JPH01176969U - - Google Patents
Info
- Publication number
- JPH01176969U JPH01176969U JP7431188U JP7431188U JPH01176969U JP H01176969 U JPH01176969 U JP H01176969U JP 7431188 U JP7431188 U JP 7431188U JP 7431188 U JP7431188 U JP 7431188U JP H01176969 U JPH01176969 U JP H01176969U
- Authority
- JP
- Japan
- Prior art keywords
- copper
- wiring board
- based paste
- palladium
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の実施例を説明するための図、
第２図は従来のセラミツク配線基板を示す図であ
る。
図において、１０はセラミツク基板、１１はス
ルーホール用の孔、１２はスルーホール、１３は
配線パターンを示す。
FIG. 1 is a diagram for explaining an embodiment of the present invention,
FIG. 2 is a diagram showing a conventional ceramic wiring board. In the figure, 10 is a ceramic substrate, 11 is a hole for a through hole, 12 is a through hole, and 13 is a wiring pattern.
Claims (1)
おいて、 スルーホール１１のみ銀パラジウム系ペースト
により形成され、配線パターン１３は銅系ペース
トにより形成されたことを特徴とするセラミツク
配線基板。[Claim for Utility Model Registration] A ceramic wiring board using a copper-based thick-film conductor, characterized in that only the through holes 11 are formed of a silver-palladium-based paste, and the wiring pattern 13 is formed of a copper-based paste. wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7431188U JPH01176969U (en) | 1988-06-06 | 1988-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7431188U JPH01176969U (en) | 1988-06-06 | 1988-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176969U true JPH01176969U (en) | 1989-12-18 |
Family
ID=31299427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7431188U Pending JPH01176969U (en) | 1988-06-06 | 1988-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176969U (en) |
-
1988
- 1988-06-06 JP JP7431188U patent/JPH01176969U/ja active Pending