JPH01163342U - - Google Patents

Info

Publication number
JPH01163342U
JPH01163342U JP5979788U JP5979788U JPH01163342U JP H01163342 U JPH01163342 U JP H01163342U JP 5979788 U JP5979788 U JP 5979788U JP 5979788 U JP5979788 U JP 5979788U JP H01163342 U JPH01163342 U JP H01163342U
Authority
JP
Japan
Prior art keywords
connecting strip
support plate
external leads
width
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5979788U
Other languages
Japanese (ja)
Other versions
JPH0642347Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5979788U priority Critical patent/JPH0642347Y2/en
Publication of JPH01163342U publication Critical patent/JPH01163342U/ja
Application granted granted Critical
Publication of JPH0642347Y2 publication Critical patent/JPH0642347Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第一実施例を示すリードフレ
ームの平面図、第2図は第1図に示す第一実施例
を変形した実施例を示すリードフレームの平面図
、第3図は本考案の第二実施例を示すリードフレ
ームの平面図、第4図は従来のリードフレームの
平面図を示す。 2……支持板、3……外部リード、21……リ
ードフレーム、22……第1の連結細条、23…
…第2の連結細条、24……幅狭部、25……幅
広部。
FIG. 1 is a plan view of a lead frame showing a first embodiment of the present invention, FIG. 2 is a plan view of a lead frame showing a modification of the first embodiment shown in FIG. A plan view of a lead frame showing a second embodiment of the invention, and FIG. 4 shows a plan view of a conventional lead frame. 2... Support plate, 3... External lead, 21... Lead frame, 22... First connecting strip, 23...
...Second connecting strip, 24...Narrow portion, 25...Wide portion.

Claims (1)

【実用新案登録請求の範囲】 (1) 支持板と、該支持板の一方の側及びこれに
対向する他方の側のそれぞれに配置された複数本
の外部リードと、前記支持板に近い側において前
記複数本の外部リードを並行に連結する第1の連
結細条と、前記支持板から遠い側において前記複
数本の外部リードを並行に連結する第2の連結細
条とを有するリードフレームにおいて、前記第1
の連結細条と前記第2の連結細条はいずれも幅長
が大となる幅広部と幅長が小となる幅狭部とを有
しており、前記第1の連結細条及び前記第2の連
結細条に設けられた前記幅広部と前記幅狭部はそ
れぞれ前記第1の連結細条及び前記第2の連結細
条の延在する方向に交互に配置されていることを
特徴とするリードフレーム。 (2) 複数個の支持板と、該支持板の一方の側及
びこれに対応する他方の側のそれぞれに配置され
た複数本の外部リードと、前記支持板に近い側に
おいて前記複数本の外部リードを並行に連結する
第1の連結細条と、前記支持板に遠い側において
前記複数本の外部リードを並行に連結する第2の
連結細条を有するリードフレームにおいて、前記
複数個の支持板は前記リードフレームの長手方向
に配置されており、前記複数本の外部リードは前
記長手方向に延在しており、前記第1の連結細条
と前記第2の連結細条はそれぞれ幅長が小となる
幅狭部と幅長が大となる幅広部とを有しており、
前記第1の連結細条は、前記リードフレームの短
手方向のほぼ中心近傍を通り前記長手方向に延在
する仮想線のいずれか一方の側の領域で前記幅狭
部となつており、前記仮想線の前記いずれか一方
の側とは反対の側の領域で前記幅広部となつてお
り、前記第1の連結細条の幅狭部に連結された前
記外部リードは前記第2の連結細条の幅広部に連
結され、前記第1の連結細条の幅広部に連結され
た前記外部リードは前記第2の幅狭部に連結され
ていることを特徴とするリードーム。
[Claims for Utility Model Registration] (1) A support plate, a plurality of external leads disposed on one side of the support plate and the other side opposite thereto, and a plurality of external leads disposed on the side near the support plate. A lead frame having a first connecting strip that connects the plurality of external leads in parallel, and a second connecting strip that connects the plurality of external leads in parallel on a side far from the support plate, Said first
Both the connecting strip and the second connecting strip have a wide part where the width is large and a narrow part where the width is small. The wide portions and the narrow portions provided in the second connecting strips are arranged alternately in the extending direction of the first connecting strip and the second connecting strip, respectively. lead frame. (2) a plurality of support plates, a plurality of external leads disposed on one side of the support plate and the corresponding other side, and a plurality of external leads disposed on the side near the support plate; In a lead frame having a first connecting strip that connects the leads in parallel, and a second connecting strip that connects the plurality of external leads in parallel on a side far from the support plate, the plurality of support plates are arranged in the longitudinal direction of the lead frame, the plurality of external leads extend in the longitudinal direction, and the first connecting strip and the second connecting strip each have a width. It has a narrow part where the width is small and a wide part where the width is large,
The first connecting strip is the narrow portion in a region on either side of an imaginary line passing substantially near the center of the lead frame in the lateral direction and extending in the longitudinal direction, and The wide portion is in a region opposite to the one side of the imaginary line, and the external lead connected to the narrow portion of the first connecting strip is connected to the second connecting strip. The lead dome is characterized in that the external lead connected to the wide portion of the strip and the wide portion of the first connecting strip is connected to the second narrow portion.
JP5979788U 1988-05-07 1988-05-07 Lead frame Expired - Lifetime JPH0642347Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5979788U JPH0642347Y2 (en) 1988-05-07 1988-05-07 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5979788U JPH0642347Y2 (en) 1988-05-07 1988-05-07 Lead frame

Publications (2)

Publication Number Publication Date
JPH01163342U true JPH01163342U (en) 1989-11-14
JPH0642347Y2 JPH0642347Y2 (en) 1994-11-02

Family

ID=31285537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5979788U Expired - Lifetime JPH0642347Y2 (en) 1988-05-07 1988-05-07 Lead frame

Country Status (1)

Country Link
JP (1) JPH0642347Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149885A (en) * 2012-01-23 2013-08-01 Dainippon Printing Co Ltd Lead frame for manufacturing semiconductor device and method of manufacturing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149885A (en) * 2012-01-23 2013-08-01 Dainippon Printing Co Ltd Lead frame for manufacturing semiconductor device and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPH0642347Y2 (en) 1994-11-02

Similar Documents

Publication Publication Date Title
JPS6046636U (en) multi-pole relay
JPH01163342U (en)
JPS6153852U (en)
JPS6190785U (en)
JPS60140502U (en) cold permanent tools
JPH01160855U (en)
JPS60138453U (en) Top board
JPS6371591U (en)
JPS6294218U (en)
JPS633922U (en)
JPH01100496U (en)
JPS59121030U (en) drainage canal
JPS6331539U (en)
JPS6155998U (en)
JPS648742U (en)
JPS6289153U (en)
JPS60173265U (en) Slatted structure
JPS61109172U (en)
JPS6190129U (en)
JPS60144633U (en) Ridge cover
JPS5884714U (en) board watch band
JPS6157799U (en)
JPS6176009U (en)
JPS6388916U (en)
JPH0236893U (en)