JPH01167054U - - Google Patents
Info
- Publication number
- JPH01167054U JPH01167054U JP6418688U JP6418688U JPH01167054U JP H01167054 U JPH01167054 U JP H01167054U JP 6418688 U JP6418688 U JP 6418688U JP 6418688 U JP6418688 U JP 6418688U JP H01167054 U JPH01167054 U JP H01167054U
- Authority
- JP
- Japan
- Prior art keywords
- die pattern
- pattern
- lead
- die
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6418688U JPH01167054U (ko) | 1988-05-16 | 1988-05-16 | |
| KR1019890006521A KR900019543A (ko) | 1988-05-16 | 1989-05-16 | 프린트 회로기판 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6418688U JPH01167054U (ko) | 1988-05-16 | 1988-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01167054U true JPH01167054U (ko) | 1989-11-22 |
Family
ID=31289663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6418688U Pending JPH01167054U (ko) | 1988-05-16 | 1988-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01167054U (ko) |
-
1988
- 1988-05-16 JP JP6418688U patent/JPH01167054U/ja active Pending