JPH01154669U - - Google Patents
Info
- Publication number
- JPH01154669U JPH01154669U JP1988050401U JP5040188U JPH01154669U JP H01154669 U JPH01154669 U JP H01154669U JP 1988050401 U JP1988050401 U JP 1988050401U JP 5040188 U JP5040188 U JP 5040188U JP H01154669 U JPH01154669 U JP H01154669U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- insulating layer
- wiring board
- printed wiring
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988050401U JPH01154669U (US20030220297A1-20031127-C00074.png) | 1988-04-14 | 1988-04-14 | |
| US07/312,014 US4962287A (en) | 1988-04-14 | 1989-02-16 | Flexible printed wire board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988050401U JPH01154669U (US20030220297A1-20031127-C00074.png) | 1988-04-14 | 1988-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154669U true JPH01154669U (US20030220297A1-20031127-C00074.png) | 1989-10-24 |
Family
ID=12857847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988050401U Pending JPH01154669U (US20030220297A1-20031127-C00074.png) | 1988-04-14 | 1988-04-14 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4962287A (US20030220297A1-20031127-C00074.png) |
| JP (1) | JPH01154669U (US20030220297A1-20031127-C00074.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110207A (ja) * | 2001-09-28 | 2003-04-11 | Alps Electric Co Ltd | フレキシブル基板 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3260941B2 (ja) * | 1993-06-18 | 2002-02-25 | 株式会社日立製作所 | 多層配線基板および多層配線基板の製造方法 |
| DE19956436A1 (de) * | 1999-11-24 | 2001-06-07 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Datenträgerkarte |
| US20130161083A1 (en) * | 2011-12-22 | 2013-06-27 | Tyco Electronics Corporation | Printed circuit boards and methods of manufacturing printed circuit boards |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3461436A (en) * | 1965-08-06 | 1969-08-12 | Transitron Electronic Corp | Matrix-type,permanent memory device |
| GB1386344A (en) * | 1972-02-21 | 1975-03-05 | Hochvakuum Dresden Veb | Manufacture of multiple laminated conductor boards |
| DE7624175U1 (de) * | 1976-07-31 | 1976-11-25 | Wilhelm Ruf Kg, 8000 Muenchen | Tastatur |
| JPS57133674A (en) * | 1981-02-13 | 1982-08-18 | Hitachi Ltd | Structure of multilayer wiring |
| DE3172643D1 (en) * | 1981-12-23 | 1985-11-14 | Ibm Deutschland | Multilayer ceramic substrate for semiconductor integrated circuits with a multilevel metallic structure |
-
1988
- 1988-04-14 JP JP1988050401U patent/JPH01154669U/ja active Pending
-
1989
- 1989-02-16 US US07/312,014 patent/US4962287A/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110207A (ja) * | 2001-09-28 | 2003-04-11 | Alps Electric Co Ltd | フレキシブル基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| US4962287A (en) | 1990-10-09 |
