JPH01173957U - - Google Patents
Info
- Publication number
- JPH01173957U JPH01173957U JP1988069057U JP6905788U JPH01173957U JP H01173957 U JPH01173957 U JP H01173957U JP 1988069057 U JP1988069057 U JP 1988069057U JP 6905788 U JP6905788 U JP 6905788U JP H01173957 U JPH01173957 U JP H01173957U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- lsi chip
- substrate
- bump
- prevention part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/701—
Landscapes
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988069057U JPH01173957U (enExample) | 1988-05-25 | 1988-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988069057U JPH01173957U (enExample) | 1988-05-25 | 1988-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173957U true JPH01173957U (enExample) | 1989-12-11 |
Family
ID=31294351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988069057U Pending JPH01173957U (enExample) | 1988-05-25 | 1988-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173957U (enExample) |
-
1988
- 1988-05-25 JP JP1988069057U patent/JPH01173957U/ja active Pending