JPH01160013A - Reduction stepper - Google Patents
Reduction stepperInfo
- Publication number
- JPH01160013A JPH01160013A JP62319245A JP31924587A JPH01160013A JP H01160013 A JPH01160013 A JP H01160013A JP 62319245 A JP62319245 A JP 62319245A JP 31924587 A JP31924587 A JP 31924587A JP H01160013 A JPH01160013 A JP H01160013A
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- light
- wafer
- circuit pattern
- foreign particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 230000003287 optical effect Effects 0.000 claims description 14
- 239000002245 particle Substances 0.000 abstract 3
- 239000003990 capacitor Substances 0.000 abstract 1
- 230000035515 penetration Effects 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 230000010076 replication Effects 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造プロセスの中のフォトレジスト塗布
後の目合せ露光工程で使用される縮小投影型露光装置(
以後ステッパと称す)に関するものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a reduction projection exposure apparatus (
(hereinafter referred to as a stepper).
従来、この種のステッパは、水平に設置された半導体基
板(以下、ウェハーという)の真上にレチクルを平行に
配設し、該レチクルに光を真上から入射、透過させ、該
レチクルに形成された回路パターンをウェハーに転写す
る構造のものであった。Conventionally, this type of stepper has a reticle placed in parallel directly above a horizontally placed semiconductor substrate (hereinafter referred to as a wafer), and light is incident on and transmitted from directly above the reticle to form a pattern on the reticle. The structure was such that the printed circuit pattern was transferred onto a wafer.
上述した従来のステッパは、レチクルが水平姿勢に保持
されているので、レチクルへゴミが付着しやすく、また
、レチクルの固定部が縮小レンズの真上にあるため、該
固定部より発生するゴミがレンズのデイスト−ジョンに
悪影響を及ぼすという欠点がある。In the conventional stepper described above, since the reticle is held in a horizontal position, dust easily adheres to the reticle, and since the fixed part of the reticle is located directly above the reduction lens, dust generated from the fixed part is easily collected. This has the disadvantage that it has a negative effect on the distortion of the lens.
本発明の目的は前記問題点を解消した縮小投影型露光装
置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a reduction projection type exposure apparatus that solves the above-mentioned problems.
本発明はレチクルに光を入射、透過させ、該レチクル上
に形成された回路パターンを、水平に設置された半導体
基板に転写する装置において、レチクルを立て掛けて垂
直姿勢に保持するレチクル保持機構と、該レチル保持機
構に垂直姿勢に保持されたレチクルに光を直角に入射さ
せ、その透過光を前記半導体基板に向けて下向きに直角
に屈折させる光学系とを有することを特徴とする縮小投
影型露光装置である。The present invention relates to an apparatus that allows light to enter and pass through a reticle and transfers a circuit pattern formed on the reticle to a horizontally installed semiconductor substrate. Reduction projection type exposure characterized by having an optical system that makes light incident on the reticle held in a vertical position in the reticle holding mechanism at right angles, and refracts the transmitted light downward at right angles toward the semiconductor substrate. It is a device.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第1図において、9はウェハーステージ部であり、該ウ
ェハーステージ部9上にウェハー8が水平に設置され、
その真上に縮小投影レンズ7が設置されている。In FIG. 1, 9 is a wafer stage section, on which the wafer 8 is horizontally installed,
A reduction projection lens 7 is installed directly above it.
本発明は、レチクル5を立て掛けて垂直姿勢に保持する
レチクル保持機構4と、該レチクル保持機構4に垂直姿
勢に保持されたレチクル5に光を直角に入射させ、その
透過光をウェハー8に向けて下向きに直角に屈折させる
光学系りを有する。The present invention includes a reticle holding mechanism 4 that leans a reticle 5 and holds it in a vertical position, and a reticle 5 that is held in a vertical position by the reticle holding mechanism 4. It has an optical system that refracts the light downward at right angles.
前記光学系りは、光を下方に出射するレジスト感光用光
源1と、該光源1からの光を水平方向に直角に屈折させ
て縦置きのレチクル5に直角に入射させる対熱型光学ミ
ラー2と、コンデンサレンズ3と、レチクル5を透過し
た光を下向きに直角に屈折させて縮小投影レンズ7に入
射させる対熱型光学ミラー6とを有する。The optical system includes a resist-sensing light source 1 that emits light downward, and a heat-resistant optical mirror 2 that refracts the light from the light source 1 at right angles to the horizontal direction and makes it enter the vertically placed reticle 5 at right angles. , a condenser lens 3 , and a heat-resistant optical mirror 6 that refracts the light that has passed through the reticle 5 downward at right angles and makes it incident on the reduction projection lens 7 .
一方、前記レチクル保持機構4は、光学系りの光学ミラ
ー2にて反射した光の光軸L□に平行な支持軸16aの
まわりに角回転する基台16と、該基台16上に設置さ
れ光軸L1と直交方向に向けてモータ14により往復駆
動されるY軸ステージ16□と、該Y軸ステージ16□
に設置され上下方向に向けてモータ13により上下駆動
される2軸ステージ162 と、2軸ステージ162上
に光軸L1に対し垂直に立設され前後方向に開閉する対
をなすレチクル保持枠11゜11と、レチクル保持枠1
1の中央部に開口された光の透過窓11aと、保持枠1
1を固定する固定ネジ12と、対をなすレチクル保持枠
11.11間にレチクル5を爪10aにて保持し出し入
れするスライダ10と、レチクル保持枠11のローテー
ションの補正を行うモータ15とを有する。On the other hand, the reticle holding mechanism 4 includes a base 16 that rotates angularly around a support shaft 16a parallel to the optical axis L□ of the light reflected by the optical mirror 2 of the optical system, and a base 16 installed on the base 16. and a Y-axis stage 16□ that is reciprocated by a motor 14 in a direction perpendicular to the optical axis L1, and the Y-axis stage 16□.
A two-axis stage 162 is installed on the two-axis stage 162 and is driven vertically by a motor 13, and a reticle holding frame 11° is a pair of reticle holding frames that are vertically installed on the two-axis stage 162 and open and close in the front and rear directions. 11 and reticle holding frame 1
1 and a light transmission window 11a opened in the center of the holding frame 1.
1, a slider 10 that holds the reticle 5 between the pair of reticle holding frames 11 and 11 with claws 10a and takes it in and out, and a motor 15 that corrects the rotation of the reticle holding frame 11. .
実施例において、対をなすレチクル保持枠11゜11を
前後に開き、その間にスライダ10によりレチクル5を
搬入し、該レチクル5をレチクル保持枠11.1.1に
て垂直姿勢に立て掛けて保持し、該レチクル5に形成さ
れた回路パターン部をレチクル保持枠11の透過窓11
a内に配置し、保持枠11を固定ネジ12により固定す
る。この状態でレチクル5のアライメントを行う。すな
わち、モータ13によりステージ162 を上下方向に
駆動してレチクル5の光軸1.1に対する上下方向の位
置補正を行う。またモータ14によりステージ16.を
左右方向に駆動してレチクル5の光軸り、に対する左右
方向の位置補正を行う。さらにモータ15によりレチク
ル保持枠11を光軸L1のまわりに角回転させてレチク
ル5のローテーションの補正を行う。In the embodiment, the paired reticle holding frames 11.1.1 are opened back and forth, and the reticle 5 is carried in by the slider 10 between them, and the reticle 5 is held in a vertical position by the reticle holding frame 11.1.1. , the circuit pattern portion formed on the reticle 5 is inserted into the transmission window 11 of the reticle holding frame 11.
a, and fix the holding frame 11 with fixing screws 12. In this state, alignment of the reticle 5 is performed. That is, the motor 13 drives the stage 162 in the vertical direction to correct the vertical position of the reticle 5 with respect to the optical axis 1.1. Also, the stage 16 is moved by the motor 14. is driven in the left-right direction to correct the position of the reticle 5 in the left-right direction relative to the optical axis. Further, the rotation of the reticle 5 is corrected by rotating the reticle holding frame 11 around the optical axis L1 by the motor 15.
アライメント終了後、光源1からの光をミラー2にてコ
ンデンサレンズに通して垂直姿勢のレチクル5に直角に
入射させ、レチクル5を透過した光をミラー6により縮
小投影レンズ7に入射させてウェハー8のフォトレジス
ト上に照射し、レチクル5上の回路パターンをウェハー
8上に転写する。After the alignment is completed, the light from the light source 1 is passed through the condenser lens by the mirror 2 and is incident on the reticle 5 in a vertical position at right angles, and the light that has passed through the reticle 5 is made to be incident on the reduction projection lens 7 by the mirror 6 and the wafer 8. The circuit pattern on the reticle 5 is transferred onto the wafer 8.
なお、以上実施例では第1図及び第2図に示した構造を
用いたが、本発明の特徴であるレチクル面をウェハー面
に対して垂直に位置させ、機械的にレチクルを固定する
方式である限り、方法形状の如何は問わないものである
。Although the structure shown in FIGS. 1 and 2 was used in the above embodiments, the reticle surface is positioned perpendicular to the wafer surface and the reticle is mechanically fixed, which is a feature of the present invention. As long as it exists, the shape of the method does not matter.
以上説明したように本発明はレチクルを垂直に立て、か
つレチクルを押さえつける構造により、レチクルへのゴ
ミの付着や、レチクル固定部のゴミ付着によるレンズデ
イスト−ジョンへの影響を防止できる効果がある。As explained above, the present invention has the effect of preventing dust from adhering to the reticle and the influence on lens distortion caused by dust adhering to the reticle fixing part by holding the reticle vertically and pressing the reticle. .
第1図は本発明の一実施例を示す概念図、第2図は第1
図のレチクル保持機構の具体例を示す斜面図である。
1・・・レジスト感光用光源2,6・・・光学ミラー3
・・・コンデンサレンズ 4・・レチクル保持機構5・
・・レチクル 7・・・縮小投影レンズ8・・
ウェハー 10・・・スライダ11・・・レチ
クル保持枠Fig. 1 is a conceptual diagram showing one embodiment of the present invention, and Fig. 2 is a conceptual diagram showing an embodiment of the present invention.
FIG. 3 is a perspective view showing a specific example of the reticle holding mechanism shown in the figure. 1... Light source for resist exposure 2, 6... Optical mirror 3
...Condenser lens 4.Reticle holding mechanism 5.
... Reticle 7 ... Reduction projection lens 8 ...
Wafer 10...Slider 11...Reticle holding frame
Claims (1)
形成された回路パターンを、水平に設置された半導体基
板に転写する装置において、レチクルを立て掛けて垂直
姿勢に保持するレチクル保持機構と、該レチル保持機構
に垂直姿勢に保持されたレチクルに光を直角に入射させ
、その透過光を前記半導体基板に向けて下向きに直角に
屈折させる光学系とを有することを特徴とする縮小投影
型露光装置。(1) A reticle holding mechanism for leaning a reticle and holding it in a vertical position in an apparatus that allows light to enter and pass through a reticle and transfers a circuit pattern formed on the reticle to a horizontally installed semiconductor substrate; Reduction projection type exposure characterized by having an optical system that makes light incident on the reticle held in a vertical position in the reticle holding mechanism at right angles, and refracts the transmitted light downward at right angles toward the semiconductor substrate. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62319245A JP2613901B2 (en) | 1987-12-17 | 1987-12-17 | Reduction projection type exposure equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62319245A JP2613901B2 (en) | 1987-12-17 | 1987-12-17 | Reduction projection type exposure equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01160013A true JPH01160013A (en) | 1989-06-22 |
JP2613901B2 JP2613901B2 (en) | 1997-05-28 |
Family
ID=18108033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62319245A Expired - Lifetime JP2613901B2 (en) | 1987-12-17 | 1987-12-17 | Reduction projection type exposure equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2613901B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7777860B2 (en) | 2005-03-28 | 2010-08-17 | Lg Display Co., Ltd. | Exposure apparatus for flat panel display device and method of exposing using the same |
JP2018026404A (en) * | 2016-08-08 | 2018-02-15 | 株式会社ブイ・テクノロジー | Mask holder |
CN111367039A (en) * | 2016-07-07 | 2020-07-03 | 核心光电有限公司 | Linear ball guided voice coil motor for folded optical devices |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5779619A (en) * | 1980-11-06 | 1982-05-18 | Fujitsu Ltd | Mask cleansing device |
JPS60164325A (en) * | 1984-01-23 | 1985-08-27 | ペルキン・エルメール・センソール・アンシユタルト | Device for projecting and copying mask on semiconductor substrate |
JPS63115213U (en) * | 1987-01-20 | 1988-07-25 | ||
JPS6442812A (en) * | 1987-08-11 | 1989-02-15 | Nec Corp | Production lot number exposure device |
-
1987
- 1987-12-17 JP JP62319245A patent/JP2613901B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5779619A (en) * | 1980-11-06 | 1982-05-18 | Fujitsu Ltd | Mask cleansing device |
JPS60164325A (en) * | 1984-01-23 | 1985-08-27 | ペルキン・エルメール・センソール・アンシユタルト | Device for projecting and copying mask on semiconductor substrate |
JPS63115213U (en) * | 1987-01-20 | 1988-07-25 | ||
JPS6442812A (en) * | 1987-08-11 | 1989-02-15 | Nec Corp | Production lot number exposure device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7777860B2 (en) | 2005-03-28 | 2010-08-17 | Lg Display Co., Ltd. | Exposure apparatus for flat panel display device and method of exposing using the same |
CN111367039A (en) * | 2016-07-07 | 2020-07-03 | 核心光电有限公司 | Linear ball guided voice coil motor for folded optical devices |
JP2018026404A (en) * | 2016-08-08 | 2018-02-15 | 株式会社ブイ・テクノロジー | Mask holder |
KR20190035676A (en) * | 2016-08-08 | 2019-04-03 | 브이 테크놀로지 씨오. 엘티디 | Mask holding device |
Also Published As
Publication number | Publication date |
---|---|
JP2613901B2 (en) | 1997-05-28 |
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