JPH01153648U - - Google Patents
Info
- Publication number
- JPH01153648U JPH01153648U JP4553988U JP4553988U JPH01153648U JP H01153648 U JPH01153648 U JP H01153648U JP 4553988 U JP4553988 U JP 4553988U JP 4553988 U JP4553988 U JP 4553988U JP H01153648 U JPH01153648 U JP H01153648U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- terminal
- container
- substrate
- divided part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4553988U JPH01153648U (da) | 1988-04-04 | 1988-04-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4553988U JPH01153648U (da) | 1988-04-04 | 1988-04-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01153648U true JPH01153648U (da) | 1989-10-23 |
Family
ID=31271843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4553988U Pending JPH01153648U (da) | 1988-04-04 | 1988-04-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01153648U (da) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019153631A (ja) * | 2018-03-01 | 2019-09-12 | パナソニックIpマネジメント株式会社 | 電解コンデンサ |
US11302612B2 (en) | 2018-11-05 | 2022-04-12 | Fuji Electric Co., Ltd. | Lead frame wiring structure and semiconductor module |
-
1988
- 1988-04-04 JP JP4553988U patent/JPH01153648U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019153631A (ja) * | 2018-03-01 | 2019-09-12 | パナソニックIpマネジメント株式会社 | 電解コンデンサ |
US11302612B2 (en) | 2018-11-05 | 2022-04-12 | Fuji Electric Co., Ltd. | Lead frame wiring structure and semiconductor module |