JPH01160837U - - Google Patents
Info
- Publication number
- JPH01160837U JPH01160837U JP4967488U JP4967488U JPH01160837U JP H01160837 U JPH01160837 U JP H01160837U JP 4967488 U JP4967488 U JP 4967488U JP 4967488 U JP4967488 U JP 4967488U JP H01160837 U JPH01160837 U JP H01160837U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate layer
- insulating film
- chip
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 230000005291 magnetic effect Effects 0.000 claims description 2
- 239000003302 ferromagnetic material Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の一実施例の半導体素子の断面
図、第２図は第１図の半導体素子の特性測定や外
観検査を行う状態を示す断面図、第３図は第１図
の半導体素子をメツキする状態を示す断面図、第
４図は本考案の別な実施例の断面図である。
１…半導体素子、２…サブストレート層、３…
動作層、４…金属電極部、５…絶縁膜、６…磁性
金属層、７…非磁性金属層、８…磁石、９…プロ
ーブ針、１０…メツキ層。
FIG. 1 is a cross-sectional view of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the semiconductor device shown in FIG. FIG. 4 is a cross-sectional view showing a state in which an element is plated, and FIG. 4 is a cross-sectional view of another embodiment of the present invention. 1... Semiconductor element, 2... Substrate layer, 3...
Operating layer, 4...Metal electrode portion, 5...Insulating film, 6...Magnetic metal layer, 7...Nonmagnetic metal layer, 8...Magnet, 9...Probe needle, 10...Plating layer.
Claims (1)
、絶縁膜等を形成したチツプ状の半導体素子にお
いて、前記サブストレート層の裏面に強磁性体か
らなる磁性金属層を形成したことを特徴とする半
導体素子。 A chip-shaped semiconductor element having an active layer, a metal electrode part, an insulating film, etc. formed on the surface of a substrate layer, characterized in that a magnetic metal layer made of a ferromagnetic material is formed on the back surface of the substrate layer. element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4967488U JPH01160837U (en) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4967488U JPH01160837U (en) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160837U true JPH01160837U (en) | 1989-11-08 |
Family
ID=31275761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4967488U Pending JPH01160837U (en) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160837U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63317114A (en) * | 1987-06-19 | 1988-12-26 | 松下電器産業株式会社 | Bread maker |
| JPH02265512A (en) * | 1989-04-07 | 1990-10-30 | Toshiba Corp | Bread making machine |
| JPH06237865A (en) * | 1993-02-19 | 1994-08-30 | Funai Electric Co Ltd | Baking oven |
-
1988
- 1988-04-13 JP JP4967488U patent/JPH01160837U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63317114A (en) * | 1987-06-19 | 1988-12-26 | 松下電器産業株式会社 | Bread maker |
| JPH02265512A (en) * | 1989-04-07 | 1990-10-30 | Toshiba Corp | Bread making machine |
| JPH06237865A (en) * | 1993-02-19 | 1994-08-30 | Funai Electric Co Ltd | Baking oven |