JPH01165637U - - Google Patents
Info
- Publication number
- JPH01165637U JPH01165637U JP1988061806U JP6180688U JPH01165637U JP H01165637 U JPH01165637 U JP H01165637U JP 1988061806 U JP1988061806 U JP 1988061806U JP 6180688 U JP6180688 U JP 6180688U JP H01165637 U JPH01165637 U JP H01165637U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- bare chip
- circuit board
- bonding pad
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061806U JPH01165637U (enExample) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061806U JPH01165637U (enExample) | 1988-05-10 | 1988-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165637U true JPH01165637U (enExample) | 1989-11-20 |
Family
ID=31287451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988061806U Pending JPH01165637U (enExample) | 1988-05-10 | 1988-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165637U (enExample) |
-
1988
- 1988-05-10 JP JP1988061806U patent/JPH01165637U/ja active Pending