JPS6351480U - - Google Patents
Info
- Publication number
- JPS6351480U JPS6351480U JP1986146170U JP14617086U JPS6351480U JP S6351480 U JPS6351480 U JP S6351480U JP 1986146170 U JP1986146170 U JP 1986146170U JP 14617086 U JP14617086 U JP 14617086U JP S6351480 U JPS6351480 U JP S6351480U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- package
- printed circuit
- electronic component
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986146170U JPS6351480U (enExample) | 1986-09-24 | 1986-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986146170U JPS6351480U (enExample) | 1986-09-24 | 1986-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351480U true JPS6351480U (enExample) | 1988-04-07 |
Family
ID=31058393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986146170U Pending JPS6351480U (enExample) | 1986-09-24 | 1986-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351480U (enExample) |
-
1986
- 1986-09-24 JP JP1986146170U patent/JPS6351480U/ja active Pending