JPS6219253U - - Google Patents
Info
- Publication number
- JPS6219253U JPS6219253U JP10978685U JP10978685U JPS6219253U JP S6219253 U JPS6219253 U JP S6219253U JP 10978685 U JP10978685 U JP 10978685U JP 10978685 U JP10978685 U JP 10978685U JP S6219253 U JPS6219253 U JP S6219253U
- Authority
- JP
- Japan
- Prior art keywords
- folded
- common electrode
- substrate
- thermal head
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案によるサーマルヘツドの一実施
例を示す断面図、第２図は本考案によるサーマル
ヘツドの他の実施例を示す断面図、第３図は従来
のサーマルヘツドを示す平面図、第４図は第３図
のＥ―Ｅ拡大断面図である。
FIG. 1 is a sectional view showing one embodiment of the thermal head according to the present invention, FIG. 2 is a sectional view showing another embodiment of the thermal head according to the present invention, and FIG. 3 is a plan view showing a conventional thermal head. FIG. 4 is an enlarged sectional view taken along the line EE in FIG. 3.
Claims (1)
基板の発熱部列形成側端部を折り返えし、該折り
返し部および該折り返し部につながる基板裏面に
コモン電極を設けたことを特徴とするサーマルヘ
ツド。 ２ 前記コモン電極を厚膜導体により構成したこ
とを特徴とする実用新案登録請求の範囲第１項記
載のサーマルヘツド。 ３ 前記折り返し部を折り畳み状に形成すると共
に、前記折り返し部に設けたコモン電極に対し、
基板裏面の前記コモン電極形成部以外のほぼ全面
にわたつて形成した厚膜導体を接続したことを特
徴とする実用新案登録請求の範囲第１項または第
２項記載のサーマルヘツド。[Claims for Utility Model Registration] 1. Low-temperature firing ceramics is used as the substrate, the end of the substrate on the side where the heat generating part row is formed is folded back, and a common electrode is provided on the folded section and the back surface of the substrate connected to the folded section. A thermal head characterized by: 2. The thermal head according to claim 1, wherein the common electrode is made of a thick film conductor. 3 The folded portion is formed into a folded shape, and a common electrode provided on the folded portion is
The thermal head according to claim 1 or 2, characterized in that a thick film conductor is connected to the thick film conductor formed over almost the entire surface of the back surface of the substrate other than the common electrode forming area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10978685U JPS6219253U (en) | 1985-07-18 | 1985-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10978685U JPS6219253U (en) | 1985-07-18 | 1985-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6219253U true JPS6219253U (en) | 1987-02-05 |
Family
ID=30988199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10978685U Pending JPS6219253U (en) | 1985-07-18 | 1985-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6219253U (en) |
-
1985
- 1985-07-18 JP JP10978685U patent/JPS6219253U/ja active Pending