JPH01162284U - - Google Patents
Info
- Publication number
- JPH01162284U JPH01162284U JP5428888U JP5428888U JPH01162284U JP H01162284 U JPH01162284 U JP H01162284U JP 5428888 U JP5428888 U JP 5428888U JP 5428888 U JP5428888 U JP 5428888U JP H01162284 U JPH01162284 U JP H01162284U
- Authority
- JP
- Japan
- Prior art keywords
- display plate
- case
- resin
- electronic device
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図はこの考案に係る電子機器の断面図、第
２図ａ，ｂはこの考案に係る電子機器の解析作業
を示す断面図、第３図は表示プレートの一例を示
す正面図である。
１……ケース、２……センサ部、５……電子回
路基板、６……電池、７……エポキシ樹脂、８…
…表示プレート、９……バツフアコート樹脂。
FIG. 1 is a sectional view of an electronic device according to this invention, FIGS. 2a and 2b are sectional views showing analysis work for the electronic device according to this invention, and FIG. 3 is a front view showing an example of a display plate. DESCRIPTION OF SYMBOLS 1... Case, 2... Sensor section, 5... Electronic circuit board, 6... Battery, 7... Epoxy resin, 8...
...display plate, 9...buffer coat resin.
補正 昭６３．７．２１
図面の簡単な説明を次のように補正する。
明細書第９頁第１５行目「例を示す正面図であ
る。」との記載を、「例を示す正面図、第４図は
本考案の他の実施例を示す断面図である。」と訂
正する。Amendment July 21, 1981 The brief description of the drawing is amended as follows. On page 9, line 15 of the specification, the statement ``This is a front view showing an example.'' was replaced with ``A front view showing an example, and FIG. 4 is a sectional view showing another embodiment of the present invention.'' I am corrected.
Claims (1)
子部品が実装された電子回路基板等をケース内に
有するとともに上記ケース内が透明なエポキシ樹
脂により樹脂モールドされてなる電子機器におい
て、 機器の型式、使用上の注意、警告等の文字ある
いはマークを表示プレート上に記載するとともに
、この表示プレートを上記透明モールド樹脂中に
封入したことを特徴とする電子機器。[Scope of Claim for Utility Model Registration] An electronic device that has a sensor part that responds to external signals and an electronic circuit board on which various electronic components are mounted inside a case, and the inside of the case is resin-molded with transparent epoxy resin. An electronic device characterized in that characters or marks such as the model of the device, precautions for use, warnings, etc. are written on a display plate, and the display plate is encapsulated in the transparent mold resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5428888U JPH01162284U (en) | 1988-04-22 | 1988-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5428888U JPH01162284U (en) | 1988-04-22 | 1988-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162284U true JPH01162284U (en) | 1989-11-10 |
Family
ID=31280225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5428888U Pending JPH01162284U (en) | 1988-04-22 | 1988-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162284U (en) |
-
1988
- 1988-04-22 JP JP5428888U patent/JPH01162284U/ja active Pending
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