JPH032641U - - Google Patents
Info
- Publication number
- JPH032641U JPH032641U JP1989063399U JP6339989U JPH032641U JP H032641 U JPH032641 U JP H032641U JP 1989063399 U JP1989063399 U JP 1989063399U JP 6339989 U JP6339989 U JP 6339989U JP H032641 U JPH032641 U JP H032641U
- Authority
- JP
- Japan
- Prior art keywords
- end faces
- chamfered
- outer peripheral
- insertion hole
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例に係るキヤピラリー
の斜視図、第２図は同キヤピラリーの断面図、第
３図は従来のキヤピラリーの説明図である。 １……金属細線、１ａ，１ｂ……金属細線の開
口部、２……筒体、２ａ，２ｂ……筒体の端部、
３ａ，３ｂ……端面。
の斜視図、第２図は同キヤピラリーの断面図、第
３図は従来のキヤピラリーの説明図である。 １……金属細線、１ａ，１ｂ……金属細線の開
口部、２……筒体、２ａ，２ｂ……筒体の端部、
３ａ，３ｂ……端面。
Claims (1)
- 細線挿通孔を形成した筒状の両端部をそれぞれ
テーパ状に形成し、且つ端面の内周縁及び外周縁
を面取りしたことを特徴とするキヤピラリー。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063399U JPH032641U (ja) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063399U JPH032641U (ja) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032641U true JPH032641U (ja) | 1991-01-11 |
Family
ID=31593411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989063399U Pending JPH032641U (ja) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032641U (ja) |
-
1989
- 1989-05-30 JP JP1989063399U patent/JPH032641U/ja active Pending