JPH01170037A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH01170037A
JPH01170037A JP32708087A JP32708087A JPH01170037A JP H01170037 A JPH01170037 A JP H01170037A JP 32708087 A JP32708087 A JP 32708087A JP 32708087 A JP32708087 A JP 32708087A JP H01170037 A JPH01170037 A JP H01170037A
Authority
JP
Japan
Prior art keywords
lamination
leads
8a
mounted
lead patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32708087A
Other versions
JP2538962B2 (en
Inventor
Toshio Sugano
Masayuki Watanabe
Original Assignee
Hitachi Device Eng Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Device Eng Co Ltd, Hitachi Ltd filed Critical Hitachi Device Eng Co Ltd
Priority to JP32708087A priority Critical patent/JP2538962B2/en
Publication of JPH01170037A publication Critical patent/JPH01170037A/en
Application granted granted Critical
Publication of JP2538962B2 publication Critical patent/JP2538962B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: To enable the tape carriers to be mounted in high density by making it feasible to lamination-mount the lead patterns of packages.
CONSTITUTION: The leads 8A as the parts if respective lead patterns 8 are modified to lamination-mount tape carriers. In other words, the lead 8A at right hand upper end part controls the input.output of chip select signals of laminationmounted upper chips while the other leads 8A adjacent to the leads 8B at right hand upper end part controls the input.output of chip select signals of lamination-mounted chips. Through these procedures, two each of tape carrier packages 3A, 3B can be lamination-mounted on a mother port 1 by modifying the leads 8A as the parts of lead patterns 8 to augment the mounting density.
COPYRIGHT: (C)1989,JPO&Japio
JP32708087A 1987-12-25 1987-12-25 Semiconductor device Expired - Lifetime JP2538962B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32708087A JP2538962B2 (en) 1987-12-25 1987-12-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32708087A JP2538962B2 (en) 1987-12-25 1987-12-25 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH01170037A true JPH01170037A (en) 1989-07-05
JP2538962B2 JP2538962B2 (en) 1996-10-02

Family

ID=18195064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32708087A Expired - Lifetime JP2538962B2 (en) 1987-12-25 1987-12-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JP2538962B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198888A (en) * 1987-12-28 1993-03-30 Hitachi, Ltd. Semiconductor stacked device
US5334875A (en) * 1987-12-28 1994-08-02 Hitachi, Ltd. Stacked semiconductor memory device and semiconductor memory module containing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198888A (en) * 1987-12-28 1993-03-30 Hitachi, Ltd. Semiconductor stacked device
US5334875A (en) * 1987-12-28 1994-08-02 Hitachi, Ltd. Stacked semiconductor memory device and semiconductor memory module containing the same

Also Published As

Publication number Publication date
JP2538962B2 (en) 1996-10-02

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