JPH01163343U - - Google Patents
Info
- Publication number
- JPH01163343U JPH01163343U JP5901888U JP5901888U JPH01163343U JP H01163343 U JPH01163343 U JP H01163343U JP 5901888 U JP5901888 U JP 5901888U JP 5901888 U JP5901888 U JP 5901888U JP H01163343 U JPH01163343 U JP H01163343U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- tip
- electrical component
- lead
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5901888U JPH01163343U (nl) | 1988-04-30 | 1988-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5901888U JPH01163343U (nl) | 1988-04-30 | 1988-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01163343U true JPH01163343U (nl) | 1989-11-14 |
Family
ID=31284805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5901888U Pending JPH01163343U (nl) | 1988-04-30 | 1988-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01163343U (nl) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020050325A1 (ja) * | 2018-09-06 | 2020-03-12 | 三菱電機株式会社 | パワー半導体装置およびその製造方法、ならびに電力変換装置 |
JP2021114513A (ja) * | 2020-01-17 | 2021-08-05 | 富士電機株式会社 | 多層基板回路構造 |
-
1988
- 1988-04-30 JP JP5901888U patent/JPH01163343U/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020050325A1 (ja) * | 2018-09-06 | 2020-03-12 | 三菱電機株式会社 | パワー半導体装置およびその製造方法、ならびに電力変換装置 |
CN112655087A (zh) * | 2018-09-06 | 2021-04-13 | 三菱电机株式会社 | 功率半导体装置及其制造方法以及电力变换装置 |
JPWO2020050325A1 (ja) * | 2018-09-06 | 2021-08-30 | 三菱電機株式会社 | パワー半導体装置およびその製造方法、ならびに電力変換装置 |
US11631623B2 (en) | 2018-09-06 | 2023-04-18 | Mitsubishi Electric Corporation | Power semiconductor device and method of manufacturing the same, and power conversion device |
CN112655087B (zh) * | 2018-09-06 | 2024-08-13 | 三菱电机株式会社 | 功率半导体装置及其制造方法以及电力变换装置 |
JP2021114513A (ja) * | 2020-01-17 | 2021-08-05 | 富士電機株式会社 | 多層基板回路構造 |