JPH01173950U - - Google Patents
Info
- Publication number
- JPH01173950U JPH01173950U JP7051988U JP7051988U JPH01173950U JP H01173950 U JPH01173950 U JP H01173950U JP 7051988 U JP7051988 U JP 7051988U JP 7051988 U JP7051988 U JP 7051988U JP H01173950 U JPH01173950 U JP H01173950U
- Authority
- JP
- Japan
- Prior art keywords
- package
- clock
- top surface
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009977 dual effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7051988U JPH01173950U (enExample) | 1988-05-27 | 1988-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7051988U JPH01173950U (enExample) | 1988-05-27 | 1988-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173950U true JPH01173950U (enExample) | 1989-12-11 |
Family
ID=31295760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7051988U Pending JPH01173950U (enExample) | 1988-05-27 | 1988-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173950U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278355A (ja) * | 2005-03-25 | 2006-10-12 | Nec Corp | 集積回路パッケージ組立構造及び集積回路パッケージの製造方法 |
-
1988
- 1988-05-27 JP JP7051988U patent/JPH01173950U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278355A (ja) * | 2005-03-25 | 2006-10-12 | Nec Corp | 集積回路パッケージ組立構造及び集積回路パッケージの製造方法 |