JPH01176950U - - Google Patents
Info
- Publication number
- JPH01176950U JPH01176950U JP1988073502U JP7350288U JPH01176950U JP H01176950 U JPH01176950 U JP H01176950U JP 1988073502 U JP1988073502 U JP 1988073502U JP 7350288 U JP7350288 U JP 7350288U JP H01176950 U JPH01176950 U JP H01176950U
- Authority
- JP
- Japan
- Prior art keywords
- package
- positioning groove
- semiconductor
- stacked
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988073502U JPH01176950U (de) | 1988-06-01 | 1988-06-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988073502U JPH01176950U (de) | 1988-06-01 | 1988-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01176950U true JPH01176950U (de) | 1989-12-18 |
Family
ID=31298644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988073502U Pending JPH01176950U (de) | 1988-06-01 | 1988-06-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01176950U (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030001032A (ko) * | 2001-06-28 | 2003-01-06 | 동부전자 주식회사 | 멀티 스택형 패키지의 실장 구조 |
KR20030057186A (ko) * | 2001-12-28 | 2003-07-04 | 동부전자 주식회사 | 반도체패키지 및 그 제조 방법 |
-
1988
- 1988-06-01 JP JP1988073502U patent/JPH01176950U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030001032A (ko) * | 2001-06-28 | 2003-01-06 | 동부전자 주식회사 | 멀티 스택형 패키지의 실장 구조 |
KR20030057186A (ko) * | 2001-12-28 | 2003-07-04 | 동부전자 주식회사 | 반도체패키지 및 그 제조 방법 |