JPH01153215U - - Google Patents

Info

Publication number
JPH01153215U
JPH01153215U JP5148088U JP5148088U JPH01153215U JP H01153215 U JPH01153215 U JP H01153215U JP 5148088 U JP5148088 U JP 5148088U JP 5148088 U JP5148088 U JP 5148088U JP H01153215 U JPH01153215 U JP H01153215U
Authority
JP
Japan
Prior art keywords
mold
sealed structure
resin
molding
mold cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5148088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5148088U priority Critical patent/JPH01153215U/ja
Publication of JPH01153215U publication Critical patent/JPH01153215U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
JP5148088U 1988-04-16 1988-04-16 Pending JPH01153215U (US06826419-20041130-M00005.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5148088U JPH01153215U (US06826419-20041130-M00005.png) 1988-04-16 1988-04-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5148088U JPH01153215U (US06826419-20041130-M00005.png) 1988-04-16 1988-04-16

Publications (1)

Publication Number Publication Date
JPH01153215U true JPH01153215U (US06826419-20041130-M00005.png) 1989-10-23

Family

ID=31277502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5148088U Pending JPH01153215U (US06826419-20041130-M00005.png) 1988-04-16 1988-04-16

Country Status (1)

Country Link
JP (1) JPH01153215U (US06826419-20041130-M00005.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001129833A (ja) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd 成形金型及び半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001129833A (ja) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd 成形金型及び半導体装置の製造方法

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