JPH01161335U - - Google Patents
Info
- Publication number
- JPH01161335U JPH01161335U JP5669088U JP5669088U JPH01161335U JP H01161335 U JPH01161335 U JP H01161335U JP 5669088 U JP5669088 U JP 5669088U JP 5669088 U JP5669088 U JP 5669088U JP H01161335 U JPH01161335 U JP H01161335U
- Authority
- JP
- Japan
- Prior art keywords
- cover
- semiconductor device
- hermetically sealed
- sealed semiconductor
- seal frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5669088U JPH0356057Y2 (https=) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5669088U JPH0356057Y2 (https=) | 1988-04-28 | 1988-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01161335U true JPH01161335U (https=) | 1989-11-09 |
| JPH0356057Y2 JPH0356057Y2 (https=) | 1991-12-16 |
Family
ID=31282561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5669088U Expired JPH0356057Y2 (https=) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356057Y2 (https=) |
-
1988
- 1988-04-28 JP JP5669088U patent/JPH0356057Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356057Y2 (https=) | 1991-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01161335U (https=) | ||
| JPH0384750U (https=) | ||
| JPS62554U (https=) | ||
| JPS59169913U (ja) | 熱可塑性フイルムの封筒状シ−ル構造 | |
| JPS6346373U (https=) | ||
| JPS61202366U (https=) | ||
| JPS6298277U (https=) | ||
| JPS6111562U (ja) | 易開封性蓋材 | |
| JPH0345641U (https=) | ||
| JPS58150842U (ja) | 半導体装置用金属キヤツプ | |
| JPS59147032U (ja) | 液体封入用罐における開口部のシ−ル材 | |
| JPS61196963U (https=) | ||
| JPS58163475U (ja) | 易開封性密封容器 | |
| JPS61183830U (https=) | ||
| JPS6041326U (ja) | 手提口の周囲を熱溶着した、熱溶着性フイルム製の袋 | |
| JPS5829966U (ja) | 包装容器 | |
| JPS63193846U (https=) | ||
| JPS63155642U (https=) | ||
| JPS61140622U (https=) | ||
| JPH02142536U (https=) | ||
| JPS59191352U (ja) | 易開封性容器 | |
| JPS6338786U (https=) | ||
| JPH0267648U (https=) | ||
| JPH01149125U (https=) | ||
| JPS61140538U (https=) |