JPH01164544A - Abrasive grain working method - Google Patents
Abrasive grain working methodInfo
- Publication number
- JPH01164544A JPH01164544A JP31755387A JP31755387A JPH01164544A JP H01164544 A JPH01164544 A JP H01164544A JP 31755387 A JP31755387 A JP 31755387A JP 31755387 A JP31755387 A JP 31755387A JP H01164544 A JPH01164544 A JP H01164544A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- workpiece
- tool
- supersonic wave
- blind hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title description 6
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 4
- 239000004945 silicone rubber Substances 0.000 claims abstract description 4
- 239000000945 filler Substances 0.000 claims description 19
- 238000003672 processing method Methods 0.000 claims description 12
- 239000004927 clay Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 229910003460 diamond Inorganic materials 0.000 abstract description 2
- 239000010432 diamond Substances 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 15
- 239000012530 fluid Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
- B23Q5/22—Feeding members carrying tools or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は、超音波振動を用いた砥粒加工方法に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to an abrasive processing method using ultrasonic vibration.
（従来の技術）
従来、超音波振動を利用した加工法として、超音波加工
法が知られている。この加工法の原理は、両振幅１０〜
１５０μｍ、周波数１５〜３０ＫＨｚで振動する工具が
、砥粒と水の混合物（スラリ、 ５ｌｕｒｒｙ）若しく
は固定砥粒の存在のもとに、加工物と一定の静圧で接触
し、超音波用工具先端が砥粒を介して加工物を衝撃して
、これを微細に破砕していくものである。(Prior Art) Ultrasonic machining is conventionally known as a machining method that utilizes ultrasonic vibrations. The principle of this processing method is that both amplitudes are 10~
A tool that vibrates at 150 μm and a frequency of 15 to 30 KHz comes into contact with the workpiece under constant static pressure in the presence of a mixture of abrasive grains and water (slurry, 5lurry) or fixed abrasive grains, and the tip of the ultrasonic tool Impacts the workpiece through abrasive grains, breaking it into fine pieces.
しかるに、このような超音波加工法は、超音波エネルギ
ーの反作用として、遊離砥粒若しくは固定砥粒に必要以
上のエネルギーが付加され、砥粒の寿命が短い欠点をも
っている。さらに、砥粒がホーンの先端部に装着された
超音波用工具の減耗を著しく促進させることも欠点とな
っている。However, such an ultrasonic machining method has the drawback that as a reaction to the ultrasonic energy, more energy than necessary is added to the free abrasive grains or fixed abrasive grains, and the life of the abrasive grains is short. Another disadvantage is that the abrasive grains significantly accelerate the wear of the ultrasonic tool attached to the tip of the horn.
（発明が解決しようとする問題点）
本発明は、上述した超音波加工の欠点を勘案してなされ
たもので、砥粒及び超音波工具の過度の減耗を緩和する
ことのできる砥粒加工方法を提供することを目的とする
。(Problems to be Solved by the Invention) The present invention has been made in consideration of the above-mentioned drawbacks of ultrasonic processing, and is an abrasive processing method that can alleviate excessive wear and tear of abrasive grains and ultrasonic tools. The purpose is to provide
（問題点を解決するための手段と作用）被加工物と超音
波工具との間に遊離砥粒を介在させ、超音波用工具を介
して超音波を遊離砥粒に印加する砥粒加工方法において
、砥粒を流動性を有する充填剤内に分散させるもので、
被加工面形状に倣って充填剤が流動し、砥粒を被加工面
に沿って均一に当接させることができるので、複雑な形
状の被加工物であっても精度のよい加工を行うことがで
きる。(Means and effects for solving the problem) An abrasive processing method in which free abrasive grains are interposed between the workpiece and an ultrasonic tool, and ultrasonic waves are applied to the free abrasive grains via the ultrasonic tool. In this method, abrasive grains are dispersed in a fluid filler,
The filler flows following the shape of the workpiece surface, allowing the abrasive grains to come into uniform contact with the workpiece surface, allowing highly accurate machining of workpieces with complex shapes. Can be done.
（実施例） 以下、本発明の一実施例を図面を参照して詳述する。(Example) Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図は、この実施例の砥粒加工方法に用いられる超音
波加工装置を示している。この装置は、被加工物（１）
を保持する被加工物保持部（２）と、被加工物（１）に
あらかじめ凹設されている盲孔（３）の内面研磨を行う
工具（４）と、この工具（４）が下端部に連結されたエ
クスポネンシャル形の超音波ホーン（５）と、この超音
波ホーン（５）に超音波を印加する超音波発振器（６）
と、超音波ホーン（５）を支持するヘッド（５ａ）と、
工具（４）に対して被加工物保持部（２）に保持されて
いる被加工物（１）を油圧を利用して押し付ける加圧部
（７）と、この加圧部（力を保持して矢印（８）方向に
回転駆動する被加工物回転部（９）とから構成されてい
る。しかして、被加工物保持部（２）は、容器状のもの
であって、その底部に被加工物が盲孔（２）を上にして
固着されるようになっている。また、この被加工物保持
部（２）は、加圧部（力の一方のシリンダ顛に支持され
、他方のシリンダ（１１）に載設された重シαつの重さ
Ｋよシ、連通管の原理によシ矢印α■方向に一定の圧力
で加圧されるようになっている。FIG. 1 shows an ultrasonic machining device used in the abrasive grain machining method of this embodiment. This device is used for processing workpiece (1)
a workpiece holder (2) that holds the workpiece, a tool (4) for polishing the inner surface of a blind hole (3) pre-drilled in the workpiece (1), and a tool (4) that an exponential type ultrasonic horn (5) connected to the ultrasonic horn (5), and an ultrasonic oscillator (6) that applies ultrasonic waves to the ultrasonic horn (5).
and a head (5a) that supports the ultrasonic horn (5).
A pressurizing part (7) that uses hydraulic pressure to press the workpiece (1) held in the workpiece holding part (2) against the tool (4), and a pressurizing part (that holds the force). and a workpiece rotating part (9) which is rotated in the direction of arrow (8).The workpiece holding part (2) is shaped like a container, and the bottom of The workpiece is fixed with the blind hole (2) facing upward.This workpiece holding part (2) is supported by the pressure part (one cylinder arm of the force) and the other The weight K of the heavy cylinder (11) mounted on the cylinder (11) is pressurized at a constant pressure in the direction of the arrow α■ according to the principle of a communicating tube.
また、被加工物回転部（９）は、加圧部（力を保持する
円盤状のテーブルα９と、このテーブルを回転軸α荀を
介して矢印（８）方向に回転させるモータ（１９とから
なっている。一方、超音波発振器（６）は、周波数１５
〜３０ ＫＨｚで、工具（４）を超音波ホーン（５）を
介して両振幅１０〜１５０μｍで加振するようになって
いる。The workpiece rotating section (9) also includes a pressurizing section (a disk-shaped table α9 that holds force) and a motor (19) that rotates this table in the direction of the arrow (8) via a rotation axis α. On the other hand, the ultrasonic oscillator (6) has a frequency of 15
~30 KHz, and the tool (4) is vibrated via an ultrasonic horn (5) with both amplitudes of 10 to 150 μm.
つぎに、上記構成の超音波加工装置を用いたこの実施例
の砥粒加工方法について述べる。Next, the abrasive processing method of this embodiment using the ultrasonic processing apparatus having the above configuration will be described.
まず、被加工物保持部（２）に被加工物（１）を保持さ
せる。ついで、盲孔（３）内壁に、粉材砥粒αｅ・・・
を分散状態で含有する流動性を有する充填剤（１７）を
塗着する（第２図参照）。このとき、砥粒αＱ・・・と
じては、例えばメツシュサイズが＃４００〜＃８００の
ダイヤモンド砥粒又はＣＢＮ砥粒を用いる。また、充填
剤αηとしては粘弾性体であるシリコーンゴムを用いる
。つぎに、ヘッド（５ａ）の位置調節によシ工具（４）
を盲孔（３）中に嵌入させる。そして、重シαりによシ
シリンダ０１．αυを介して、被加工物（１）を工具（
４）に対し一定圧で押圧させる。つづいて、テーブル（
Ｉ養をモータα９により矢印（８）方向に回転させる。First, the workpiece (1) is held by the workpiece holding section (2). Then, on the inner wall of the blind hole (3), powder abrasive grains αe...
A fluid filler (17) containing a dispersed state of filler (17) is applied (see FIG. 2). At this time, as the abrasive grains αQ, for example, diamond abrasive grains or CBN abrasive grains with a mesh size of #400 to #800 are used. Furthermore, silicone rubber, which is a viscoelastic material, is used as the filler αη. Next, use the tool (4) to adjust the position of the head (5a).
into the blind hole (3). Then, cylinder 01. The workpiece (1) is connected to the tool (
4) Press with a constant pressure. Next, the table (
The motor is rotated in the direction of arrow (8) by motor α9.
そして、超音波発振器によシ、周波数１５〜３０ ＫＨ
ｚの超音波を超音波ホーン（５）を介して工具（４）に
印加する。すると、工具は、矢印α樽方向に両振幅１０
〜１５０μｍで振動し、この振動は、充填剤αηに伝わ
る。その結果、充填剤αηに保持された砥粒（ＩＦ５・
・・は加圧され、被加工物（１）の盲孔（３）の内壁面
に衝突して、衝突時の衝撃力によシ内壁面を除去加工す
る（第２図参照）。すなわち、盲孔（３）内壁面は、所
望の表面粗さにラッピング加工される。Then, use an ultrasonic oscillator, frequency 15-30 KH.
Ultrasonic waves of z are applied to the tool (4) via the ultrasonic horn (5). Then, the tool moves in the direction of the arrow α barrel with both amplitudes of 10
It vibrates at ~150 μm, and this vibration is transmitted to the filler αη. As a result, the abrasive grains (IF5・
... is pressurized and collides with the inner wall surface of the blind hole (3) of the workpiece (1), and the inner wall surface is removed by the impact force at the time of collision (see Fig. 2). That is, the inner wall surface of the blind hole (3) is lapped to a desired surface roughness.
以上のように、この実施例の砥粒加工方法は、充填剤α
ηに分散された砥粒α＠・・・によシ研磨加工を行うよ
うにしているので、以下のような利点をもりている。As described above, the abrasive grain processing method of this example uses the filler α
Since the polishing process is performed using abrasive grains α@... dispersed in η, it has the following advantages.
■砥粒が充填剤に分散されているので、充填剤が被加工
面形状に倣って変形することができる結果、複雑な形状
の被加工面でも、砥粒を均一に当接させることができ、
加工のフレキシビリティおよび加工精度が向上する。■Since the abrasive grains are dispersed in the filler, the filler can deform to follow the shape of the workpiece surface, allowing the abrasive grains to come into uniform contact with the workpiece surface even if it has a complex shape. ,
Processing flexibility and processing accuracy are improved.
■従来、砥粒供給に不可欠であった加工液としてのスラ
リか不要となるので、それだけ装置が簡単化する。- Slurry as a machining fluid, which was previously essential for supplying abrasive grains, is no longer required, which simplifies the equipment.
■切れ刃となる砥粒の供給が安定化し、かつ、砥粒に対
する加工エネルギーの供給効率が良くなることによシ、
被加工物の除去能率が向上する。■By stabilizing the supply of abrasive grains that form the cutting edge and improving the efficiency of supplying machining energy to the abrasive grains,
The removal efficiency of the workpiece is improved.
■砥粒が充填剤によυ保持されているので、砥粒寿命が
長くなシ、荒加工から仕上げ加工まで一貫使用が可能と
なる。なおかつ、充填剤がクブシ璽ンの役目をするので
、工具損耗が少なくなる。■Since the abrasive grains are retained by the filler, the life of the abrasive grains is long and can be used consistently from rough machining to finishing machining. Furthermore, since the filler acts as a sealant, tool wear and tear is reduced.
なお、本発明は、上記実施例のように、ラッピングに限
ることなく、スライシング、型彫夛、穿孔等にも適用で
きる。また、砥粒を保持するメディアトシては、シリコ
ーンゴムの他に、可塑性を有する紙粘度、土粘度でもよ
い。Note that the present invention is not limited to wrapping as in the above embodiments, but can also be applied to slicing, die engraving, perforation, and the like. In addition to silicone rubber, the media for holding the abrasive grains may be made of paper viscosity or earth viscosity having plasticity.
本発明の砥粒加工方法は、以下のような顕著な効果を奏
し、ファインセラミックスをはじめとする硬脆材料、難
加工材料の加工にとくに有効である。The abrasive grain processing method of the present invention has the following remarkable effects and is particularly effective in processing hard and brittle materials such as fine ceramics and difficult-to-process materials.
■砥粒が流動性を有する充填剤に分散されているので、
充填剤が被加工面形状に倣って流動することができる結
果、複雑な形状の被加工面でも砥粒を被加工面に沿って
ほぼ均一に当接させることができ、被加工物の形状に制
約されることがなくなシ、加工のフレキシビリティおよ
び加工精度が向上する。■Since the abrasive grains are dispersed in a fluid filler,
As a result of the filler being able to flow following the shape of the workpiece surface, the abrasive grains can be brought into contact with the workpiece almost uniformly along the workpiece surface even if the workpiece has a complex shape, and the shape of the workpiece can be adjusted. There are no restrictions, and processing flexibility and processing accuracy are improved.
■従来、砥粒供給に不可欠であった加工液が不要と々る
ので、それだけ、装置が簡単化する。■The machining fluid, which was conventionally indispensable for supplying abrasive grains, is no longer required, which simplifies the equipment.
■切れ刃となる砥粒の供給が安定化し、かつ、砥粒く対
する加工エネルギーの供給効率が良くなることによシ、
被加工物の除去能率が向上する。■By stabilizing the supply of abrasive grains that form the cutting edge and improving the efficiency of supplying machining energy to the abrasive grains,
The removal efficiency of the workpiece is improved.
■砥粒が、流動性を有する充填剤に安定して分散保持さ
れているので、砥粒寿命が長くなシ、荒加工から仕上げ
加工まで一貫使用が可能となる。■Since the abrasive grains are stably dispersed and held in a fluid filler, the abrasive grains have a long life and can be used consistently from rough machining to finishing machining.
また、充填剤がクツションとなるので工具の極度の損耗
を防止できる。In addition, the filler acts as a cushion, which prevents excessive wear and tear on the tool.
第１図は本発明の一実施例の砥粒加工方法に用いられる
超音波加工装置の構成図、第２図は同じく砥粒加工の説
明図である。
（１）：被加工物。
（４）：工 具。
αｅ：砥 粒。
α７） ：充填剤。
代理人 弁理士 則 近 憲 佑
同 松山光之
第１図
第２図FIG. 1 is a block diagram of an ultrasonic machining device used in an abrasive processing method according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of the abrasive processing. (1): Workpiece. (4): Tools. αe: Abrasive grain. α7): Filler. Agent Patent Attorney Noriyuki Chika Yudo Mitsuyuki Matsuyama Figure 1 Figure 2
Claims (3)
せ上記超音波工具を介して超音波を上記遊離砥粒に印加
することにより上記被加工物を加工する砥粒加工方法に
おいて、上記遊離砥粒は流動性を有する充填剤内に分散
されていることを特徴とする砥粒加工方法。(1) An abrasive processing method for processing the workpiece by interposing free abrasive grains between the workpiece and an ultrasonic tool and applying ultrasonic waves to the free abrasive grains via the ultrasonic tool. An abrasive grain processing method characterized in that the free abrasive grains are dispersed in a filler having fluidity.
特許請求の範囲第１項記載の砥粒加工方法。(2) The abrasive grain processing method according to claim 1, wherein the filler is silicone rubber.
範囲第１項記載の砥粒加工方法。(3) The abrasive processing method according to claim 1, wherein the filler is clay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31755387A JPH01164544A (en) | 1987-12-17 | 1987-12-17 | Abrasive grain working method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31755387A JPH01164544A (en) | 1987-12-17 | 1987-12-17 | Abrasive grain working method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01164544A true JPH01164544A (en) | 1989-06-28 |
Family
ID=18089540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31755387A Pending JPH01164544A (en) | 1987-12-17 | 1987-12-17 | Abrasive grain working method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01164544A (en) |
-
1987
- 1987-12-17 JP JP31755387A patent/JPH01164544A/en active Pending
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