JPH01156073U - - Google Patents
Info
- Publication number
- JPH01156073U JPH01156073U JP1988047776U JP4777688U JPH01156073U JP H01156073 U JPH01156073 U JP H01156073U JP 1988047776 U JP1988047776 U JP 1988047776U JP 4777688 U JP4777688 U JP 4777688U JP H01156073 U JPH01156073 U JP H01156073U
- Authority
- JP
- Japan
- Prior art keywords
- coil
- substrates
- secondary transformer
- card
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 3
- 230000001681 protective effect Effects 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Manufacture Of Motors, Generators (AREA)
- Credit Cards Or The Like (AREA)
Description
第1図はこの考案に係るICカードの分解斜視
図、第2図は第1図のICカードを組み立てた側
面断面図、第3図はコイルの巻き方を示す模式図
、第4図は従来例の側面断面図である。
1……ICカード、2……保護シート、3……
回路基板、3a,13a……嵌合孔、4……2次
側トランス、5……コア、5c……段差部、6…
…コイル、6a……リード部分、6b……中間部
分、13……補強板。
Fig. 1 is an exploded perspective view of the IC card according to this invention, Fig. 2 is a side sectional view of the assembled IC card of Fig. 1, Fig. 3 is a schematic diagram showing how to wind the coil, and Fig. 4 is the conventional one. FIG. 3 is a side cross-sectional view of an example. 1...IC card, 2...protection sheet, 3...
Circuit board, 3a, 13a... Fitting hole, 4... Secondary transformer, 5... Core, 5c... Step portion, 6...
... Coil, 6a ... Lead part, 6b ... Middle part, 13 ... Reinforcement plate.
Claims (1)
として構成される一対の基板を互いに重合すると
ともに、これら基板の外側面に保護シートを被着
することにより薄型パツケージを構成し、このパ
ツケージ内に信号伝送用の2次側トランスを実装
したICカードにおいて、 上記2次側トランスのコアは、その両端を上記
各基板に形成された嵌合孔に嵌入して保持され、 上記2次側トランスのコイルは、その中間部分
をコイルの最内周部に位置させるとともに、その
両端側を漸次外径方向に巻回し、両端のリード部
分をコイルの最外周部に位置させたことを特徴と
するICカード。[Claims for Utility Model Registration] A thin package is constructed by overlapping a pair of substrates, at least one of which is a circuit board on which an integrated circuit is mounted, and covering the outer surfaces of these substrates with a protective sheet. In the IC card in which a secondary transformer for signal transmission is mounted in this package, the core of the secondary transformer is held by fitting both ends into fitting holes formed in each of the substrates, and The coil of the secondary transformer has its middle part located at the innermost periphery of the coil, and its both ends are wound gradually in the outer radial direction, and the lead parts at both ends are located at the outermost periphery of the coil. An IC card featuring
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988047776U JPH0751343Y2 (en) | 1988-04-11 | 1988-04-11 | IC card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988047776U JPH0751343Y2 (en) | 1988-04-11 | 1988-04-11 | IC card |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01156073U true JPH01156073U (en) | 1989-10-26 |
JPH0751343Y2 JPH0751343Y2 (en) | 1995-11-22 |
Family
ID=31273962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988047776U Expired - Lifetime JPH0751343Y2 (en) | 1988-04-11 | 1988-04-11 | IC card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0751343Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235862A (en) * | 2007-02-20 | 2008-10-02 | Seiko Epson Corp | Coil unit and electronic instrument |
JP2009027025A (en) * | 2007-07-20 | 2009-02-05 | Seiko Epson Corp | Coil unit, and electronic instrument |
JP2009105434A (en) * | 2007-02-20 | 2009-05-14 | Seiko Epson Corp | Method of manufacturing coil unit, and jig using for manufacture |
JP2009277690A (en) * | 2008-05-12 | 2009-11-26 | Seiko Epson Corp | Coil unit and electronic apparatus using the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950754A (en) * | 1982-09-16 | 1984-03-23 | Sony Corp | Winding method and device |
JPS61214088A (en) * | 1985-03-20 | 1986-09-22 | Hitachi Maxell Ltd | Production of ic card |
JPS6213396A (en) * | 1985-07-11 | 1987-01-22 | 東京磁気印刷株式会社 | Integrated circuit card |
-
1988
- 1988-04-11 JP JP1988047776U patent/JPH0751343Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950754A (en) * | 1982-09-16 | 1984-03-23 | Sony Corp | Winding method and device |
JPS61214088A (en) * | 1985-03-20 | 1986-09-22 | Hitachi Maxell Ltd | Production of ic card |
JPS6213396A (en) * | 1985-07-11 | 1987-01-22 | 東京磁気印刷株式会社 | Integrated circuit card |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235862A (en) * | 2007-02-20 | 2008-10-02 | Seiko Epson Corp | Coil unit and electronic instrument |
JP2009105434A (en) * | 2007-02-20 | 2009-05-14 | Seiko Epson Corp | Method of manufacturing coil unit, and jig using for manufacture |
US8169286B2 (en) | 2007-02-20 | 2012-05-01 | Seiko Epson Corporation | Coil unit, method of manufacturing the same, and electronic instrument |
JP2009027025A (en) * | 2007-07-20 | 2009-02-05 | Seiko Epson Corp | Coil unit, and electronic instrument |
JP4605192B2 (en) * | 2007-07-20 | 2011-01-05 | セイコーエプソン株式会社 | Coil unit and electronic equipment |
JP2009277690A (en) * | 2008-05-12 | 2009-11-26 | Seiko Epson Corp | Coil unit and electronic apparatus using the same |
JP4508266B2 (en) * | 2008-05-12 | 2010-07-21 | セイコーエプソン株式会社 | Coil unit and electronic device using the same |
US8378774B2 (en) | 2008-05-12 | 2013-02-19 | Seiko Epson Corporation | Coil unit and electronic apparatus using the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0751343Y2 (en) | 1995-11-22 |