JPH01174138U - - Google Patents
Info
- Publication number
- JPH01174138U JPH01174138U JP7159488U JP7159488U JPH01174138U JP H01174138 U JPH01174138 U JP H01174138U JP 7159488 U JP7159488 U JP 7159488U JP 7159488 U JP7159488 U JP 7159488U JP H01174138 U JPH01174138 U JP H01174138U
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- insulating substrate
- heating resistor
- thermal head
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案による厚膜型サーマルヘツドの
一実施例の要部の拡大図、第２図は第１図の―
線による断面図、第３図は従来の熱記録装置の
全体図、第４図はその装置に用いられるサーマル
ヘツドの一例を示す部分斜視図、第５図は第４図
の矢視Ｖ部の拡大図、第６図は第５図の―線
による断面図、第７図は従来のサーマルヘツドの
他の例を示す第１図と同じ箇所の図、第８図は第
７図の―線による断面図である。
１…絶縁基板、４…個別電極、５…共通電極、
６…共通電極接続部、７…共通電極本体部、８…
金層、９…合金層（金以外の金属層）、１１…発
熱抵抗体。
Figure 1 is an enlarged view of the main parts of an embodiment of the thick film type thermal head according to the present invention, and Figure 2 is the same as in Figure 1.
3 is an overall view of a conventional thermal recording device, FIG. 4 is a partial perspective view showing an example of a thermal head used in the device, and FIG. 5 is a section taken in the direction of arrow V in FIG. Enlarged view, Figure 6 is a cross-sectional view taken along the - line in Figure 5, Figure 7 is a view of the same location as Figure 1 showing another example of a conventional thermal head, and Figure 8 is a cross-sectional view taken along the - line in Figure 7. FIG. 1... Insulating substrate, 4... Individual electrode, 5... Common electrode,
6... Common electrode connection part, 7... Common electrode main body part, 8...
Gold layer, 9... Alloy layer (metal layer other than gold), 11... Heat generating resistor.
Claims (1)
た帯状の共通電極本体部７および該共通電極本体
部７から櫛歯状に延びる複数の共通電極接続部６
より成る共通電極５と、前記絶縁基板１表面に形
成され、前記複数の共通電極接続部６に対峙する
複数の個別電極４と、前記共通電極接続部６と個
別電極４を接続する発熱抵抗体１１とを備えて成
る厚膜型サーマルヘツドにおいて； 前記共通電極５の共通電極本体部７が、共通電
極接続部６と一体に形成された金層８と、この金
層８に重ねて形成された金以外の金属層９とを有
し、前記絶縁基板１表面の前記金以外の金属層９
が形成された部分の高さを前記発熱抵抗体１１が
形成された部分の高さよりも低く形成したことを
特徴とする、厚膜型サーマルヘツド。[Claims for Utility Model Registration] An insulating substrate 1, a band-shaped common electrode main body 7 formed on the surface of the insulating substrate 1, and a plurality of common electrode connecting parts 6 extending in a comb-like shape from the common electrode main body 7.
a common electrode 5, a plurality of individual electrodes 4 formed on the surface of the insulating substrate 1 and facing the plurality of common electrode connection parts 6, and a heating resistor connecting the common electrode connection part 6 and the individual electrodes 4. In the thick film type thermal head comprising: and a metal layer 9 other than gold on the surface of the insulating substrate 1.
1. A thick film type thermal head, characterized in that the height of the portion where the heating resistor 11 is formed is lower than the height of the portion where the heating resistor 11 is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7159488U JPH01174138U (en) | 1988-05-30 | 1988-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7159488U JPH01174138U (en) | 1988-05-30 | 1988-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174138U true JPH01174138U (en) | 1989-12-11 |
Family
ID=31296800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7159488U Pending JPH01174138U (en) | 1988-05-30 | 1988-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174138U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0419155A (en) * | 1990-05-15 | 1992-01-23 | Rohm Co Ltd | Thick film type thermal head |
-
1988
- 1988-05-30 JP JP7159488U patent/JPH01174138U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0419155A (en) * | 1990-05-15 | 1992-01-23 | Rohm Co Ltd | Thick film type thermal head |