JPH01167060U - - Google Patents

Info

Publication number
JPH01167060U
JPH01167060U JP6387788U JP6387788U JPH01167060U JP H01167060 U JPH01167060 U JP H01167060U JP 6387788 U JP6387788 U JP 6387788U JP 6387788 U JP6387788 U JP 6387788U JP H01167060 U JPH01167060 U JP H01167060U
Authority
JP
Japan
Prior art keywords
circuit board
insulating substrate
image sensor
support plate
driving circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6387788U
Other languages
English (en)
Japanese (ja)
Other versions
JPH071801Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6387788U priority Critical patent/JPH071801Y2/ja
Publication of JPH01167060U publication Critical patent/JPH01167060U/ja
Application granted granted Critical
Publication of JPH071801Y2 publication Critical patent/JPH071801Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
JP6387788U 1988-05-14 1988-05-14 イメージセンサ Expired - Lifetime JPH071801Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6387788U JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6387788U JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Publications (2)

Publication Number Publication Date
JPH01167060U true JPH01167060U ( ) 1989-11-22
JPH071801Y2 JPH071801Y2 (ja) 1995-01-18

Family

ID=31289365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6387788U Expired - Lifetime JPH071801Y2 (ja) 1988-05-14 1988-05-14 イメージセンサ

Country Status (1)

Country Link
JP (1) JPH071801Y2 ( )

Also Published As

Publication number Publication date
JPH071801Y2 (ja) 1995-01-18

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