apparatus according to the present invention measures an amount of dropped resist and converts the weight of the resist into a voltage, and an analog output measuring device which outputs the weight. It is equipped with a comparison and judgment circuit that compares and judges the signal and the set value (amount), an arithmetic circuit that processes this data and sets the adjustment amount, etc., and a motor drive unit that adjusts the resist discharge amount by the signal. There is.
【0005】[0005]
【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の実施例を示すブロック図である。本
実施例はレジスト吐出機構と、回路構成されたレジスト
滴下量自動調整機構とを有する。The present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of the present invention. This embodiment has a resist discharge mechanism and a circuit-configured automatic resist dropping amount adjusting mechanism.
【0006】あらかじめ入力されたプログラムシーケン
スにより、任意の吐出回数分に担当する量のレジストが
アナログ出力付計量器6に滴下され、1回あたりの滴下
量が比較判定回路7に入力される。この計量器6からの
信号が設定値(量)とどの程度違うかを比較判定回路7
において比較し、演算回路8で処理される。滴下量が規
格内ならばレジスト吐出ノズル1をウェーハチャック2
上に移動させて製品処理に入るが、規格より外れた場合
には滴下量の多少を比較判定回路7で判定し、演算回路
8で補正量を計算し、吐出量調整モーター5に信号を送
り、レジスト吐出ポンプ4を動作させ、規格内になるま
でこのシーケンスをくり返す。According to a program sequence input in advance, the amount of the resist that is in charge of any number of ejections is dropped on the analog output measuring device 6, and the amount of each dropping is input to the comparison / determination circuit 7. The comparison / determination circuit 7 determines how much the signal from the measuring instrument 6 differs from the set value (quantity).
And the processing is performed by the arithmetic circuit 8. If the dropping amount is within the standard, the resist discharge nozzle 1 is connected to the wafer chuck 2
Although it is moved to the upper part to start product processing, if it is out of the standard, the comparison judgment circuit 7 judges how much the drop amount is, the calculation circuit 8 calculates the correction amount, and sends a signal to the discharge amount adjustment motor 5. , The resist discharge pump 4 is operated, and this sequence is repeated until it is within the standard.
【0007】[0007]
【発明の効果】以上説明したように本発明は、滴下量を
自動測定し、測定データをフィードバックさせ自動調整
する機構を持つので、人による滴下量測定誤差及び調整
量のばらつきを無くことができ、ウェーハへの塗布不良
を防止し、又、作業の効率化という効果を有する。As described above, since the present invention has a mechanism for automatically measuring the dropping amount and automatically feeding back the measurement data, it is possible to eliminate the error of the dropping amount by the person and the variation of the adjusting amount. In addition, it has the effects of preventing defective coating on the wafer and improving work efficiency.
【図1】本発明の一実施例のブロック図である。FIG. 1 is a block diagram of an embodiment of the present invention.
【図2】従来の製造装置のレジスト吐出機構を示す構成
図である。FIG. 2 is a configuration diagram showing a resist discharge mechanism of a conventional manufacturing apparatus.
1 レジスト吐出ノズル 2 ウェーハチャック 3 サックバック 4 レジスト吐出ポンプ 5 吐出量調整モーター 6 アナログ出力付計量器 7 比較判定回路 8 演算回路 9 D/A変換器 10 ドライバー 11 メスシリンダー 1 Resist Discharge Nozzle 2 Wafer Chuck 3 Suck Back 4 Resist Discharge Pump 5 Discharge Amount Adjusting Motor 6 Meter with Analog Output 7 Comparison Judgment Circuit 8 Arithmetic Circuit 9 D / A Converter 10 Driver 11 Measuring Cylinder
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 // B05C 5/00 Z 9045−4D ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Office reference number FI technical display location // B05C 5/00 Z 9045-4D
Claims (1)
半導体製造装置において、ノズルから滴下されるレジス
ト量を自動計測する計量器と、その計測値をフィードバ
ックし規格値と比較する比較判定回路と、規格値からず
れた場合の補正量を設定する演算回路と、その信号によ
りレジスト吐出機構を自動制御し補正を行う滴下量自動
調整機構とを備えることを特徴とする半導体製造装置。1. In a semiconductor manufacturing apparatus for coating photoresist on a wafer, a measuring instrument for automatically measuring the amount of resist dropped from a nozzle, a comparison judgment circuit for feeding back the measured value and comparing it with a standard value, and a standard. A semiconductor manufacturing apparatus comprising: an arithmetic circuit that sets a correction amount when the value deviates from the value; and a dropping amount automatic adjustment mechanism that automatically controls and corrects the resist ejection mechanism based on the signal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP439492A JPH05190437A (en) | 1992-01-14 | 1992-01-14 | Semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP439492A JPH05190437A (en) | 1992-01-14 | 1992-01-14 | Semiconductor manufacturing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05190437A true JPH05190437A (en) | 1993-07-30 |
Family
ID=11583138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP439492A Pending JPH05190437A (en) | 1992-01-14 | 1992-01-14 | Semiconductor manufacturing apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05190437A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002542920A (en) * | 1999-04-23 | 2002-12-17 | ノードソン コーポレーション | Viscous material distribution system and method including feedback control |
JP2004344883A (en) * | 2003-05-23 | 2004-12-09 | Nordson Corp | Noncontact jetting system for viscous material |
KR100631918B1 (en) * | 2000-10-27 | 2006-10-04 | 삼성전자주식회사 | Wafer photo resist uncoating sencing unit of semiconductor manufacture device |
KR100689703B1 (en) * | 2001-04-19 | 2007-03-08 | 삼성전자주식회사 | Wafer photo resist dispense sencing unit of semiconductor manufacture device |
KR100731040B1 (en) * | 2002-06-12 | 2007-06-22 | 엘지.필립스 엘시디 주식회사 | Manufacturing method of liquid crystal display device |
US7621310B2 (en) | 2000-11-30 | 2009-11-24 | Fujitsu Limited | Apparatus for manufacturing bonded substrate |
JP2009542430A (en) * | 2006-06-28 | 2009-12-03 | ノードソン コーポレイション | System and method for applying a liquid coating material to a substrate |
-
1992
- 1992-01-14 JP JP439492A patent/JPH05190437A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002542920A (en) * | 1999-04-23 | 2002-12-17 | ノードソン コーポレーション | Viscous material distribution system and method including feedback control |
KR100631918B1 (en) * | 2000-10-27 | 2006-10-04 | 삼성전자주식회사 | Wafer photo resist uncoating sencing unit of semiconductor manufacture device |
US7621310B2 (en) | 2000-11-30 | 2009-11-24 | Fujitsu Limited | Apparatus for manufacturing bonded substrate |
US7681522B2 (en) | 2000-11-30 | 2010-03-23 | Fujitsu Limited | Apparatus for manufacturing bonded substrate |
US7703494B2 (en) | 2000-11-30 | 2010-04-27 | Fujitsu Limited | Apparatus for manufacturing bonded substrate |
US7819165B2 (en) | 2000-11-30 | 2010-10-26 | Fujitsu Limited | Apparatus for manufacturing bonded substrate |
US8128768B2 (en) | 2000-11-30 | 2012-03-06 | Fujitsu Limited | Apparatus for manufacturing bonded substrate |
KR100689703B1 (en) * | 2001-04-19 | 2007-03-08 | 삼성전자주식회사 | Wafer photo resist dispense sencing unit of semiconductor manufacture device |
KR100731040B1 (en) * | 2002-06-12 | 2007-06-22 | 엘지.필립스 엘시디 주식회사 | Manufacturing method of liquid crystal display device |
JP2004344883A (en) * | 2003-05-23 | 2004-12-09 | Nordson Corp | Noncontact jetting system for viscous material |
JP2009542430A (en) * | 2006-06-28 | 2009-12-03 | ノードソン コーポレイション | System and method for applying a liquid coating material to a substrate |
US8545929B2 (en) | 2006-06-28 | 2013-10-01 | Nordson Corporation | Method for applying a liquid coating material to a substrate |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19981201 |