JPH01157447U - - Google Patents
Info
- Publication number
- JPH01157447U JPH01157447U JP4733588U JP4733588U JPH01157447U JP H01157447 U JPH01157447 U JP H01157447U JP 4733588 U JP4733588 U JP 4733588U JP 4733588 U JP4733588 U JP 4733588U JP H01157447 U JPH01157447 U JP H01157447U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- chip case
- external input
- output pin
- end portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4733588U JPH01157447U (enExample) | 1988-04-08 | 1988-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4733588U JPH01157447U (enExample) | 1988-04-08 | 1988-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157447U true JPH01157447U (enExample) | 1989-10-30 |
Family
ID=31273549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4733588U Pending JPH01157447U (enExample) | 1988-04-08 | 1988-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157447U (enExample) |
-
1988
- 1988-04-08 JP JP4733588U patent/JPH01157447U/ja active Pending