JPH01181508A - Chip-type solid electrolytic capacitor - Google Patents
Chip-type solid electrolytic capacitorInfo
- Publication number
- JPH01181508A JPH01181508A JP410488A JP410488A JPH01181508A JP H01181508 A JPH01181508 A JP H01181508A JP 410488 A JP410488 A JP 410488A JP 410488 A JP410488 A JP 410488A JP H01181508 A JPH01181508 A JP H01181508A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- lead wire
- resin
- anode
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 21
- 239000007787 solid Substances 0.000 title claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000843 powder Substances 0.000 abstract description 5
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はチップ形固体電解コンデンサに関し、゛特に外
部電極構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-type solid electrolytic capacitor, and particularly to an external electrode structure.
従来、この種のチップ形固体電解コンデンサは、例えば
第２図に示す如く、公知の技術により銀ペースト層迄形
成した陽極体に外部陰極端子１９ｂを導電性接着剤１８
ａにより接続し、また陽極体から導出した陽極リード線
１２に外部ｖ！Ｊ極端子１９ａを溶接により接続した後
、陽・陰極リードの一部を含みモールド外装を行ない、
外部陽・陰極端子をそれぞれＬ字型に折り曲げた構造と
なっていた。Conventionally, this type of chip-type solid electrolytic capacitor has been manufactured by attaching an external cathode terminal 19b to an anode body formed up to a silver paste layer using a conductive adhesive 18 using a known technique, as shown in FIG.
a and external v! to the anode lead wire 12 led out from the anode body. After connecting the J electrode terminal 19a by welding, mold exterior including part of the anode and cathode leads is performed.
It had a structure in which the external positive and negative terminals were each bent into an L-shape.
また、体積効率を高める為に、第３図に示す如く、公知
の技術により銀ペースト層まで形成した陽極体の銀ペー
スト層の表面にはんだ層１８ｂを形成し、陽極リード線
２２に外部陽極端子２９を接続し接続部を補強樹脂２７
により補強してなる裸チップ形固体電解コンデンサがあ
る。In addition, in order to increase the volumetric efficiency, as shown in FIG. 3, a solder layer 18b is formed on the surface of the silver paste layer of the anode body, which has been formed up to the silver paste layer by a known technique, and an external anode terminal is connected to the anode lead wire 22. Connect 29 and reinforce the connection part with resin 27
There is a bare chip type solid electrolytic capacitor reinforced with
上述した従来のチップ形固体電Ｍコンデンサは、下記に
述べる欠点がある。The above-mentioned conventional chip type solid electric M capacitor has the following drawbacks.
すなわち、モールド樹脂外装したチップ形固体電解コン
デンサは、外部陰極端子を導電性接着剤により接続した
後、モールド外装するため、外部陰極端子と導電性接着
剤の肉厚だけ厚くなること、また、外部陽・貼極端子を
モールド樹脂側面に沿って折り曲げる際に機械的応力が
素子に加わるのを緩和するため外部端子がモールド樹脂
外装内部に含まれる部分はある程度の長さが必要となり
、薄形化、小型化が困難であった。In other words, a chip-type solid electrolytic capacitor coated with a molded resin is coated with a mold after the external cathode terminal is connected with a conductive adhesive. Therefore, the thickness of the external cathode terminal and the conductive adhesive becomes thicker. In order to alleviate mechanical stress applied to the element when the positive/stick terminal is bent along the side of the molded resin, the part where the external terminal is included inside the molded resin exterior needs to be a certain length, making it thinner. However, miniaturization was difficult.
一方、裸チップ形固体電解コンデンサは、薄 −型、小
型化の観点からみるとモールド樹脂外層タイプよりも優
れているが、外装していないためはんだ面が広く露出し
ており、実装基板上に実装した場合、実装基板上の他の
配線パターン、部品との絶縁に問題があることや、捺印
表示を行なっても実装時にはんだが一旦溶融するため、
表示が消えてしまうという欠点がある。On the other hand, bare chip type solid electrolytic capacitors are superior to molded resin outer layer types from the viewpoint of thinness and miniaturization, but because they are not packaged, the solder surface is widely exposed and there is When mounted, there may be problems with insulation from other wiring patterns and components on the mounting board, and even if the seal is stamped, the solder will melt during mounting.
The disadvantage is that the display disappears.
本発明の目的は、薄形化、小型化が容易で、従来の外部
端子接続と比較して、接続の信頼性が向上し、かつ実装
したとき実装基板上の他の配線バ゛ターン、部品−絶縁
が良好で、捺印表示が実装時に消えることのないチップ
形固体電解コンデンサを提供することにある。The purpose of the present invention is to easily reduce the thickness and size, improve the reliability of the connection compared to conventional external terminal connections, and, when mounted, to connect other wiring patterns and components on the mounting board. - It is an object of the present invention to provide a chip-type solid electrolytic capacitor which has good insulation and whose marking does not disappear during mounting.
本発明のチップ形固体電解コンデンサは、陽極リード線
を導出し、弁作用を有する金属からなる陽極体の表面に
順次、酸化被膜層、電解質層、カーボン層、めっき層を
形成してなるコンデンサ素子と、少なくとも陽極リード
線導出面の対向面を含む先端部のめっき層が露出するよ
うにコンデンサ素子周面に被着した絶縁樹脂と、コンデ
ンサ素子先端部の露出しためつき層に被着したはんだ層
と、陽極リード線先端に接続された外部陽極端子とを有
することを特徴として構成される。The chip-type solid electrolytic capacitor of the present invention is a capacitor element in which an anode lead wire is led out, and an oxide film layer, an electrolyte layer, a carbon layer, and a plating layer are sequentially formed on the surface of an anode body made of a metal having a valve action. , an insulating resin coated on the circumferential surface of the capacitor element such that at least the plating layer at the tip including the opposite surface of the anode lead wire lead-out surface is exposed, and solder coated on the exposed plating layer at the tip of the capacitor element. and an external anode terminal connected to the tip of the anode lead wire.
次に、本発明について図面を参照して説明する。第１図
は本発明のｉ実施例の縦断面図である。第１図に示すよ
うに、タンタル粉末を加圧成形し陽極リード線２を植立
させて、高温で真空焼結した陽極体１をリン酸、水溶液
中で化成電圧１００ｖを印加して陽極酸化し、タンタル
の酸化皮膜層３を形成した０次に電解質層４と゛して硝
酸マンガン溶液中に浸漬して硝酸マンガンを付着させた
後、温度２００〜３００℃の雰囲気中で熱分解して二酸
化マンガン層を形成した。この浸漬および熱分解は数回
繰り返して行う。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a longitudinal sectional view of the i embodiment of the present invention. As shown in Fig. 1, tantalum powder is pressure-molded, anode lead wires 2 are planted, and the anode body 1 is sintered in vacuum at high temperature.The anode body 1 is anodized by applying a formation voltage of 100V in a phosphoric acid and aqueous solution. After forming the tantalum oxide film layer 3, the electrolyte layer 4 is immersed in a manganese nitrate solution to adhere manganese nitrate, and then thermally decomposed in an atmosphere at a temperature of 200 to 300°C to form carbon dioxide. A manganese layer was formed. This soaking and pyrolysis are repeated several times.
次に、エポキシ樹脂とカーボン粉末、パラジウム粉末、
炭酸カルシウム粉末を混練し、有機溶剤にて希釈した溶
液中に浸漬した後温度１５０〜２００℃の雰囲気中で加
熱硬化し、カーボン層５を形成した後、ｌ Ｑｖｏｊ’
％の塩酸水溶液中に素子を浸漬し、カーボン層５を活性
化して無電解めっきを行ない、めっき層６を形成した。Next, epoxy resin, carbon powder, palladium powder,
Calcium carbonate powder is kneaded, immersed in a solution diluted with an organic solvent, and then heated and cured in an atmosphere at a temperature of 150 to 200°C to form a carbon layer 5.
% hydrochloric acid aqueous solution to activate the carbon layer 5 and perform electroless plating to form a plating layer 6.
めっき液にはホウ素系無電解ニッケルめっき液を使用し
、３〜５ミクロンのニッケルめっき皮膜が得られた。A boron-based electroless nickel plating solution was used as the plating solution, and a nickel plating film of 3 to 5 microns was obtained.
次に、素子周面に静電付着番こよりエポキシ系の粉体樹
脂を付着させた後陽極リード線２の導出面と対向する面
を含む素子先端部の粉体樹脂を除去してめっき層６を露
出させる。しかる後１５０〜２００℃の雰囲気中で粉体
樹脂を加熱硬化させ厚さ１００〜２００ミクロンの外装
樹脂層７を形成した。Next, after applying an epoxy powder resin to the circumferential surface of the element using an electrostatic adhesive, the powder resin at the tip of the element, including the surface facing the lead-out surface of the anode lead wire 2, is removed to form a plating layer 6. expose. Thereafter, the powder resin was cured by heating in an atmosphere of 150 to 200[deg.] C. to form an exterior resin layer 7 having a thickness of 100 to 200 microns.
・次に、溶融はんだ洛中に浸漬して露出しているめっき
層６上に、はんだ層８を形成した後、陽極リード線２の
先端部にコの字状の外部陽極端子９を溶接法により接続
して、チップ形固体電解コンデンサを作成した。・Next, after forming a solder layer 8 on the plating layer 6 exposed by immersing it in molten solder, a U-shaped external anode terminal 9 is attached to the tip of the anode lead wire 2 by welding. By connecting them, a chip-type solid electrolytic capacitor was created.
なお、めっき層６を形成する際に発生する水素ガスから
陽極リード線２の周辺部を保護することと、陽極リード
線２と素子を補強するために、カーボン層４を形成した
後陽極リード線２の導出面に樹脂層を設けてもよい。Note that in order to protect the periphery of the anode lead wire 2 from hydrogen gas generated when forming the plating layer 6 and to reinforce the anode lead wire 2 and the element, the anode lead wire is removed after the carbon layer 4 is formed. A resin layer may be provided on the second lead-out surface.
また、本実施例ではめつぎ層を無電解ニック°ルめっき
浴から生成したが無電解銅めっき浴から生成してもよい
、さらに、絶縁樹脂外装にはブタジェン、アクリル、酸
化ビニル、ポリエステル、フェノール、フロロエラスト
マ、ポリイミド等の樹脂及び変性、混合物を用いてもよ
い。In addition, although the mating layer was produced from an electroless nickel plating bath in this example, it may also be produced from an electroless copper plating bath. Resins such as fluoroelastomers, polyimides, and modified resins and mixtures may also be used.
以上説明したように本発明は、陽極体上に酸化皮膜層、
電解質層、カーボン層を介して形成されためっき層の一
部を除き絶縁樹脂外装を行ない、めっき層露出面にはん
だ層を形成して陰極端子とし、陽極体から導出した陽極
リード線に外部陽極端子が接続されているので下記に述
べる効果がある。As explained above, the present invention provides an oxide film layer on an anode body,
A part of the plating layer formed through the electrolyte layer and carbon layer is covered with insulating resin, a solder layer is formed on the exposed surface of the plating layer to form a cathode terminal, and an external anode is connected to the anode lead wire led out from the anode body. Since the terminals are connected, there is the effect described below.
（１） 陰極端子の取り出しに外部陰極端子と導電性
接着剤を使用しないため、薄形化が可能となり、また材
料費が低減できる。(1) Since an external cathode terminal and a conductive adhesive are not used to take out the cathode terminal, it is possible to make the device thinner and reduce material costs.
（２） めっき層の一部を露出させ直接陰極端子を取
り出しているため、従来の外部端子接続と比較して接続
の信顆性が向上するとともに小形化が可能となり、チッ
プ形固体電解コンデンサの床面積を低減できる。(2) Since a part of the plating layer is exposed and the cathode terminal is taken out directly, the reliability of the connection is improved compared to the conventional external terminal connection, and the size can be reduced. Floor space can be reduced.
（３） Ｋ子の周面を絶縁樹脂により外装するなめ、
裸チップ形に比べて耐衝撃性が向上し、自動実装機によ
る実装、捺印表示が可能である。(3) Covering the circumferential surface of the K-piece with insulating resin,
It has improved impact resistance compared to the bare chip type, and can be mounted using an automatic mounting machine and stamped.
（４） 絶縁樹脂外装を静電塗装法で実施するため、
高価なモールド金型が不要になり、モールド外装に比べ
て外装時に受ける機械的応力が際めて小さいため、漏れ
電流の劣化が少ない。(4) Because the insulating resin exterior is applied using electrostatic coating,
There is no need for expensive molding dies, and the mechanical stress received during packaging is much smaller than that in molded packaging, so there is less deterioration in leakage current.
（５） 陽極端子として外部陽極端子を使用するため
、外部陽極端子を素子本体の高さにあった形状に成型す
ることにより、接地状態が安定した形状とすることがで
きる。(5) Since an external anode terminal is used as the anode terminal, by molding the external anode terminal into a shape that matches the height of the element body, a stable grounding state can be achieved.
第１図は本発明の一実施例の縦断面図、第２図、第３図
は従来例の縦断面図である。
１・・・陽極体、２．１２．２２・・・陽極リード線、
３・・・酸化皮膜層、４・・・電解質層、５・・・カー
ボン層、６・・・めっき層、７・・・外装樹脂層、８・
・・はんだ層、９・・・陽極端子、１８ａ・・・導電性
接着剤、１８ｂ・・・はんだ層、１９ａ、２９・・・外
部陽極端子、１９ｂ・・・外部陰極端子、２７・・・補
強樹脂。FIG. 1 is a vertical cross-sectional view of one embodiment of the present invention, and FIGS. 2 and 3 are vertical cross-sectional views of a conventional example. 1... Anode body, 2.12.22... Anode lead wire,
3... Oxide film layer, 4... Electrolyte layer, 5... Carbon layer, 6... Plating layer, 7... Exterior resin layer, 8...
... Solder layer, 9... Anode terminal, 18a... Conductive adhesive, 18b... Solder layer, 19a, 29... External anode terminal, 19b... External cathode terminal, 27... Reinforced resin.
Claims (1)
極体の表面に順次、酸化被膜層，電解質層，カーボン層
，めっき層を形成してなるコンデンサ素子と、少なくと
も陽極リード線導出面の対向面を含む先端部のめっき層
が露出するようにコンデンサ素子周面に被着した絶縁樹
脂と、コンデンサ素子先端部の露出しためっき層に被着
したはんだ層と、陽極リード線先端に接続された外部陽
極端子とを有することを特徴とするチップ形固体電解コ
ンデンサ。An anode lead wire is led out, and at least the anode lead wire lead-out surface faces a capacitor element formed by sequentially forming an oxide film layer, an electrolyte layer, a carbon layer, and a plating layer on the surface of an anode body made of a metal having a valve action. The insulating resin is applied to the circumferential surface of the capacitor element so that the plating layer at the tip including the surface is exposed, the solder layer is applied to the exposed plating layer at the tip of the capacitor element, and the anode lead wire is connected to the tip of the anode lead wire. A chip-type solid electrolytic capacitor characterized by having an external anode terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP410488A JPH01181508A (en) | 1988-01-11 | 1988-01-11 | Chip-type solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP410488A JPH01181508A (en) | 1988-01-11 | 1988-01-11 | Chip-type solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01181508A true JPH01181508A (en) | 1989-07-19 |
Family
ID=11575483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP410488A Pending JPH01181508A (en) | 1988-01-11 | 1988-01-11 | Chip-type solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01181508A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159722A (en) * | 1984-11-09 | 1986-07-19 | ノ−ス・アメリカン・フイリツプス・コ−ポレ−シヨン | Solid electrolytic capacitor for mounting surface |
-
1988
- 1988-01-11 JP JP410488A patent/JPH01181508A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159722A (en) * | 1984-11-09 | 1986-07-19 | ノ−ス・アメリカン・フイリツプス・コ−ポレ−シヨン | Solid electrolytic capacitor for mounting surface |
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