JPH01183888A - Cooling structure of electronic equipment - Google Patents
Cooling structure of electronic equipmentInfo
- Publication number
- JPH01183888A JPH01183888A JP63009149A JP914988A JPH01183888A JP H01183888 A JPH01183888 A JP H01183888A JP 63009149 A JP63009149 A JP 63009149A JP 914988 A JP914988 A JP 914988A JP H01183888 A JPH01183888 A JP H01183888A
- Authority
- JP
- Japan
- Prior art keywords
- fins
- air
- cooling
- phase flow
- heating elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 230000005514 two-phase flow Effects 0.000 abstract description 17
- 238000011144 upstream manufacturing Methods 0.000 abstract description 13
- 238000001704 evaporation Methods 0.000 abstract description 4
- 239000003507 refrigerant Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器の冷却構造に係り、特に多数の半導体
素子を有するモジュールが複数列に配列された場合、そ
れらのモジュールの１つ１つを効率良く空冷することが
できる電子機器の冷却構造に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cooling structure for electronic equipment, and particularly when modules having a large number of semiconductor elements are arranged in multiple rows, each of the modules The present invention relates to a cooling structure for electronic equipment that can efficiently air-cool the electronic equipment.
近年、半導体素子は高密度に集積化され、１箇当りの半
導体素子の発熱量は益々増加しており、モジュールの発
熱量も当然に増加の傾向にある。In recent years, semiconductor elements have been integrated with high density, and the amount of heat generated by each semiconductor element has been increasing more and more, and naturally the amount of heat generated by modules has also tended to increase.
このため、モジュールが多数使用される電子計算機では
、これらのモジュールを空気で冷却する際に、高い冷却
性能が要求されている０例えば、個々に冷却用フィンが
設けられたモジュールが複数列に配列されている場合、
モジュールの１つ１つの発熱量をほぼ同じとし、これら
のモジュールを同一の空気流で直列的に冷却すると、空
気流に対して上流側のモジュールは、冷たい空気で冷却
されるため、十分な冷却効果が得られるが、下流側のモ
ジュールは、・上流側のモジュールを冷却して温度が上
昇した空気で冷却されるので、十分な冷却効果が得られ
ない、しかも、空気がフィンを通過するときには１通風
抵抗があるため、下流側の空気の流速は遅くなり、冷却
効果は一層低下する。For this reason, in electronic computers where a large number of modules are used, high cooling performance is required when cooling these modules with air. If it is,
If the heat output of each module is approximately the same and these modules are cooled in series with the same air flow, the module on the upstream side of the air flow will be cooled with cold air, so it will not be sufficiently cooled. However, the downstream module is cooled by the air whose temperature has increased by cooling the upstream module, so a sufficient cooling effect cannot be obtained.Moreover, when the air passes through the fins, 1. Due to the ventilation resistance, the flow velocity of the air on the downstream side is slowed down, and the cooling effect is further reduced.
このような空冷による冷却効果を良くするために、空気
の流速を大きくしたり、フィンの面積を増加させたりす
ることが考えられるが、前者の場合はファンが大型化し
てファン騒音の増大を招き・また後者の場合はフィン重
量の増大により強度信頼性の低下、コスト上昇等の問題
が生じる。In order to improve the cooling effect of air cooling, it is possible to increase the air flow velocity or increase the area of the fins, but in the former case, the fan becomes larger and the fan noise increases. - In the latter case, problems such as a decrease in strength reliability and an increase in cost arise due to the increase in fin weight.
そこで、空気よりも熱容量の大きい水を用いて冷却する
方法、すなわち水冷によってモジュールを冷却するよう
にしたものが特開昭５８−２３４６３号公報に開示され
ている。これは、第７図に示すように、基板１上の半導
体素子２および可撓性熱伝導体３を収納するモジュール
４の上面に水冷ジャケット５を設け、この水冷ジャケッ
ト５内に配設された水配管６に循環水７を流すことによ
ってモジュール４冷却するようにしたものである。Therefore, Japanese Patent Laid-Open No. 58-23463 discloses a cooling method using water, which has a larger heat capacity than air, in which the module is cooled by water cooling. As shown in FIG. 7, a water-cooling jacket 5 is provided on the top surface of a module 4 that accommodates a semiconductor element 2 on a substrate 1 and a flexible heat conductor 3, and a water-cooling jacket 5 is disposed inside the water-cooling jacket 5. The module 4 is cooled by flowing circulating water 7 through the water pipe 6.
なお、図中８は冷媒９が流れる冷媒配管、１０は圧縮器
、１１はコンデンサ（ｉｇ縮器）、１２は冷媒９によっ
て循環水７を冷却する水冷却器、１３はファンである。In the figure, 8 is a refrigerant pipe through which the refrigerant 9 flows, 10 is a compressor, 11 is a condenser (IG condenser), 12 is a water cooler that cools the circulating water 7 with the refrigerant 9, and 13 is a fan.
このようにモジュールを水冷で冷却すれば、モジュール
が複数列に配列にされても、個々のモジュールを十分に
冷却することが可能である。If the modules are cooled with water in this way, even if the modules are arranged in multiple rows, each module can be sufficiently cooled.
しかしながら、上記公報の技術では、水冷ジャケットの
他に、水冷却器、コンデンサ、圧縮器および配管等が必
要となり、冷却系の容積が大型化し、またこのために製
造コストが上昇するという問題があった。However, the technology disclosed in the above publication requires a water cooler, condenser, compressor, piping, etc. in addition to the water cooling jacket, which increases the volume of the cooling system and increases manufacturing costs. Ta.
本発明の目的は、複数列に配列されたモジュールを空冷
で効率良く冷却できる電子機器の冷却構造を提供するこ
とである。An object of the present invention is to provide a cooling structure for electronic equipment that can efficiently cool modules arranged in multiple rows by air cooling.
上記目的を達成するために、本発明の電子機器の冷却構
造は、複数列に配列された発熱体の上面に個々に冷却用
のフィンを設け、該発熱体の上面に平行に空気を流して
前記フィンを空冷することにより、前記発熱体を冷却す
る電子機器の冷却構造において、前記フィンの配置高さ
を、前記発熱体の列毎に、前記空気の流れと直交する方
向へ相 。In order to achieve the above object, the cooling structure for electronic equipment of the present invention provides individual cooling fins on the upper surfaces of heating elements arranged in multiple rows, and allows air to flow parallel to the upper surfaces of the heating elements. In the cooling structure for an electronic device that cools the heating element by air cooling the fins, the height of the fins is adjusted in a direction perpendicular to the air flow for each row of the heating elements.
違させて前記フィンの略全面に空気を当てる構成とした
ものである。The structure is such that air is applied to substantially the entire surface of the fins.
上記構成によれば１発熱体に設けられたフィンの配置高
さが列毎に異なっているから１発熱体の上面に平行に冷
却用の空気を流すと、各々のフィンの略全面に新鮮な冷
たい空気が当たることになり、どの列の発熱体も十分に
冷却される。また、ファンで加速された空気は、どのフ
ィンにも直接当たるようになるため、フィンを通過する
空気の流速は全てほぼ同等となり、全てのモジュールは
均一に冷却される。According to the above configuration, the arrangement height of the fins provided on one heating element is different for each row, so when cooling air is flowed parallel to the top surface of one heating element, fresh air is distributed over almost the entire surface of each fin. The cold air hits the heating elements in every row, and the heating elements are sufficiently cooled. Furthermore, since the air accelerated by the fan directly hits every fin, the flow velocity of the air passing through the fins is approximately the same, and all modules are cooled uniformly.
以下に本発明の一実施例を図面に従って説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明に係る冷却構造の全体構成図、第２図は
モジュールの配置を示す上面図であり。FIG. 1 is an overall configuration diagram of a cooling structure according to the present invention, and FIG. 2 is a top view showing the arrangement of modules.
また第３図および第４図は第１図における上流側モジュ
ールおよび下流側モジュールのそれぞれの断面図である
。3 and 4 are cross-sectional views of the upstream module and downstream module in FIG. 1, respectively.
第１図において、基板１上には半導体素子２および可撓
性熱伝導体３が設けられ、これらを覆うようにモジュー
ル・キャップ１４が基板１上に固定されている。モジュ
ール・キャップ１４の上面には箱型の蒸発部２０がモジ
ュール・キャップ１４に当接して設けられ、その内部に
冷媒液２ＬＬが収納されている。蒸発部２０の上方には
二相流管２２が立設され、この２相流管２２に多数の冷
却フィンが取付けられている。なお、基板１上の半導体
素子２をモジュール・キャップ１４内に収納したものを
モジュール４と呼ぶ。In FIG. 1, a semiconductor element 2 and a flexible thermal conductor 3 are provided on a substrate 1, and a module cap 14 is fixed on the substrate 1 so as to cover them. A box-shaped evaporator 20 is provided on the upper surface of the module cap 14 in contact with the module cap 14, and a refrigerant liquid 2LL is stored inside the evaporator 20. A two-phase flow pipe 22 is provided upright above the evaporator 20, and a large number of cooling fins are attached to this two-phase flow pipe 22. Note that a module in which the semiconductor element 2 on the substrate 1 is housed within the module cap 14 is referred to as a module 4.
以上の説明では、モジュール４が空気２４の流れに対し
て上流側に配置されたものについてであったが、同様の
ものが下流側にも配置されている。In the above description, the module 4 was arranged on the upstream side with respect to the flow of the air 24, but a similar module is also arranged on the downstream side.
下流側のモジュール４′の構造は上流側のモジュール４
と相違はないが、その上方に設けられた二相流管２２′
は前述の二相流管２２よりも約２倍の長さを持っている
。そして、その二相流管２２′に取付けられたフィン２
３′の配置高さは前述のフィン２３よりも略倍の高さの
所に形成されている。The structure of the downstream module 4' is similar to that of the upstream module 4.
, but the two-phase flow pipe 22' provided above it
has a length approximately twice as long as the two-phase flow tube 22 described above. Then, the fin 2 attached to the two-phase flow pipe 22'
The height of the fins 3' is approximately twice the height of the fins 23 described above.
また、モジュール４，４′は第１図の紙面垂直方向に複
数個配列されており、その様子を第２図に示す。図にお
いて、４ａ、４−ｂ、４ｃ・・・・・・は上流側のモジ
ュールを４ａ’ 、４ｂ’ 、４ｃ’・・・・・・は下
流側のモジュールを示している。なお、２４ａｔ ２４
ｂ ｖ ２４ ｃ・・・・・・は空気の流れである。Further, a plurality of modules 4, 4' are arranged in a direction perpendicular to the plane of the paper of FIG. 1, and the arrangement is shown in FIG. In the figure, 4a, 4-b, 4c... indicate modules on the upstream side, and 4a', 4b', 4c'... indicate modules on the downstream side. In addition, 24 at 24
b v 24 c... is the flow of air.
次に本実施例の作用について第３図および第４図を用い
て説明する。Next, the operation of this embodiment will be explained using FIGS. 3 and 4.
まず、上流側のモジュール４において、半導体素子２で
生じた熱は可撓性熱伝導体３を経てモジュール・キャッ
プ１４に伝わり、更に蒸発部２０に伝導する。蒸発部２
０内の冷媒２１Ｌは、この熱により熱せられて蒸発し、
冷媒の蒸気２１Ｇは二相流管２２の内部を昇り、このと
き冷媒ガス２１Ｇの熱はフィン２３に伝導する。一方、
冷却用の空気２４をフィン２３に当てると、フィン２３
表面の熱伝達によりフィン２３の部分の熱が空気に冷や
されるので、二相流管２２内の冷媒２１Ｇも気体から液
体に変化し、重力により二相流管２２を流下して蒸発部
２０に戻る。First, in the upstream module 4, heat generated in the semiconductor element 2 is transmitted to the module cap 14 via the flexible heat conductor 3, and further to the evaporation section 20. Evaporation section 2
The refrigerant 21L inside 0 is heated by this heat and evaporates.
The refrigerant vapor 21G rises inside the two-phase flow tube 22, and at this time, the heat of the refrigerant gas 21G is conducted to the fins 23. on the other hand,
When the cooling air 24 is applied to the fins 23, the fins 23
As the heat in the fins 23 is cooled by the air through surface heat transfer, the refrigerant 21G in the two-phase flow tube 22 also changes from gas to liquid, flows down the two-phase flow tube 22 due to gravity, and reaches the evaporator 20. return.
なお、下流側のモジュール４′についても上流側のモジ
ュール４′と同様に冷却される。この場合、下流側のモ
ジュール４′に設けられたフィン２３′の高さが上流側
のフィン２３より高い位置にあるので、フィン２３を通
過した空気はフィン２３′の下方を通り抜け、フィン２
３′には新鮮な空気が当たることになる。Note that the downstream module 4' is also cooled in the same manner as the upstream module 4'. In this case, since the height of the fins 23' provided on the downstream module 4' is higher than the fins 23 on the upstream side, the air that has passed through the fins 23 passes under the fins 23' and
3' will be exposed to fresh air.
本実施例によれば、フィン２３に当たった空気は、フィ
ン２３を通過後に他のフィンに当たらないため、その通
風抵抗は小さく、冷却ファンを大型化する必要はない。According to this embodiment, the air that hits the fins 23 does not hit other fins after passing through the fins 23, so the ventilation resistance is small and there is no need to increase the size of the cooling fan.
第５図は本発明の他の実施例を示しており、本実施例で
は、空気の流れに対してフィンの高さ位置を前述の実施
例とは逆にした場合であり、他の構成は前述の実施例と
同じである：
また、第６図は更に他の実施例を示しており、上流側の
二相流管２２ａと下流側の二相流管２２ｂの長さを同一
とした場合である。FIG. 5 shows another embodiment of the present invention. In this embodiment, the height position of the fins with respect to the air flow is reversed from that of the above-mentioned embodiment. The same as the above-mentioned embodiment: FIG. 6 shows still another embodiment, in which the length of the upstream two-phase flow pipe 22a and the downstream two-phase flow pipe 22b are the same. It is.
本実施例によれば、二相流管２２ａ、２２ｂを共通化で
きるので、コスト低減させることができる。According to this embodiment, the two-phase flow tubes 22a and 22b can be used in common, so that costs can be reduced.
以上説明したように、本発明によれば、冷却用の空気の
流れに対して、上流側および下流側のフィンの略全面に
それぞれ新鮮な冷たい空気が当たるようになるので１発
熱体を効率良く冷却することが可能である。また発熱体
の発熱量が大きい場合でも、フィン面積をあまり大きく
する必要はないため、冷却装置の小型化が図れる。As explained above, according to the present invention, with respect to the flow of cooling air, nearly the entire surfaces of the fins on the upstream side and the downstream side are hit with fresh cold air, so that one heating element can be efficiently heated. It is possible to cool it down. Further, even if the heat generation amount of the heating element is large, there is no need to increase the fin area so much that the cooling device can be made smaller.
第１図は本発明の冷却構造を示す全体構成図、第２図は
モジュールの配置を示す平面図、第３図および第４図は
第１図における冷却構造のうち各々上流側および下流側
の構造を示す断面図、第５図は他の実施例を示す全体構
成図、第６図は更に他の実施例を示す全体構成図、第７
図は従来の冷却構造を示す構成図である。
１・・・基板、２・・・半導体素子、
３・・・可撓性熱伝導体、４，４′・・・モジュール。
１４・・・モジュール・キャププ、２０・・・蒸発部、
２ＬＬ・・・冷媒液、２１Ｇ・・・冷媒蒸気、２２．２
２’・・・二相流管、
２３．２３’・・・フィン、２４・・・空気。
第１１図
ぎ
第３図
第４図
１Ｌ１
第５図Figure 1 is an overall configuration diagram showing the cooling structure of the present invention, Figure 2 is a plan view showing the arrangement of modules, and Figures 3 and 4 are the upstream and downstream parts of the cooling structure in Figure 1, respectively. 5 is a cross-sectional view showing the structure, FIG. 5 is an overall configuration diagram showing another embodiment, FIG. 6 is an overall configuration diagram showing still another embodiment, and FIG.
The figure is a configuration diagram showing a conventional cooling structure. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Semiconductor element, 3...Flexible thermal conductor, 4,4'...Module. 14...Module cap, 20...Evaporation section,
2LL...Refrigerant liquid, 21G...Refrigerant vapor, 22.2
2'... Two-phase flow tube, 23.23'... Fin, 24... Air. Figure 11 Figure 3 Figure 4 Figure 1L1 Figure 5
Claims (1)
ィンを設け、該発熱体の上面に平行に空気を流して前記
フィンを空冷することにより、前記発熱体を冷却する電
子機器の冷却構造において、前記フィンの配置高さを、
前記発熱体の列毎に、前記空気の流れと直交する方向へ
相違させて前記フィンの略全面に空気を当てる構成とし
たことを特徴とする電子機器の冷却構造。Cooling of electronic equipment that cools the heating elements by providing individual cooling fins on the upper surface of the heating elements arranged in a plurality of rows and cooling the fins by flowing air parallel to the upper surfaces of the heating elements. In the structure, the arrangement height of the fins is
A cooling structure for an electronic device, characterized in that air is applied to substantially the entire surface of the fins in different directions orthogonal to the air flow for each row of the heating elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63009149A JPH01183888A (en) | 1988-01-19 | 1988-01-19 | Cooling structure of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63009149A JPH01183888A (en) | 1988-01-19 | 1988-01-19 | Cooling structure of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01183888A true JPH01183888A (en) | 1989-07-21 |
Family
ID=11712565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63009149A Pending JPH01183888A (en) | 1988-01-19 | 1988-01-19 | Cooling structure of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01183888A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3090679A4 (en) * | 2014-05-21 | 2017-11-08 | Olympus Corporation | Cooling device, and light source device for endoscope |
| EP3263009A3 (en) * | 2016-06-30 | 2018-04-25 | Karl Storz SE & Co. KG | Device for video endoscopy |
| JP2019165191A (en) * | 2018-03-20 | 2019-09-26 | 廣達電脳股▲ふん▼有限公司 | Extended heat sink design for server |
-
1988
- 1988-01-19 JP JP63009149A patent/JPH01183888A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3090679A4 (en) * | 2014-05-21 | 2017-11-08 | Olympus Corporation | Cooling device, and light source device for endoscope |
| US10092174B2 (en) | 2014-05-21 | 2018-10-09 | Olympus Corporation | Endoscope light source apparatus |
| EP3263009A3 (en) * | 2016-06-30 | 2018-04-25 | Karl Storz SE & Co. KG | Device for video endoscopy |
| JP2019165191A (en) * | 2018-03-20 | 2019-09-26 | 廣達電脳股▲ふん▼有限公司 | Extended heat sink design for server |
| US10842054B2 (en) | 2018-03-20 | 2020-11-17 | Quanta Computer Inc. | Extended heat sink design in server |
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