JPH01189101A - Manufacture of resistor - Google Patents

Abstract

PURPOSE:To obtain a resistor having large adhering strength of an electrode section and a stable resistance value by laminating a resistor layer and an electrode layer on a substrate, covering a part except the necessary region of the electrode layer with a resist layer, plating a connecting conductor layer only on the necessary region, providing a protective film on the conductor layer, and then removing the resist layer which becomes unnecessary. CONSTITUTION:A resistor layer 3 made of Ni-Cr alloy is sputter deposited in a predetermined thickness on one face of a flat substrate 2 of alumina, and a Cu electrode layer 4 is laminated thereon by means of a similar method. Then, the layer 4 except electrode sections 7a, 7b forming region is covered with a resist layer 5 by means of a photolithography, and with the layer 5 as a mask the layers 4a, 4b of the layer 4 to become the sections 7a, 7b are covered with Cu connecting conductor layers 8a, 8b by means of a wet plating method. Thereafter, protective layers 9a, 9b made of Ni are laminated thereon by a similar method, the layer 5 is removed by isolating, and the layer 4 becoming unnecessary except the layers 4a, 4b is removed by etching.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for manufacturing a resistor, and more specifically, it relates to a method for manufacturing a resistor, and more specifically, it is manufactured by a substrate assembly process and used as a circuit element of various electronic and electrical devices. The present invention relates to a method of manufacturing a chip type resistor.

(Prior Art) An overview of the conventional manufacturing method of this type of resistor 20 is as follows.
This will be explained with reference to FIG.

In this manufacturing method, first, for example, Ni is deposited on an alumina substrate 21.
After forming the resistor layer 22 using a Cr alloy or the like, an electrode layer 23a having a predetermined size is formed on a predetermined region on the resistor layer 22.
Sputtering 23b.

A resist layer 24a is formed by a method such as vapor deposition, or after an electrode layer (Cu and/or Cu alloy, etc.) is formed over the entire resistor film, a resist layer 24a is formed in a necessary region of the electrode layer.

24b is formed and the electrode layer in unnecessary areas is removed to form an electrode pattern. Furthermore, the resistor 20 is obtained by forming a resistor pattern on the resistor @22 by photolithography or the like.

However, in the conventional method described above, the electrode layer 23a,
Since the layer 23b is formed by a method such as sputtering or vapor deposition, a big problem arises when forming each of these layers.

That is, for example, if the film thickness of the electrode layers 23a and 23b is increased to a certain extent, the adhesion strength with the resistor layer 22 deteriorates, and the manufacturing cost increases due to the long sputtering and vapor deposition times.

In addition, if the connection conductor layers 24a and 24b are too thin, their own resistance value will increase, especially in the case of the resistor 20 in which the resistor layer 22 has a low resistance value.
Trimming of resistor layer 22 and completed resistor 2
0 and the resistance value becomes large, and the resistance value of the resistor 20 as a product differs significantly.

(Problems to be Solved by the Invention) As mentioned above, in the conventional manufacturing method of resistors, due to the manufacturing method, the adhesion strength of each layer deteriorates, the manufacturing cost increases, and the resistance value becomes stable. There is a problem of not being able to obtain the product.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing a resistor that can provide a product that has good adhesion strength between each layer constituting an electrode part, can reduce manufacturing costs, and has a stable resistance value. It is something.

[Structure of the Invention] (Means for Solving the Problems) The method for manufacturing a resistor of the present invention includes a step of forming a resistor layer on a substrate, and a step of forming an electrode layer over the entire area on the resistor layer. a step of forming a resist layer on a region other than the required region of the electrode layer; a step of forming a connecting conductor layer on the required region of the electrode layer by a plating method; and a plating method on the connecting conductor layer. and a step of removing the resist layer and the electrode layer in a region corresponding to the resist layer.

(Function) According to the method for manufacturing a resistor having the above-described configuration, a resistor layer and an electrode layer are formed on a substrate, and areas other than the necessary areas of the electrode layer are covered with a resist layer, so that only the necessary areas are covered. After roughly forming a protective layer for the conductor layer by plating on the connecting conductor layer, the resist layer and the electrode layer in the area corresponding to this resist layer are removed to form a resistor. Therefore, a resistor having an electrode portion having a desired thickness, high adhesion strength, and low resistance value can be manufactured at low cost.

(Example) Examples of the present invention will be described in detail below.

FIG. 1 shows a chip-type resistor 1 obtained by the method of this embodiment.

This resistor 1 includes a substrate 2 made of alumina, a resistor layer 3 made of a NiCr alloy formed on one surface of the substrate 2, and a necessary area on this resistor layer 3, that is, an electrode portion is formed. Two electrode layers 4a and 4b formed in the area and a connecting conductor layer 5a made of Cu formed on the picture electrode layers 4a and 4b, respectively.

5b, and protective layers 6a and 6b formed on both connection conductor layers 5a and 5b, respectively, the one electrode layer 4a,
One electrode portion 7 is formed by the connecting conductor layer 5a and the protective layer 6a.
a, the other electrode layer 4b, the connecting conductor layer 5b, and the protective layer 6b constitute the other electrode portion 7b, respectively.

Next, the manufacturing process of the resistor 1 having the above structure will be explained with reference to FIGS. 2 to 6.

First, prepare a flat substrate 2 made of alumina, and
A resistor layer 3 made of NiCr alloy is formed on the entire surface of the resistor layer 3 to a predetermined thickness (approximately 250 Å) by sputtering. Roughly, as shown in FIG. An electrode layer 4 made of Cu was formed to a predetermined thickness (approximately 2000 Å>) by sputtering.

Next, as shown in FIG. 3, a resist layer 5 having a predetermined thickness (approximately 2.5 μm) is formed on the upper surface of the electrode layer 4 except for the regions where the electrode portions 7a and 7b are to be formed by a photolithography method. do. Roughly, the electrode parts 7a, 7 on the electrode layer 4
As shown in FIG. 4, connection conductor layers aa and ab made of Cu were formed to a predetermined thickness (approximately 5 μm) in the area where b was to be formed by wet plating, respectively.

Since the connection conductor layers Ba and Bb are formed by wet plating, their thickness can be set arbitrarily, for example, 'L! If the resistor 1 to be manufactured has a low resistance value, its thickness is made thicker than usual to lower the resistance value of the connecting conductor layers 8a, 3b themselves.

Furthermore, since the connection conductor layers 8a and 8b are formed by the wet plating method as described above, the adhesion strength to the electrode layer 4 is high, and the manufacturing cost is lower than when they are formed by sputtering or the like. significantly reduced.

Next, a fifth
As shown in the figure, a protective layer 9a of the conductor layer made of a material such as Ni is formed by wet plating again.

9b is formed to a predetermined thickness (in this embodiment, Ni is approximately 1 μm thick). The protective layers 9a and 9b are made of a metal such as Ni, Ag, Au, or Sn, which has solderability and is not affected by the etchant used in the etching process described later.

Since the protective layers 9a and 9b are also formed by wet plating, the adhesion strength with the connecting conductor layers 8a and 8b is high.
Moreover, it has a miraculous effect on reducing manufacturing costs.

Next, an electrode pad can be formed by performing a process for removing unnecessary portions, which includes peeling off the resist layer 5 and etching the electrode layer 4 in areas other than the electrode portions 7a and 7b, as shown in FIG. . After this, a resistor pattern is formed and trimmed by photolithography, and the resistor 1 shown in FIG. 1 can be obtained.

According to this method of manufacturing the resistor 1, the electrode portion 7a,
Since the thickness of 7b can be easily increased, the resistance value of these elements themselves becomes small, and even in the case of the resistor 1 with a low resistance value, it is stable and is not affected by trimming etc. of the resistor layer 3. It is possible to easily manufacture products with a certain resistance value. Along with this, it is also possible to widen the lower limit range of the resistance value of the resistor 1.

Further, a connecting conductor layer 3a constituting the electrode parts 7a and 7b,
Since the protective layers 8b and the protective layers ga and gb are formed by a wet plating method, their adhesion strength is increased and manufacturing costs can also be reduced.

Roughly speaking, since the connection conductor layers 8a and 8b need only be made thicker in the necessary regions, there is no loss of material, which also contributes to a reduction in manufacturing costs.

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the invention. For example, connection conductor layers 8a, 8b and protective layer 9a.

If the material of 9b is appropriately selected, it is possible to satisfy both functions.

[Effects of the Invention] According to the invention described in detail above, it is possible to provide a method for manufacturing a resistor that can manufacture a product having a high adhesion strength of the electrode portion and a stable resistance value at low cost.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a resistor manufactured by an embodiment method of the present invention, FIGS. 2 to 6 are sectional views each showing the manufacturing process of the embodiment method, and FIG. 7 is a sectional view showing a resistor manufactured by a conventional method. FIG. DESCRIPTION OF SYMBOLS 1...Resistor, 2...Substrate, 3...Resistor layer, 4
a, 4b...electrode layer, 5a, 5b...connecting conductor layer, 6a, 5b...protective layer.

Claims (1)

[Claims] A step of forming a resistor layer on a substrate, a step of forming an electrode layer over the entire area on this resistor layer, a step of forming a resist layer in an area other than the required area of this electrode layer, and a step of forming the resist layer on the electrode layer. a step of forming a connecting conductor layer by plating in the required area of the connecting conductor layer, a step of forming a protective layer made of a conductor by plating on the connecting conductor layer, and a step of forming the resist layer and the area corresponding to the resist layer. A method for manufacturing a resistor, comprising the step of removing an electrode layer.