JPH01179459U - - Google Patents
Info
- Publication number
- JPH01179459U JPH01179459U JP7476488U JP7476488U JPH01179459U JP H01179459 U JPH01179459 U JP H01179459U JP 7476488 U JP7476488 U JP 7476488U JP 7476488 U JP7476488 U JP 7476488U JP H01179459 U JPH01179459 U JP H01179459U
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- circuit board
- printed circuit
- microwave integrated
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7476488U JPH01179459U (enExample) | 1988-06-07 | 1988-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7476488U JPH01179459U (enExample) | 1988-06-07 | 1988-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01179459U true JPH01179459U (enExample) | 1989-12-22 |
Family
ID=31299859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7476488U Pending JPH01179459U (enExample) | 1988-06-07 | 1988-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01179459U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936616A (ja) * | 1995-07-13 | 1997-02-07 | Mitsubishi Electric Corp | マイクロ波回路装置 |
| JPWO2018193844A1 (ja) * | 2017-04-17 | 2020-01-16 | 株式会社フジクラ | 多層基板、多層基板アレイ、及び送受信モジュール |
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1988
- 1988-06-07 JP JP7476488U patent/JPH01179459U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936616A (ja) * | 1995-07-13 | 1997-02-07 | Mitsubishi Electric Corp | マイクロ波回路装置 |
| JPWO2018193844A1 (ja) * | 2017-04-17 | 2020-01-16 | 株式会社フジクラ | 多層基板、多層基板アレイ、及び送受信モジュール |