JPH01183894A - Electronic part supplying method - Google Patents

Abstract

PURPOSE:To make it possible to supply an electronic part to a specified position under the accurate positioning state, by holding the electronic part with four tabs at the same time at the four sides, correcting the positioning state, and supplying the electronic part to the specified position. CONSTITUTION:An electronic part 41 is held with four tabs 18-21 at the same time at the four sides. At this time, the position, where the electronic part 41 is held, is a rigid package 42 or the very firm shoulder parts of lead lines. Therefore, the lead lines 43-46 are not deformed even if the electronic part is strongly held with the tabs 18-21. Since the electronic part 41 is held with the tabs 18-21 at the same time at the four sides, the position deviation of the electronic part 41 is suppressed. After the position of the electronic part 41 is determined, the positioning state of the electronic part is corrected with a visual recognizing device 40. Then, the electronic part 41 is supplied to the specified position. In this way, the electronic part 41 is supplied to the specified position in the accurate positioning state.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention is directed to an electronic component such as a flat package IC in which lead rows are taken out from each of the four sides of a package, for example, on a printed circuit board. The present invention relates to a method for supplying electronic components to a specified position in a positioned state.

(Prior Art) FIGS. 5 and 6 show an example of a method for supplying this type of electronic component. That is, the IC 6, which is an electronic component formed by lead rows 2 to 5 taken out from the four sides of the flat package 1, is placed at the tip of the vacuum suction nozzle 7. And I
Positioning claws 8 to 1 are used to position the tips of each lead row 2 to 5 of C6.
1 and then releasing the clamping state, the IC 6 can be positioned so that its center coincides with the center of the nozzle 7, or, for example, the tips of the lead rows 2 and 4 can be positioned first. The IC 6 is positioned by clamping the lead rows 3 and 5 with the claws 8 and 10 and releasing the clamping, and then clamping the tips of the lead rows 3 and 5 with the positioning claws 7 and 9 and releasing the clamping. There is. After the positioned IC 6 is sucked and held by the nozzle 7, the IC 6 in the positioned state is placed, for example, on a printed circuit board using a well-known transfer device, thereby positioning the IC 6 at a specified position on the printed circuit board. We try to supply it in the same condition.

(Problem to be Solved by the Invention) However, in the method of positioning the IC 6 by simultaneously holding each lead row 2 to 5 by the positioning claws 8 to 11, as shown in FIG.
When is rectangular, lead rows 3 and 5 corresponding to the long sides of the flat package 1 are held by the positioning claws 9 and 11, and then lead rows 2 and 4 corresponding to the short sides are held by the positioning claws. 8 and 10, and as a result, there was a risk that an excessive load would be applied to the lead rows 3 and 5 in the lateral direction, causing them to deform.

Also, lead rows 2 and 4. In the method of sequentially and individually holding lead rows 3 and 5, the IC is
6 is often misaligned, and for this reason I
When disposing C6 on the printed circuit board, there is a possibility that its position may deviate from the specified position on the printed circuit board.

The present invention has been made in view of the above-mentioned circumstances, and its purpose is to provide a method for positioning an electronic component, which is made up of lead rows taken out from each of the four sides of a package, by holding it between positioning claws. To provide a method for supplying an electronic component, which prevents lead rows from being deformed and can supply the electronic component to a specified position in an accurate positioning state.

[Structure of the Invention (Means for Solving the Problems) The present invention is a method for supplying an electronic component, which is formed by taking out lead rows from each of the four sides of a package, to a prescribed position in a positioned state. is first positioned by simultaneously holding the shoulders of the package or lead row from all sides with four positioning claws, and then,
This positioning state is corrected using a visual confirmation device placed on the back side of the electronic component, and then the electronic component is supplied to the prescribed position.

(Function) First, the electronic component is simultaneously held from all sides by the four positioning claws. At this time, the position where the electronic component is held is
Since this is an extremely strong shoulder in a rigid package or lead array, the lead array will not be deformed even if it is strongly clamped by the positioning claws. Furthermore, since the electronic component is simultaneously held from all sides by the positioning claws, misalignment of the electronic component is suppressed.

Next, after the electronic component is positioned by the positioning claw as described above, the positioning state is corrected by the visual recognition device, and then the electronic component is supplied to the specified position. Therefore, the positioning state by the positioning claw becomes more accurate, and as a result, the electronic component can be supplied to a prescribed position in an accurate positioning state.

(Embodiment) An embodiment of the present invention will be described below with reference to FIGS. 1 to 4.

First, in FIGS. 1 and 2 showing the entire parts supply device used in this embodiment, a hollow driven pulley 12 is rotatably disposed on a support plate 11, and a motor 13 A drive pulley 14 is provided which is rotated by the drive of. A belt 15 is wound between both pulleys 12 and 14, and thereby the motor 13
The driven pulley 12 is rotated by the drive of the driven pulley 12. Reference numeral 16 denotes a vacuum suction section disposed to cover the upper opening of the driven boob, which discharges the air in the vacuum generation chamber 16a formed inside by suction from a vacuum pump (not shown). Nozzle 16 communicating with vacuum generation chamber 16a
It is designed to suction and hold the electronic components placed on b. In this case, the upper surface 16c and lower surface 16d of the vacuum suction section 16 are formed from a transparent member, and these upper surfaces 16c and 16d are made of a transparent material.
The electronic components placed on the nozzle 16b can be seen from below the vacuum suction section 16 through the nozzle 6C and the lower surface lad. Reference numeral 17 denotes a base disposed on the vacuum suction section 16, on which grooves 17a to 17d are formed in the shape of a cross, as shown in FIG. Reference numerals 18 to 21 are positioning claws mounted in the grooves 1.7a to 17d, respectively, and these are capable of reciprocating movement along the grooves 17a to 17d. At this time, the height relationship between the positioning claws 18 to 21 and the tip of the nozzle 16b is such that the tip of the positioning claws 18 to 21 is The height is set to be the height of the shoulder of the IC lead row.

In FIG. 2, reference numerals 22 and 23 indicate opening/closing mechanisms having the same structure. Here, one opening/closing mechanism 22 will be explained, and a description of the other opening/closing mechanism 23 will be omitted.

That is, the opening/closing mechanism 22 is constructed by combining levers 26 and 27 in the shape of an abbreviation with pins 24 and 25 as rotation centers, respectively, so that these levers partially overlap.
The elongated hole 28 provided on the 6 side and the elongated hole 2 provided on the lever 27 side.
Due to the cooperative action of a pin 29 inserted into the lever 8, when one lever 26 rotates, the other lever 27 also rotates in the opposite direction.

In addition, long holes 3 provided on the tip sides of the levers 26 and 27
Pins 32 and 33 provided on the lower surfaces of the positioning pawls 19 and 21 are loosely fitted into the positioning pawls 19 and 21, respectively, so that the positioning pawls 19 and 21 simultaneously move in response to the rotation of the levers 26 and 27. It is designed to reciprocate within the grooves 17b and 17d. Note that a tension coil spring 34 is stretched between the levers 26 and 27, so that
A biasing force is applied to the levers 26 and 27 in a direction in which their tips approach each other.

On the other hand, 35 is a reciprocating mechanism, which includes a slide block 36 that slides on the upper surface of the base 17, and a support plate 1 that is engaged with the slide block 36.
It consists of a cylinder 37 or 7 provided on one side.

Here, the slide block 36 is connected to the opening/closing mechanism 2 by tension coil springs 38 and 38 stretched between the slide block 36 and the base 17.
The roller 3 is biased in the 2 and 23 directions (arrow A direction in FIG. 2) and is provided on the slide block 36.
9, 39 are levers 26 and 2 of each opening/closing mechanism 22 and 23;
7. At this time, in the non-driving state, the cylinder 37 is connected to the rod 37a and the slide block 3.
6 and slide block 36.
The rod 37a is allowed to slide in the direction of arrow A, and in the driving state, the rod 37a is engaged with the slide block 36, and the slide block 36 is pulled by the coil spring 3.
8.38 and slide in the opposite direction of arrow A. Further, the tension coil spring 38 has a spring constant set to be sufficiently larger than the tension coil spring 34, so that the tension coil spring 38 is
In a state where sliding in the direction is permitted, the slide block 36 is slid in the direction of arrow A by the tension coil springs 38,38. 2 shows a state in which the cylinder 37 is in a non-driving state. Therefore, in the positional relationship shown in FIG. By being pressed, each of the positioning claws 18 to 21 is maintained at a clamp release position where the positioning claws 18 to 21 are retreated away from the nozzle 16b.

Note that when the cylinder 37 is in a non-driven state, the hollow pulley 12 can be rotated by the drive of the motor 13. Here, the vacuum pump, motor 13, and cylinder 37 (not shown) described above are each driven by control of a control device (not shown).

In FIG. 1, 40 is a visual recognition device such as a CCD.
The camera is disposed below the nozzle 16b, and is configured to receive an image of the vicinity of the tip of the nozzle 16b and provide the received image signal to the control device. Further, an illumination device (not shown) is disposed above the nozzle 16b, and is turned on in synchronization with the start of image reception by the CCD camera 40.

Note that the above-mentioned control device controls a transport device (not shown), and the electronic component placed at the tip of the nozzle 16b is placed at a prescribed position on, for example, a printed circuit board by the transport device. There is.

In this case, the control device is provided with a function of correcting and controlling the conveying device based on the image reception signal given from the CCD camera 40, as will be described later.

Next, the operation of the above configuration will be explained.

First, as shown in FIG. 1, the IC 41, which is an electronic component, is placed on the nozzle 16b by a supply device (not shown). Here, the IC 41 has lead rows 43 to 46 taken out from the four sides of the flat package 42, each extending laterally.
FD (Quad Flat Packaga)
In the above-mentioned state, each lead row 43 to 4G is substantially opposed to each positioning pawl 18 to 21, respectively. When the cylinder 37 is driven under the control of the control device, the rod 37a and thus the slide block 36 slide in the eight directions opposite to the arrows in FIG. 27 is rotated so that each tip is brought close to each other. Then, the opposing positioning claws 18 and 20 simultaneously move (advance) toward the nozzle 16b, and the other opposing positioning claws 19 and 21 move (advance) toward the nozzle 16b. Accordingly, the shoulders of the lead rows 43 and 45 are held between the positioning claws 18 and 20, and at the same time the lead row 44
and 45 are held between the positioning claws 19 and 21.

Therefore, as shown in FIG.
3 to 46 from all sides, it is positioned so that its center coincides with the center of the base 17 (the center of the nozzle 16b).

Subsequently, the vacuum pump is driven under the control of the control device, and the vacuum generation chamber 16a is brought into a vacuum state, so that the IC4
1 is attracted to the nozzle 16b and its positioning state is maintained. Then, the drive of the cylinder 37 is stopped under the control of the control device, and as a result, the positioning claws 18 to 21
is retracted to the positioning release position and IC41 due to these
The pinched state is released. When the motor 13 is driven, the driven pulley 12 and, in turn, the base 17 rotate, so that the angle of the IC 41 matches the angle when it is placed on the printed circuit board.

Even though the IC 41 is positioned on the nozzle 16b by holding the positioning claws 18 to 21 as described above, it is extremely difficult to position the IC 41 without error. The errors that occur are nullified as much as possible.

That is, after the angle of the IC 41 is set by driving the motor 13, an illumination device (not shown) is turned on and the entire image of the IC 41 is received by the CCD camera 40. Then, a received image signal corresponding to the external shape of the IC 41 is output from the CCD camera 40 to the control device, and based on this, the amount of deviation between the center position of the IC 41 and the center position of the base 17 is calculated in the control device. Then, the control device drives a transport device (not shown) based on the calculated amount of deviation of the IC 41, thereby transporting the IC 41 to a specified position on the printed circuit board (not shown). That is, the transport device is
When transporting C41 to the specified position on the printed circuit board,
C41 conveys the IC41 while being corrected and controlled by the amount of deviation on the nozzle 16b.

According to the above configuration, the position where the IC 41 is held between the positioning claws 18 to 21 is from each lead row 43 to 4.
6, the lead rows 18 to 21 will not be deformed even if the lead rows 18 to 21 are strongly held by the positioning claws 18. Moreover, since the IC 41 is simultaneously held from all sides by the positioning claws 18 to 21, displacement of the IC 41 is reliably prevented.

Furthermore, in this embodiment, the position of the IC 41 positioned by the positioning claws 18 to 21 is detected by the CCD camera 40, and the information from the CCD camera 40 is detected when the transport device places the IC 41 at a prescribed position on the printed circuit board. Since the position where the IC 41 is arranged is corrected based on the above, the IC 41 is accurately arranged at the prescribed position on the printed circuit board.

In the above embodiment, the electronic component was a QFP type IC 41 in which the lead rows 43 to 46 taken out from the four sides of the flat package 42 extend laterally. P L CC (Plastic Lead) is made by bending each lead row taken out from the
ed Chip Carrier). In addition, the portions of the IC 41 that are held by the positioning claws 18 to 21 are connected to the flat package 42.
It may be made to have four sides.

In addition, the present invention is not limited to what has been described above and shown in the drawings, and can be modified in various ways without departing from the gist thereof.

[Effects of the Invention] As is clear from the above description, according to the electronic component supply method of the present invention, the shoulders of the package or lead row of the electronic component are simultaneously held from the west by four positioning claws. At the same time, this positioning state is corrected using a visual confirmation device placed on the back side of the electronic component, and then the electronic component is supplied to the specified position. Although it is used for positioning, it has excellent effects in that the lead array of the electronic component is not deformed and the electronic component can be supplied to a prescribed position in an accurate positioning state.

[Brief explanation of the drawing]

1 to 4 show one embodiment of the present invention, in which FIG. 1 is a longitudinal cross-sectional view of the whole, FIG. 2 is a plan view of the whole, FIG. 3 is a perspective view of the base, and FIG. FIG. 4 is a side view of the electronic component being held by the positioning claws. Also, the fifth
6 and 6 show a conventional example. FIG. 5 is a plan view in a state where the electronic component is held between the positioning claws, and FIG. 6 is a side view in the same state as FIG. 5. In the figure, 18 to 21 are positioning claws, 41 is an IC (electronic component), 42 is a flat package, and 43 to 46 are lead rows.

Claims (1)

[Claims] 1. In a method for supplying an electronic component in which lead rows are taken out from each of the four sides of a package to a predetermined position in a positioned state, the electronic component is supplied from four sides by four positioning claws on the shoulders of the package or lead row. A method for supplying electronic components, characterized in that positioning is performed by simultaneously holding the electronic component, and this positioning state is corrected using a visual recognition device placed on the back side of the electronic component, and then the electronic component is supplied to the specified position. .