JPH01160852U - - Google Patents
Info
- Publication number
- JPH01160852U JPH01160852U JP4966588U JP4966588U JPH01160852U JP H01160852 U JPH01160852 U JP H01160852U JP 4966588 U JP4966588 U JP 4966588U JP 4966588 U JP4966588 U JP 4966588U JP H01160852 U JPH01160852 U JP H01160852U
- Authority
- JP
- Japan
- Prior art keywords
- internal lead
- lead
- semiconductor element
- grooves
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１実施例の一部を透視状態
で表した平面図、第２図は本考案の第２実施例を
樹脂容器のキヤツプを外した状態で表した平面図
である。
１〜３…リード端子、１ａ〜３ａ…内部リード
、４…半導体素子ペレツト、５…金属ワイヤ、６
…封止樹脂、７ａ〜７ｄ…溝、１１〜１４…リー
ド端子、１１ａ…内部リード、１５…半導体素子
ペレツト、１６…金属ワイヤ、１７…封止容器、
１８ａ〜１８ｄ…溝。
Fig. 1 is a plan view showing a part of the first embodiment of the present invention in a see-through state, and Fig. 2 is a plan view showing the second embodiment of the present invention with the cap of the resin container removed. . DESCRIPTION OF SYMBOLS 1-3... Lead terminal, 1a-3a... Internal lead, 4... Semiconductor element pellet, 5... Metal wire, 6
... Sealing resin, 7a to 7d... Groove, 11 to 14... Lead terminal, 11a... Internal lead, 15... Semiconductor element pellet, 16... Metal wire, 17... Sealing container,
18a-18d...grooves.
Claims (1)
封止してなる半導体装置において、前記内部リー
ドの表面にロツト識別記号をビツト表示する複数
本の溝又は突条を形成したことを特徴とする半導
体装置。 1. A semiconductor device comprising an internal lead of a lead terminal sealed together with a semiconductor element, characterized in that a plurality of grooves or protrusions for displaying a lot identification symbol in bits are formed on the surface of the internal lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4966588U JPH01160852U (en) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4966588U JPH01160852U (en) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160852U true JPH01160852U (en) | 1989-11-08 |
Family
ID=31275752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4966588U Pending JPH01160852U (en) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160852U (en) |
-
1988
- 1988-04-13 JP JP4966588U patent/JPH01160852U/ja active Pending
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