JPH01174930U - - Google Patents

Info

Publication number
JPH01174930U
JPH01174930U JP1988071375U JP7137588U JPH01174930U JP H01174930 U JPH01174930 U JP H01174930U JP 1988071375 U JP1988071375 U JP 1988071375U JP 7137588 U JP7137588 U JP 7137588U JP H01174930 U JPH01174930 U JP H01174930U
Authority
JP
Japan
Prior art keywords
bonding
oscillation output
wire
tool
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988071375U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988071375U priority Critical patent/JPH01174930U/ja
Publication of JPH01174930U publication Critical patent/JPH01174930U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1988071375U 1988-05-30 1988-05-30 Pending JPH01174930U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988071375U JPH01174930U (enExample) 1988-05-30 1988-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988071375U JPH01174930U (enExample) 1988-05-30 1988-05-30

Publications (1)

Publication Number Publication Date
JPH01174930U true JPH01174930U (enExample) 1989-12-13

Family

ID=31296583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988071375U Pending JPH01174930U (enExample) 1988-05-30 1988-05-30

Country Status (1)

Country Link
JP (1) JPH01174930U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04120753A (ja) * 1989-12-22 1992-04-21 Hughes Aircraft Co ボンドシグネチャ解析装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04120753A (ja) * 1989-12-22 1992-04-21 Hughes Aircraft Co ボンドシグネチャ解析装置

Similar Documents

Publication Publication Date Title
JPS5949470U (ja) 溶接電極の追跡装置
JP3425492B2 (ja) 半導体実装方法およびその装置
JPH01174930U (enExample)
JPH0238739U (enExample)
JP2722886B2 (ja) ワイヤボンディング装置
JPH0270439U (enExample)
JPH0466281A (ja) 超音波熔接機
JP2888335B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
JPS58160045A (ja) バイトの異常検出装置
JPH03220741A (ja) ワイヤレスボンディング装置
JPS5943731Y2 (ja) ワイヤボンデイング監視機構
JPH01173939U (enExample)
JPH0313740U (enExample)
JPS6235593Y2 (enExample)
JPS6115336A (ja) ワイヤボンデイング方法
JPS602833U (ja) 半導体組立装置
JPS6126150U (ja) 材料試験機の試験片つかみ装置
JPS60194473U (ja) ボルト軸力検出装置
JPS61237438A (ja) ボンデイング検査方式
JPS61294830A (ja) 自動ワイヤ−ボンデイング装置
JPS61237440A (ja) ボンデイング検査方式
JPS6420977U (enExample)
JPS5936687U (ja) モ−シヨナルフイ−ドバツクスピ−カ装置
JPH0273739U (enExample)
JPH01105083U (enExample)