JPH01173957U - - Google Patents

Info

Publication number
JPH01173957U
JPH01173957U JP1988069057U JP6905788U JPH01173957U JP H01173957 U JPH01173957 U JP H01173957U JP 1988069057 U JP1988069057 U JP 1988069057U JP 6905788 U JP6905788 U JP 6905788U JP H01173957 U JPH01173957 U JP H01173957U
Authority
JP
Japan
Prior art keywords
inner lead
lsi chip
substrate
bump
prevention part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988069057U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988069057U priority Critical patent/JPH01173957U/ja
Publication of JPH01173957U publication Critical patent/JPH01173957U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/701—

Landscapes

  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
JP1988069057U 1988-05-25 1988-05-25 Pending JPH01173957U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988069057U JPH01173957U (cg-RX-API-DMAC10.html) 1988-05-25 1988-05-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988069057U JPH01173957U (cg-RX-API-DMAC10.html) 1988-05-25 1988-05-25

Publications (1)

Publication Number Publication Date
JPH01173957U true JPH01173957U (cg-RX-API-DMAC10.html) 1989-12-11

Family

ID=31294351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988069057U Pending JPH01173957U (cg-RX-API-DMAC10.html) 1988-05-25 1988-05-25

Country Status (1)

Country Link
JP (1) JPH01173957U (cg-RX-API-DMAC10.html)

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