JPH01159198A - Method of cutting multilayer circuit substrate - Google Patents

Abstract

PURPOSE: To produce a reliable and precise multilayer circuit board with efficiency by using a high-frequency sensor, a visual sensor and a second high-frequency sensor by three stages. CONSTITUTION: In cutting a single multilayer board 1 integrating a plurality of pairs of circuit board units into the circuit board units, a high-frequency sensor 4 detects linear or L-shaped guide marks 6 put in position on the internal layer circuit of the multilayer board 1 so that the multilayer board 1 is provided correspondingly with marks 7 of a visible ink or the like. These marks 7 are located for reconfirmation by a visual sensor 8 using reflected light from a CCD camera and a laser. The guide marks 6 are also located for reconfirmation by a separate second high-frequency sensor 9. This two-stage positioning is followed by cutting the multilayer board 1 into the circuit board units to manufacture reliable and precise multilayer circuit boards.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention is used in the manufacture of multilayer circuit boards to accurately detect the position of inner layer circuits using a sensor (hereinafter referred to as a high-frequency sensor) that detects the position from the outside by changes in high-frequency current. The present invention relates to a method of detecting and confirming the position using both a visible sensor and a high-frequency sensor, and then cutting and separating each circuit board.

(Prior art) Conventionally, the method for manufacturing a multilayer circuit board is to form a multilayer board by placing an insulating layer and a metal foil layer on both sides of a board on which several sets of inner layer circuits are formed, and then laminating and forming the multilayer board. The position of the provided guide mark is determined by visual inspection of slight variations in unevenness appearing on the surface of the multilayer substrate, a positioning mark is attached, and then a separately prepared template is placed in alignment with the positioning mark. The necessary locations were marked on the template, and these markings were used as a guide for cutting and separating.

However, in these methods, there is a high risk of double errors occurring in the first step of visually marking the position and the second step of marking by applying a template to the mark. In many cases, these errors are as large as 3 mm at most, resulting in a very unreliable system.

Furthermore, this poses a major hindrance to automation in post-processes.

Various studies have been conducted to make these visual position judgments more efficient and accurate, and methods using soft X-rays are being considered, but these methods require closed systems to use X-rays. However, it has not been widely used because of the disadvantages that it requires a large amount of equipment, is too bulky, and costs a huge amount of money.

In addition, as a method for accurately detecting the position of the guide marks of these inner layer circuits, as shown in Japanese Patent Laid-Open No. 184384/1984, a high frequency current is used to sense the eddy currents generated in the guide marks of the inner layer circuits. A method of detecting position (high frequency sensor) is disclosed.

In this publication, the position is determined using a high frequency sensor, and the shape of the guide mark attached to the inner layer circuit board is a snake's eye shape, and in order to read the position of the guide mark by scanning the high frequency sensor, It is difficult to avoid variations on the order of ±0.025+nn+, and inner layer circuits must be designed taking these variations into consideration.
It was difficult to achieve high density.

Furthermore, since high-frequency sensors are used centrally, even if a mistake occurs due to a mechanical failure, there is a lack of a system to check this, and the system cannot be highly reliable.

Therefore, it has not been possible to efficiently obtain a highly reliable multilayer circuit board using a method of directly cutting and separating the multilayer board into individual units of multilayer circuit boards using a high-frequency sensor.

(Object of the Invention) The present invention is a method for cutting a multilayer board including an inner layer circuit board to create each unit of a multilayer wiring board. A method for efficiently obtaining a highly reliable and highly accurate multilayer circuit board by marking the position of the mark, then reconfirming it with a visible sensor, and then again confirming it with a separately provided high-frequency sensor, and then cutting it into each unit. It is related to.

(Structure of the Invention) The present invention provides a straight line or L
A multilayer board with a letter-shaped guide mark is provided with a detection coil at a certain distance, and a high-frequency current is supplied to the multilayer board to scan the detection coil or the multilayer board. First, the position of the inner layer circuit is detected using a sensor that detects the position by sensing the change in the high frequency current flowing through the detection coil in response to the change in the eddy current generated in the sensor coil. The first step is to mark using ink, etc. The marking position is detected by a COD camera or a sensor that uses reflected laser light, and then the position is confirmed by a separately installed high frequency sensor, It concerns a method of cutting.

By adopting these two-step positioning, it becomes possible to efficiently and industrially produce multilayer circuit boards with high reliability and excellent precision through automatic cutting.

Also, by making the position detection/confirmation process a two-step process, the position can be visually confirmed after marking in the first stage.
The accuracy can be further improved by performing a sampling check.

The present invention will be explained with reference to the steps of manufacturing a multilayer circuit board and drawings.

To produce a multilayer circuit board, first, printed circuits for each circuit are formed from a copper-clad laminate for the inner layer, and at the same time, guide marks (6) are formed at positions where each circuit is to be cut.

The shape of the guide mark is linear (engineering shape) or L-shaped. When scanning a high-frequency sensor or a multilayer board with conventionally used snake-eye guide marks, the sensitivity changes depending on the scanning position, and the guide mark reading error is ±0.025 mm.
That's about it.

On the other hand, if a linear or L-shaped guide mark is detected by a high-frequency sensor, the rise of the change in high-frequency current will appear sharply, and the reading error for these will be ±0.
．． It can be within 0.01 mm.

Next, metal foils are placed on both sides of the substrate on which the inner layer circuit is formed, with an insulating layer interposed therebetween, and laminated and molded to obtain a multilayer substrate (I).

The obtained multilayer substrate (I) is marked by the positioning marking equipment shown in FIG. 1 by using a high frequency sensor (4) to detect the guide mark (6) provided on the inner layer and using visible ink (7).

The marking method uses an inkjet printer (5) or the like that operates in conjunction with a high frequency sensor (4).

In the marking step, a visual check is performed to check whether the marking position is correct.

Multilayer substrate subsequently marked with visible ink (I)
is applied to the cutting equipment shown in FIG. In the equipment shown in Figure 2, the position (7) marked with visible ink is
Read using a CD camera (8). In addition to the CCD camera, a method of reading using a sensor using reflected laser light may also be used.

Furthermore, the position of the guide mark (6) is confirmed again using a separately installed high-frequency sensor (9), and only when it matches the position marked in the first step can the guide mark be advanced a certain distance to the cutting device (I0). By assembling circuits, accurate and highly reliable multilayer circuit boards for each unit can be manufactured efficiently and industrially.

(Effects of the Invention) According to the present invention, since a high-frequency sensor, a visible sensor, and a high-frequency sensor are triple-used, the accuracy is high, mechanization is possible, and mistakes caused by sensor failure can be completely prevented, making it extremely reliable. A multilayer substrate with high properties can be obtained.

In other words, it becomes possible to mechanize, and the template creation process and the manual marking process using the template are no longer necessary, making it possible to greatly streamline the process. Furthermore, the accuracy of cutting and separation positions is increased, and for this reason, the inner layer circuit It becomes possible to make wires thinner and higher in density, and therefore the yield of products can be greatly improved.

(Example) When a 500×1000o+o+ multilayer board having 8 circuit units was marked using the equipment shown in FIG.
The marking accuracy was within ±0.01a+m.

Subsequently, using the cutting equipment shown in FIG. 2, the marked multilayer circuit boards were positioned and confirmed using a CCD camera and a high frequency sensor to obtain eight sets of multilayer circuit boards. The accuracy of the internal circuit of the obtained multilayer circuit board was within ±0.5 mm, and a highly accurate one was obtained with high efficiency.

Furthermore, the accuracy of the internal circuit obtained through the conventional visual positioning, marking, and cutting processes is ±3.
Variations of about 1 degree are unavoidable, resulting in poor product yields and a large number of remanufacturings of multilayer circuit boards.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing positioning and marking equipment. FIG. 2 is a diagram showing the cutting equipment.

Claims (1)

[Claims] In the method of cutting into individual circuit board units from a multilayer board in which many sets of circuit board units are incorporated in one board, (I) the inner layer circuits of the multilayer circuit board are cut by a sensor that detects the position by changes in high frequency current; A step of detecting a straight or L-shaped guide mark provided at a predetermined position and marking it on the surface of the outermost layer of the multilayer circuit board by means such as an inkjet method, (I
I) Next, the position of the mark made on the surface is detected by a visible sensor, and the guide mark of the inner layer circuit is confirmed again by a separately installed sensor that detects the position by changes in high-frequency current, and then each circuit is cut. Method.