JPH01167042U - - Google Patents
Info
- Publication number
- JPH01167042U JPH01167042U JP1988063854U JP6385488U JPH01167042U JP H01167042 U JPH01167042 U JP H01167042U JP 1988063854 U JP1988063854 U JP 1988063854U JP 6385488 U JP6385488 U JP 6385488U JP H01167042 U JPH01167042 U JP H01167042U
- Authority
- JP
- Japan
- Prior art keywords
- package
- circuits
- separated
- stepped portion
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/682—
-
- H10W72/5449—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063854U JPH0622989Y2 (ja) | 1988-05-13 | 1988-05-13 | 電子部品用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063854U JPH0622989Y2 (ja) | 1988-05-13 | 1988-05-13 | 電子部品用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01167042U true JPH01167042U (enExample) | 1989-11-22 |
| JPH0622989Y2 JPH0622989Y2 (ja) | 1994-06-15 |
Family
ID=31289342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063854U Expired - Lifetime JPH0622989Y2 (ja) | 1988-05-13 | 1988-05-13 | 電子部品用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622989Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014027585A (ja) * | 2012-07-30 | 2014-02-06 | Seiko Epson Corp | 電子部品の製造方法および電子モジュールの製造方法 |
| JP2023037262A (ja) * | 2021-09-03 | 2023-03-15 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
-
1988
- 1988-05-13 JP JP1988063854U patent/JPH0622989Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014027585A (ja) * | 2012-07-30 | 2014-02-06 | Seiko Epson Corp | 電子部品の製造方法および電子モジュールの製造方法 |
| JP2023037262A (ja) * | 2021-09-03 | 2023-03-15 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0622989Y2 (ja) | 1994-06-15 |