JPH01165636U - - Google Patents

Info

Publication number
JPH01165636U
JPH01165636U JP6188288U JP6188288U JPH01165636U JP H01165636 U JPH01165636 U JP H01165636U JP 6188288 U JP6188288 U JP 6188288U JP 6188288 U JP6188288 U JP 6188288U JP H01165636 U JPH01165636 U JP H01165636U
Authority
JP
Japan
Prior art keywords
mold
groove
width
parting surface
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6188288U
Other languages
English (en)
Japanese (ja)
Other versions
JP2526001Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988061882U priority Critical patent/JP2526001Y2/ja
Publication of JPH01165636U publication Critical patent/JPH01165636U/ja
Application granted granted Critical
Publication of JP2526001Y2 publication Critical patent/JP2526001Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1988061882U 1988-05-10 1988-05-10 半導体部品のモールド成形装置 Expired - Lifetime JP2526001Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988061882U JP2526001Y2 (ja) 1988-05-10 1988-05-10 半導体部品のモールド成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988061882U JP2526001Y2 (ja) 1988-05-10 1988-05-10 半導体部品のモールド成形装置

Publications (2)

Publication Number Publication Date
JPH01165636U true JPH01165636U (US07494231-20090224-C00006.png) 1989-11-20
JP2526001Y2 JP2526001Y2 (ja) 1997-02-12

Family

ID=31287527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988061882U Expired - Lifetime JP2526001Y2 (ja) 1988-05-10 1988-05-10 半導体部品のモールド成形装置

Country Status (1)

Country Link
JP (1) JP2526001Y2 (US07494231-20090224-C00006.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55149952U (US07494231-20090224-C00006.png) * 1979-04-12 1980-10-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55149952U (US07494231-20090224-C00006.png) * 1979-04-12 1980-10-29

Also Published As

Publication number Publication date
JP2526001Y2 (ja) 1997-02-12

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