JPH01180796A - レーザビームの照射方法 - Google Patents

レーザビームの照射方法

Info

Publication number
JPH01180796A
JPH01180796A JP62336082A JP33608287A JPH01180796A JP H01180796 A JPH01180796 A JP H01180796A JP 62336082 A JP62336082 A JP 62336082A JP 33608287 A JP33608287 A JP 33608287A JP H01180796 A JPH01180796 A JP H01180796A
Authority
JP
Japan
Prior art keywords
mirror
laser beam
segment
linear
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62336082A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455785B2 (enrdf_load_stackoverflow
Inventor
Shinsuke Nakanishi
伸介 中西
Osami Ichiko
市古　修身
Katsuhiro Minamida
勝宏 南田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP62336082A priority Critical patent/JPH01180796A/ja
Publication of JPH01180796A publication Critical patent/JPH01180796A/ja
Publication of JPH0455785B2 publication Critical patent/JPH0455785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP62336082A 1987-12-28 1987-12-28 レーザビームの照射方法 Granted JPH01180796A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62336082A JPH01180796A (ja) 1987-12-28 1987-12-28 レーザビームの照射方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62336082A JPH01180796A (ja) 1987-12-28 1987-12-28 レーザビームの照射方法

Publications (2)

Publication Number Publication Date
JPH01180796A true JPH01180796A (ja) 1989-07-18
JPH0455785B2 JPH0455785B2 (enrdf_load_stackoverflow) 1992-09-04

Family

ID=18295509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62336082A Granted JPH01180796A (ja) 1987-12-28 1987-12-28 レーザビームの照射方法

Country Status (1)

Country Link
JP (1) JPH01180796A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7148447B2 (en) * 2001-03-29 2006-12-12 Gsi Group Corporation Method and apparatus for laser marking by ablation
US7270431B2 (en) * 2004-07-16 2007-09-18 Carl Zeiss Jena Gmbh Illumination device and its use

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794482A (en) * 1980-12-05 1982-06-11 Hitachi Ltd Pattern forming device by laser
JPS6284889A (ja) * 1985-10-11 1987-04-18 Nippon Steel Corp レ−ザ溶接方法および装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794482A (en) * 1980-12-05 1982-06-11 Hitachi Ltd Pattern forming device by laser
JPS6284889A (ja) * 1985-10-11 1987-04-18 Nippon Steel Corp レ−ザ溶接方法および装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7148447B2 (en) * 2001-03-29 2006-12-12 Gsi Group Corporation Method and apparatus for laser marking by ablation
US7270431B2 (en) * 2004-07-16 2007-09-18 Carl Zeiss Jena Gmbh Illumination device and its use

Also Published As

Publication number Publication date
JPH0455785B2 (enrdf_load_stackoverflow) 1992-09-04

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