JPH01165618U - - Google Patents
Info
- Publication number
- JPH01165618U JPH01165618U JP6202888U JP6202888U JPH01165618U JP H01165618 U JPH01165618 U JP H01165618U JP 6202888 U JP6202888 U JP 6202888U JP 6202888 U JP6202888 U JP 6202888U JP H01165618 U JPH01165618 U JP H01165618U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- capacitor element
- element body
- elastic
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の実施例の図で、ａは斜視図、
ｂは側断面図、第２図は従来例の図で、ａは斜視
図、ｂは側断面図である。
図において、１はプリント板、２はスルーホー
ル、５はコンデンサ素子本体、６は外部電極、１
０，２０はリード端子、２１は端子本体、２１ａ
は挟持片、２２はピン部をそれぞれ示す。
Figure 1 is a diagram of an embodiment of the present invention, where a is a perspective view;
b is a side sectional view, FIG. 2 is a diagram of a conventional example, a is a perspective view, and b is a side sectional view. In the figure, 1 is a printed board, 2 is a through hole, 5 is a capacitor element body, 6 is an external electrode, 1
0, 20 are lead terminals, 21 is the terminal body, 21a
2 indicates a holding piece, and 22 indicates a pin portion.
Claims (1)
片２１ａが、コンデンサ素子本体５の外部電極の
上下面部分に弾接した状態で、該コンデンサ素子
本体５に半田付け固着される側面視がコ形の端子
本体２１と、 下側の該挟持片２１ａの側縁に上端が連結して
形成された、下先端がプリント板１のスルーホー
ル２に挿入半田付けされるピン部２２とを有する
、弾性ある良導電性金属板よりなるリード端子２
０が、 該コンデンサ素子本体５に半田付け装着された
ことを特徴とする積層セラミツクコンデンサ。[Claims for Utility Model Registration] A pair of clamping pieces 21a with upper and lower side edges bent inward are in elastic contact with the upper and lower surfaces of the external electrodes of the capacitor element body 5. A terminal main body 21 having a U-shape in side view is fixed by soldering, and a lower tip formed by connecting the upper end to the side edge of the lower holding piece 21a is inserted into the through hole 2 of the printed board 1 and soldered. A lead terminal 2 made of an elastic and highly conductive metal plate having a pin portion 22
0 is attached to the capacitor element body 5 by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6202888U JPH01165618U (en) | 1988-05-11 | 1988-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6202888U JPH01165618U (en) | 1988-05-11 | 1988-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165618U true JPH01165618U (en) | 1989-11-20 |
Family
ID=31287664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6202888U Pending JPH01165618U (en) | 1988-05-11 | 1988-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165618U (en) |
-
1988
- 1988-05-11 JP JP6202888U patent/JPH01165618U/ja active Pending
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