JPH01165639U - - Google Patents
Info
- Publication number
- JPH01165639U JPH01165639U JP1988061214U JP6121488U JPH01165639U JP H01165639 U JPH01165639 U JP H01165639U JP 1988061214 U JP1988061214 U JP 1988061214U JP 6121488 U JP6121488 U JP 6121488U JP H01165639 U JPH01165639 U JP H01165639U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding device
- capillary
- wire bonding
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来装置を示す断面図である。図中、９は
キヤピラリチツプ、９ａはテーパ部である。なお
、図中、同一符号は同一、又は相当部分を示す。
２図は従来装置を示す断面図である。図中、９は
キヤピラリチツプ、９ａはテーパ部である。なお
、図中、同一符号は同一、又は相当部分を示す。
Claims (1)
- 貫通孔を有した先細筒形状のキヤピラリにワイ
ヤを挿通し、このワイヤの先端部にボールを形成
してワイヤ接続するワイヤボンデイング装置にお
いて、前記キヤピラリの上記ワイヤの挿入側開口
部をテーパ状に拡大したことを特徴とするワイヤ
ボンデイング装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061214U JPH01165639U (ja) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061214U JPH01165639U (ja) | 1988-05-10 | 1988-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165639U true JPH01165639U (ja) | 1989-11-20 |
Family
ID=31286890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988061214U Pending JPH01165639U (ja) | 1988-05-10 | 1988-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165639U (ja) |
-
1988
- 1988-05-10 JP JP1988061214U patent/JPH01165639U/ja active Pending