JP2638950B2 - Application method - Google Patents
Application methodInfo
- Publication number
- JP2638950B2 JP2638950B2 JP16944388A JP16944388A JP2638950B2 JP 2638950 B2 JP2638950 B2 JP 2638950B2 JP 16944388 A JP16944388 A JP 16944388A JP 16944388 A JP16944388 A JP 16944388A JP 2638950 B2 JP2638950 B2 JP 2638950B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- application
- test
- actual
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は液体及び粘性流体を塗布する塗布方法に関す
るものである。Description: TECHNICAL FIELD The present invention relates to an application method for applying a liquid and a viscous fluid.
従来の技術 近年、社会のエレクトロニクス化が進み、各種機器・
製品の微小化，高密度化，高信頼性化が求められており
塗布装置に対してもより高信頼性化が要求されている。2. Description of the Related Art In recent years, society has become more electronic and various devices and
Product miniaturization, high density, and high reliability are required, and higher reliability is also required for coating devices.
以下図面を参照しながら、上述した従来の塗布方法の
一例について説明する。第２図は塗布装置の斜視図、第
３図は従来の塗布方法の流れ図を示すものである。第２
図において、５はヘッド部、６は塗布ノズル、7bは面積
測定器、８はプリント基板、９はＸ−Ｙテーブル、10は
本体である。第３図において、１はテスト塗布工程、11
は面積測定工程、12は圧力変更工程、４は実塗布工程で
ある。以上の様に構成された塗布方法について以下その
動作を説明する。Ｘ−Ｙテーブル９にはあらかじめプリ
ント基板８が固定されており、塗布ノズル６及び面積測
定器7bの下へ位置決めされる。ヘッド部５には塗布ノズ
ル６及び面積測定器7bが取り付けられており、プリント
基板８上へ空圧により塗布を行なったり、プリント基板
上に塗布された塗布剤の面積測定を行う。ここで塗布ノ
ズル６は塗布剤の効果によりつまったり、液ダレ等によ
り塗布量が不安定になる事がある為その対策としてプリ
ント基板毎にテスト塗布工程１において、プリント基板
８が位置決めされ、塗布ノズル６がプリント基板８上の
空きスペースに塗布剤のテスト塗布を行なう。しかしな
がら、１回のテスト塗布では塗布ノズル６のつまりの解
消が不十分な事もあり、次の面積測定工程11及び圧力変
更工程12において塗布圧力の自動変更による塗布量の一
定化を図っている。すなわち面積測定工程11において、
プリント基板８のテスト塗布された位置が面積測定器7b
の下へ位置決めされ、面積測定器7bにより塗布剤の面積
が測定され、圧力変更工程12において、塗布剤の面積の
大小に応じて塗布圧力を自動的に加減して塗布ノズル６
のつまりを補正し一定量の塗布が行なえるようにし、実
塗布工程４において実際の生産に必要な塗布を順次行な
う。Hereinafter, an example of the above-described conventional coating method will be described with reference to the drawings. FIG. 2 is a perspective view of a coating apparatus, and FIG. 3 is a flowchart of a conventional coating method. Second
In the figure, 5 is a head, 6 is a coating nozzle, 7b is an area measuring device, 8 is a printed circuit board, 9 is an XY table, and 10 is a main body. In FIG. 3, 1 is a test application step, 11
Denotes an area measuring step, 12 denotes a pressure changing step, and 4 denotes an actual application step. The operation of the coating method configured as described above will be described below. A printed board 8 is fixed to the XY table 9 in advance, and is positioned below the application nozzle 6 and the area measuring device 7b. An application nozzle 6 and an area measuring device 7b are attached to the head portion 5, and perform application on the printed circuit board 8 by pneumatic pressure and measure the area of the application agent applied on the printed circuit board. Here, the coating nozzle 6 may be clogged by the effect of the coating agent, or the amount of coating may become unstable due to liquid dripping or the like. As a countermeasure, the printed substrate 8 is positioned in the test coating step 1 for each printed substrate. The nozzle 6 performs a test application of the coating material on an empty space on the printed circuit board 8. However, in one test application, the clogging of the application nozzle 6 may not be sufficiently eliminated. In the next area measurement step 11 and the pressure change step 12, the application amount is stabilized by automatically changing the application pressure. . That is, in the area measurement step 11,
The position where the test coating of the printed circuit board 8 is applied is the area measuring instrument 7b.
The area of the coating agent is measured by the area measuring device 7b, and in the pressure changing step 12, the application pressure is automatically adjusted according to the size of the area of the coating agent, and the application nozzle 6
The clogging is corrected so that a predetermined amount of coating can be performed, and in the actual coating step 4, coating necessary for actual production is sequentially performed.
発明が解決しようとする課題 しかしながら上記の様な従来構成では、テスト塗布に
よる塗布ノズルのつまりの解消が不十分で塗布圧力が変
更された場合、実塗布の途中で塗布ノズルのつまりが解
消されると塗布量が多くなる、あるは液ダレ量が多かっ
た場合１回のテスト塗布では液ダレの除去が不十分で実
塗布の初めの数点の塗布量が多いなど塗布量が不安定な
場合があるという問題点を有していた。However, in the conventional configuration as described above, when the application pressure is changed due to insufficient elimination of the clogging of the application nozzle by the test application, the clogging of the application nozzle is eliminated during the actual application. When the amount of liquid dripping is large, or when the amount of liquid dripping is large, the amount of liquid dripping is insufficient in one test coating, and the amount of liquid dripping is unstable at the beginning of actual application There was a problem that there is.
本発明は上記問題点に鑑み、塗布装置の塗布量を安定
化し、塗布品質の向上を可能とするものである。The present invention has been made in view of the above problems, and has an object to stabilize an application amount of an application device and improve application quality.
課題を解決するための手段 上記問題点を解決する為に本発明の塗布方法は、テス
ト塗布工程と、テスト塗布された塗布剤の盛り高さを測
定する工程と、測定値と基準値を比較してテスト塗布を
くり返す判断工程と、実塗布工程を有するものである。
また塗布剤の面積を測定する工程を設けたり、あるい
は、上記テスト塗布に替って実塗布を行なうものであ
る。Means for Solving the Problems In order to solve the above problems, the coating method of the present invention comprises a test application step, a step of measuring the height of the test applied coating agent, and comparing the measured value with a reference value. Then, a test step of repeating test application and an actual application step are provided.
Further, a step of measuring the area of the coating agent is provided, or actual coating is performed instead of the test coating.
作用 本発明は上記した構成により次の様になる。すなわち
塗布ノズルのつまり・液ダレを解消する為テスト塗布を
行ない、高さ測定器により塗布剤の盛り高さを測定す
る。この測定値をあらかじめ設定された基準値と比較
し、不適当と判断した場合、塗布ノズルのつまり・液ダ
レが十分に解消されていないとしてテスト塗布から再度
くり返す。また比較の際適当と判断した場合塗布ノズル
のつまり・液ダレは解消されたとして実塗布を行なう。
この様に塗布量が安定するまでテスト塗布をくり返す事
で実塗布時の塗布量を安定化する事が可能となる。Operation The present invention is as follows by the above configuration. That is, test coating is performed to eliminate clogging and liquid dripping of the coating nozzle, and the height of the coating agent is measured by a height measuring device. This measured value is compared with a preset reference value, and when it is determined that the application nozzle is inappropriate, the test application is repeated again assuming that the coating nozzle is not sufficiently removed. If it is determined that the application is appropriate during the comparison, the actual application is performed on the assumption that the clogging of the application nozzle and the liquid dripping have been eliminated.
By repeating the test coating until the coating amount becomes stable in this manner, the coating amount at the time of actual application can be stabilized.
また塗布剤の面積を測定する事で、重心を求めあるい
は高さと面積から体積を求める事により基準値との比較
をより正確に行ない実塗布時の塗布量をより安定化する
事が可能となる。さらに液ダレの可能性が無い場合に
は、上記テスト塗布に替って実塗布を行ないその塗布量
を確認し、塗布量が最適となるまで同一場所への実塗布
をくり返す事でテスト塗布を不要とし、塗布剤のムダを
無くし、生産のロスタイムも削減できる。In addition, by measuring the area of the coating agent, the center of gravity is obtained, or the volume is obtained from the height and the area, so that the comparison with the reference value can be performed more accurately, and the applied amount at the time of actual application can be further stabilized. . If there is no possibility of liquid dripping, perform actual application in place of the above test application, check the applied amount, and repeat the actual application in the same place until the applied amount is optimal. Is unnecessary, the waste of the coating agent is eliminated, and the production loss time can be reduced.
実 施 例 以下、本発明の一実施例の塗布方法について図面を参
照しながら説明する。第１図は本発明の実施例における
動作の流れ図を示すものであり、第２図はこの動作を行
なう塗布装置の斜視図を示すものである。EXAMPLES Hereinafter, a coating method according to an example of the present invention will be described with reference to the drawings. FIG. 1 is a flow chart of the operation in the embodiment of the present invention, and FIG. 2 is a perspective view of a coating apparatus for performing this operation.
第１図において、１はテスト塗布工程、２は高さ測定
工程、３は判断工程、４は実塗布工程である。第２図に
おいて、５はヘッド部、６は塗布ノズル、7aは高さ測定
器、８はプリント基板、９はＸ−Ｙテーブル、10は本体
である。以上の様な構成での塗布方法について、以下第
１図及び第２図を用いてその動作を説明する。In FIG. 1, 1 is a test application step, 2 is a height measurement step, 3 is a judgment step, and 4 is an actual application step. In FIG. 2, 5 is a head, 6 is a coating nozzle, 7a is a height measuring device, 8 is a printed circuit board, 9 is an XY table, and 10 is a main body. The operation of the coating method having the above configuration will be described below with reference to FIGS. 1 and 2.
Ｘ−Ｙテーブル９にはあらかじめプリント基板８が固
定されており、塗布ノズル６及び高さ測定器7aの下へ位
置決めされる。テスト塗布工程１において、プリント基
板８が位置決めされ、塗布ノズル６がプリント基板８上
へ空圧により塗布剤のテスト塗布を行なう。次いで高さ
測定工程２にて、プリント基板８のテスト塗布位置が高
さ測定器7aの下になるよう位置決めされ、高さ測定器7a
により塗布剤の盛り高を測定する。判断工程３にて盛り
高の測定値があらかじめ設定された基準値に対して許容
範囲内か範囲外かの判断を行ない範囲外であれば再びテ
スト塗布工程１以降の工程をくり返し、範囲内ならば、
実塗布工程４おいて実際の生産に必要な塗布を順次行な
う。これによりプリント基板毎にテスト塗布をくり返
し、塗布量が適当になった事を確認した後、安定した実
塗布を行なう事が可能となる。The printed board 8 is fixed to the XY table 9 in advance, and is positioned below the application nozzle 6 and the height measuring device 7a. In the test coating step 1, the printed circuit board 8 is positioned, and the coating nozzle 6 performs test coating of the coating material on the printed circuit board 8 by air pressure. Next, in the height measuring step 2, the test application position of the printed circuit board 8 is positioned so as to be below the height measuring device 7a.
To measure the height of the coating agent. In the judgment step 3, it is judged whether the measured value of the peak height is within the allowable range or outside the range with respect to the preset reference value. If the measured value is outside the range, the steps after the test application step 1 are repeated again. If
In the actual application step 4, application necessary for actual production is sequentially performed. As a result, the test application is repeated for each printed circuit board, and after confirming that the amount of application is appropriate, it is possible to perform stable actual application.
発明の効果 以上の様に本発明によれば、塗布量を安定させる為の
テスト塗布工程と、テスト塗布された塗布剤の盛り高さ
を測定する工程と、測定値を基準値と比較して塗布量が
適当になるまでテスト塗布をくり返す判断工程と、実際
の生産を行なう実塗布工程を設ける事により、塗布量の
安定化が容易に図れ高品質な生産が可能となる。Effects of the Invention As described above, according to the present invention, a test application step for stabilizing the coating amount, a step of measuring the height of the test-applied coating agent, and comparing the measured value with a reference value By providing a determination step of repeating test coating until the coating amount becomes appropriate and an actual coating step of performing actual production, the coating amount can be easily stabilized and high-quality production can be achieved.
第１図は本発明の一実施例における塗布方法のフローチ
ャート図、第２図は塗布装置の斜視図、第３図は従来の
塗布方法のフローチャート図である。 １……テスト塗布工程、２……高さ測定工程、３……判
断工程、４……実塗布工程。FIG. 1 is a flowchart of a coating method according to an embodiment of the present invention, FIG. 2 is a perspective view of a coating apparatus, and FIG. 3 is a flowchart of a conventional coating method. 1 ... test application step, 2 ... height measurement step, 3 ... judgment step, 4 ... actual application step.
Claims (3)
布工程と、試験的に塗布された塗布剤の盛り高を測定す
る測定工程と、測定工程により測定された測定値を基準
値と比較して塗布量が最適になるまでテスト塗布工程を
くり返す判断工程と、実際に所定位置に粘性流体を塗布
する実塗布工程とからなる塗布方法。1. A test application step in which a viscous fluid is preliminarily applied in a test, a measurement step in which a height of a test application is measured, and a measurement value measured in the measurement step is compared with a reference value. A test application step until the application amount is optimized, and an actual application step of actually applying a viscous fluid to a predetermined position.
面積を測定する工程を設け、体積及び重心を求めた特許
請求の範囲第１項記載の塗布方法。2. The coating method according to claim 1, further comprising a step of measuring an area of the coating agent applied in the test application step, and determining a volume and a center of gravity.
確認を行ない、不適当なら同一場所への塗布をくり返す
事でテスト塗布工程を不要とした特許請求の範囲第１項
記載の塗布方法。3. The test coating step according to claim 1, wherein the actual coating step is performed first, the optimum amount of coating is checked, and if inappropriate, the test coating step is unnecessary by repeating coating in the same place. Application method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16944388A JP2638950B2 (en) | 1988-07-07 | 1988-07-07 | Application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16944388A JP2638950B2 (en) | 1988-07-07 | 1988-07-07 | Application method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0217977A JPH0217977A (en) | 1990-01-22 |
| JP2638950B2 true JP2638950B2 (en) | 1997-08-06 |
Family
ID=15886700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16944388A Expired - Lifetime JP2638950B2 (en) | 1988-07-07 | 1988-07-07 | Application method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2638950B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5011785A (en) * | 1990-10-30 | 1991-04-30 | The United States Of America As Represented By The Secretary Of The Navy | Insulator assisted self-aligned gate junction |
-
1988
- 1988-07-07 JP JP16944388A patent/JP2638950B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217977A (en) | 1990-01-22 |
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