JPH01172456U - - Google Patents
Info
- Publication number
- JPH01172456U JPH01172456U JP6671788U JP6671788U JPH01172456U JP H01172456 U JPH01172456 U JP H01172456U JP 6671788 U JP6671788 U JP 6671788U JP 6671788 U JP6671788 U JP 6671788U JP H01172456 U JPH01172456 U JP H01172456U
- Authority
- JP
- Japan
- Prior art keywords
- steam
- inert liquid
- vapor
- recovery device
- liquid recovery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000011084 recovery Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000012808 vapor phase Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 3
- 239000000155 melt Substances 0.000 claims 1
- 239000012071 phase Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6671788U JPH0539828Y2 (cs) | 1988-05-20 | 1988-05-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6671788U JPH0539828Y2 (cs) | 1988-05-20 | 1988-05-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01172456U true JPH01172456U (cs) | 1989-12-06 |
JPH0539828Y2 JPH0539828Y2 (cs) | 1993-10-08 |
Family
ID=31292113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6671788U Expired - Lifetime JPH0539828Y2 (cs) | 1988-05-20 | 1988-05-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0539828Y2 (cs) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010118387A (ja) * | 2008-11-11 | 2010-05-27 | Tamura Seisakusho Co Ltd | リフロー済基板の冷却装置 |
-
1988
- 1988-05-20 JP JP6671788U patent/JPH0539828Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010118387A (ja) * | 2008-11-11 | 2010-05-27 | Tamura Seisakusho Co Ltd | リフロー済基板の冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0539828Y2 (cs) | 1993-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH01172456U (cs) | ||
JPH04237559A (ja) | 半田ゴテ | |
JPS6264473A (ja) | 物品の融着接合装置 | |
JPH01289566A (ja) | ベーパーフェイズ・リフロー半田付装置 | |
JPS6232690Y2 (cs) | ||
JP3865866B2 (ja) | リフロー装置 | |
JPS6437077A (en) | Reflow soldering | |
SU846187A1 (ru) | Флюс дл пайки медных сплавов | |
JPS6246184U (cs) | ||
JPH0276665U (cs) | ||
JPS59120072U (ja) | サブマ−ジア−ク溶接装置 | |
JPS6353362U (cs) | ||
JPS6371970U (cs) | ||
JPS63106174U (cs) | ||
JPH01127667U (cs) | ||
Nishimura | Hard Solder Brazing of Aluminum | |
Ruediger | Investigations on the Effect of Gravity on the Arc Welding Process.(Dissertation) | |
Kemble | Vacuum Braze Cycle for Clad Aluminum Sheet | |
JPH075680Y2 (ja) | 端子ピンの平面出し治具 | |
JPH0270859U (cs) | ||
Piegat | Method Using a Soldering Alloy for Connecting Parts of Which at Least Some Are Made of Aluminum | |
JPS6390383U (cs) | ||
Brous | Process of Applying Solder | |
Coffman et al. | Device for Desoldering/Soldering | |
JPH03101364U (cs) |