JPH01153208U - - Google Patents
Info
- Publication number
- JPH01153208U JPH01153208U JP4972388U JP4972388U JPH01153208U JP H01153208 U JPH01153208 U JP H01153208U JP 4972388 U JP4972388 U JP 4972388U JP 4972388 U JP4972388 U JP 4972388U JP H01153208 U JPH01153208 U JP H01153208U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- dicing
- support plate
- cut
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 claims 5
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4972388U JPH01153208U (cs) | 1988-04-12 | 1988-04-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4972388U JPH01153208U (cs) | 1988-04-12 | 1988-04-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01153208U true JPH01153208U (cs) | 1989-10-23 |
Family
ID=31275807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4972388U Pending JPH01153208U (cs) | 1988-04-12 | 1988-04-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01153208U (cs) |
-
1988
- 1988-04-12 JP JP4972388U patent/JPH01153208U/ja active Pending