JPH01151228A - Manufacture of solid electrolytic capacitor - Google Patents
Manufacture of solid electrolytic capacitorInfo
- Publication number
- JPH01151228A JPH01151228A JP62309831A JP30983187A JPH01151228A JP H01151228 A JPH01151228 A JP H01151228A JP 62309831 A JP62309831 A JP 62309831A JP 30983187 A JP30983187 A JP 30983187A JP H01151228 A JPH01151228 A JP H01151228A
- Authority
- JP
- Japan
- Prior art keywords
- electrode body
- silicone oil
- extraction terminal
- solid electrolytic
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 10
- 239000007787 solid Substances 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 229920002545 silicone oil Polymers 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 229910052715 tantalum Inorganic materials 0.000 abstract description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 4
- 238000001721 transfer moulding Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- ROSDCCJGGBNDNL-UHFFFAOYSA-N [Ta].[Pb] Chemical compound [Ta].[Pb] ROSDCCJGGBNDNL-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 abstract 4
- 238000010981 drying operation Methods 0.000 abstract 1
- 229920006268 silicone film Polymers 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、固体電解コンデンサの製造法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing solid electrolytic capacitors.
従来の技術
従来のアンダーコートを施した固体電解コンデンサ、例
エバチップタンタル固体電解コンデンサは、第4図に示
すものが一般的な製造法である。2. Description of the Related Art A conventional undercoated solid electrolytic capacitor, such as an eva-chip tantalum solid electrolytic capacitor, is generally produced by the method shown in FIG.
まず電極体1と陰極引き出し端子6とを導電性接着剤7
によって接合し、タンタルリード線2と陽極引き出し端
子6とを溶接によって接合した後、アンダーコート剤で
あるエポキシ等の樹脂3を筆等によって電極体全体に形
成する。その後トランスファーモールドや、インジエク
シ目ンモールドによって樹脂外装4を施し、外部電極引
き出し端子10が樹脂外装側面8、及び底面9に沿って
折り曲げてなるものであった。First, connect the electrode body 1 and the cathode lead terminal 6 with a conductive adhesive 7.
After joining the tantalum lead wire 2 and the anode lead terminal 6 by welding, a resin 3 such as epoxy as an undercoat agent is applied to the entire electrode body using a brush or the like. Thereafter, a resin sheath 4 was applied by transfer molding or in-die extrusion molding, and the external electrode lead terminals 10 were bent along the side surfaces 8 and bottom surface 9 of the resin sheath.
発明が解決しようとする問題点
このような従来のアンダーコート剤は、電極体に形成さ
れる膜厚が10〜500μm程度と、比較的厚膜に形成
され、電極体寸法が増大するので、外装樹脂成形時に高
い組立精度が要求される。Problems to be Solved by the Invention These conventional undercoating agents are formed on the electrode body in a relatively thick film of about 10 to 500 μm, which increases the size of the electrode body. High assembly precision is required during resin molding.
さらに電気導通性を確保するため、陰極引き出し端子と
の接合を行なった後でアンダーコート剤を塗布しなけれ
ばならないので、電極体部分のみをアンダーコートする
には、ハケや筆塗りによらなければならなかった。Furthermore, in order to ensure electrical conductivity, an undercoat agent must be applied after bonding with the cathode lead terminal, so the only way to undercoat only the electrode body is by brushing or brush painting. did not become.
従ってアンダーコートは、耐湿特性改善等を目的として
公知の技術であるが、従来の製造法は工法上及び生産性
の面で非常に不利なものであった。Therefore, undercoating is a well-known technique for improving moisture resistance, but the conventional manufacturing method is very disadvantageous in terms of construction method and productivity.
本発明はこのような問題点を解決するものであり、固体
電解コンデンサの品質安定化、及び生産性の向上を目的
としている。The present invention is intended to solve these problems, and aims to stabilize the quality of solid electrolytic capacitors and improve productivity.
問題点を解決するだめの手段
本発明はこのような従来の問題点を解決するものであり
、弁作用金属線を有する陽極体に誘電体層、半導体層、
陰極層を順次形成した電極体内部に、低粘度シリコンオ
イルを浸透させ、その後に陰極引き出し端子への接続を
行なうもので、シリコンオイルの膜厚は0.1μm以下
とするものである。Means for Solving the Problems The present invention solves these conventional problems, and includes a dielectric layer, a semiconductor layer,
Low-viscosity silicone oil is infiltrated into the electrode body in which cathode layers are sequentially formed, and then connection to the cathode lead terminal is made, and the film thickness of the silicone oil is 0.1 μm or less.
作用
本発明は以上の構成により、アンダーコート剤が電極体
内部へ浸透するため、電極体表面のアンダーコート膜厚
は0.1μm以下となり、電極体寸法の増大を防ぐこと
が出来る。Function According to the present invention, the undercoat agent permeates into the interior of the electrode body, so that the undercoat film thickness on the surface of the electrode body is 0.1 μm or less, and an increase in the size of the electrode body can be prevented.
又、電極体にアンダーコート剤を塗布する工程には、電
極体全体を浸漬する工法がとれるので作業を容易化する
ことが出来る。Further, in the step of applying the undercoat agent to the electrode body, a method of immersing the entire electrode body can be used, so that the work can be facilitated.
実施例
以下、本発明の一実施例を示す第1図を用いて説明スる
。第1図乙の様に、ステンレスフープ11に等間隔に溶
接されたタンタル固体電解コンデンサの電極体1を、ア
ンダーコート剤であるシリコンオイル12に浸漬する。EXAMPLE Hereinafter, an example of the present invention will be explained using FIG. 1. As shown in FIG. 1B, electrode bodies 1 of a tantalum solid electrolytic capacitor welded to stainless steel hoops 11 at equal intervals are immersed in silicone oil 12, which is an undercoating agent.
使用したシリコンオイルは希釈剤によって約20 C,
p、S、の粘度に調整し、乾燥は約180°Cの熱風炉
中で90分間放置した。乾燥後の電極体表面のシリコン
膜厚はO〜o、06μm程度であった。The silicone oil used had a temperature of about 20 C depending on the diluent.
The viscosity was adjusted to p, s, and dried in a hot air oven at about 180°C for 90 minutes. The silicon film thickness on the surface of the electrode body after drying was about 0 to 06 μm.
第2図は電極体表面の簡略断面図であるが、銀塗料13
の凸部にはシリコンオイルの塗膜14が形成されていな
い部分があり、この部分において電気導通性が得られ、
仮に銀塗料凸部にシリコンオイルの塗膜が形成されてい
たとしても、凹部の膜厚が0.1μm以内であれば凸部
の最小膜厚は0.001μm以下となることが確認され
ており、0.001/im以下の膜厚では1〜3v程度
の直流電圧で絶縁破壊することも確認されている。以上
のことから、シリコンオイルを浸漬した後に陰極引き出
し端子への接続を行なっても、電気導通性が確保出来る
。Figure 2 is a simplified cross-sectional view of the surface of the electrode body.
There is a part on the convex part where the silicone oil coating 14 is not formed, and electrical conductivity is obtained in this part,
It has been confirmed that even if a silicone oil film is formed on the silver paint convex parts, if the film thickness in the concave parts is within 0.1 μm, the minimum film thickness on the convex parts will be 0.001 μm or less. It has also been confirmed that dielectric breakdown occurs at a DC voltage of about 1 to 3 V when the film thickness is 0.001/im or less. From the above, even if the connection to the cathode lead terminal is made after immersion in silicone oil, electrical conductivity can be ensured.
乾燥後第1図すの様に、タンク、!レリード線2と陽極
引き出し端子6とを溶接によって接合し、電極体1と陰
極引き出し端子5とを導電性接着剤7によって接合し、
第1図Cでエポキシ樹脂4によってトランスファーモー
ルドを行ない、外部引き出し端子1oをモールド樹脂に
沿って折り曲げて完成した。After drying, as shown in Figure 1, the tank! The relief wire 2 and the anode lead terminal 6 are joined by welding, the electrode body 1 and the cathode lead terminal 5 are joined by a conductive adhesive 7,
Transfer molding was performed using epoxy resin 4 as shown in FIG. 1C, and the external lead terminal 1o was bent along the mold resin to complete the process.
完成したチップタンタル固体電解コンデンサの定格は1
6V、1.0μFで、従来法と本発明の方法について以
下の様な比較試験を行なった。The rating of the completed chip tantalum solid electrolytic capacitor is 1
The following comparative test was conducted between the conventional method and the method of the present invention at 6V and 1.0 μF.
表1は、外装成形後の電極体露出不良の発生数を比較し
たものである。従来法は2561個中5何発生している
が、本発明法は2586個中不何発発生は0個であった
。Table 1 compares the number of occurrences of defective electrode body exposure after exterior molding. In the conventional method, 5 out of 2561 cases occurred, but in the method of the present invention, 0 out of 2586 cases occurred.
表 1
第3図は、耐湿試験による電気特性を示す図で、第3図
aは静電容量変化率、第3図すは損失角の正接、第3図
Cは漏れ電流の特性を示しており、それぞれ同等の性能
を示している。Table 1 Figure 3 shows the electrical characteristics obtained by the humidity test. Figure 3a shows the capacitance change rate, Figure 3 shows the loss angle tangent, and Figure 3C shows the leakage current characteristics. Both have shown equivalent performance.
以上の結果から、露出不良については大幅々効果があり
、電気特性についても従来と同等の性能を確保しており
、明らかに本発明法が優位である。From the above results, it is clear that the method of the present invention is superior, as it has a significant effect on exposure defects and maintains the same performance as the conventional method in terms of electrical properties.
又、アンダーコート処理の作業性向上においても、第1
図aの様に電極体素子数十個を一度に浸漬出来る為、大
幅な作業効率の向上が得られる。In addition, in improving the workability of undercoat treatment,
As shown in Figure a, several dozen electrode elements can be immersed at once, resulting in a significant improvement in work efficiency.
発明の詳細
な説明したように本発明によれば、電極体内部に低粘度
シリコンオイルを浸透させたことにより、電極体寸法の
増大を防止し、露出不良の低減に大幅な効果があり、ア
ンダーコート処理後に陰極引き出し端子への接合を可能
にしたことで、生産性の向上に大幅々効来が得られる。DETAILED DESCRIPTION OF THE INVENTION According to the present invention, by infiltrating the inside of the electrode body with low-viscosity silicone oil, it is possible to prevent an increase in the size of the electrode body, and to have a significant effect on reducing poor exposure. By making it possible to bond to the cathode lead terminal after coating, productivity can be greatly improved.
第1図は本発明による製造法の一実施例を示す概略工程
図、第2図はアンダーコート後の電気導通性確保を説明
する電極体表面の断面図、第3図は従来法と本発明の方
法を比較して示す耐湿特性図、第4図は従来の製造法の
一実施例の工程を示す断面図である。
1 ・・・・・電極体、2・・・・・・タンクルリード
線、4・・・・外装樹脂、5・・・・陰極引き出し端子
、6・・・・陽極引き出し端子、7・・・・・導電性接
着剤、10・・・・・・外部電極引き出し端子、12・
・・−・・シリコンオイル、13・・・・銀塗料、14
・・・シリコンオイIし塗膜。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第4
図
(久)Fig. 1 is a schematic process diagram showing one embodiment of the manufacturing method according to the present invention, Fig. 2 is a cross-sectional view of the surface of the electrode body illustrating ensuring electrical conductivity after undercoating, and Fig. 3 is a conventional method and the present invention. FIG. 4 is a diagram illustrating moisture resistance characteristics in comparison with the methods of FIG. 1... Electrode body, 2... Tank lead wire, 4... Exterior resin, 5... Cathode lead terminal, 6... Anode lead terminal, 7... ... Conductive adhesive, 10... External electrode lead terminal, 12.
...Silicone oil, 13...Silver paint, 14
...Silicone oil I coating film. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 4
Figure (ku)
Claims (2)
層、陰極層を形成した電極体内部に、低粘度シリコンオ
イルを浸透させ、その後陰極引き出し端子への接続を行
なうことを特徴とする固体電解コンデンサの製造法。(1) Low viscosity silicone oil is infiltrated into the inside of the electrode body in which a dielectric layer, a semiconductor layer, and a cathode layer are formed on an anode body having a valve action metal wire, and then connection to a cathode lead terminal is made. A manufacturing method for solid electrolytic capacitors.
1μm以下とすることを特徴とする特許請求の範囲第1
項記載の固体電解コンデンサの製造法。(2) The thickness of the electrode body surface film of the infiltrated silicone oil is 0.
Claim 1 characterized in that the diameter is 1 μm or less.
Method for manufacturing solid electrolytic capacitors as described in Section 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62309831A JP2615712B2 (en) | 1987-12-08 | 1987-12-08 | Manufacturing method of solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62309831A JP2615712B2 (en) | 1987-12-08 | 1987-12-08 | Manufacturing method of solid electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01151228A true JPH01151228A (en) | 1989-06-14 |
JP2615712B2 JP2615712B2 (en) | 1997-06-04 |
Family
ID=17997790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62309831A Expired - Fee Related JP2615712B2 (en) | 1987-12-08 | 1987-12-08 | Manufacturing method of solid electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2615712B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02123724A (en) * | 1988-11-02 | 1990-05-11 | Elna Co Ltd | Manufacture of solid electrolytic capacitor |
JP2001126964A (en) * | 1999-10-29 | 2001-05-11 | Matsushita Electric Ind Co Ltd | Solid electrolytic capacitor and method for manufacturing the same |
JP2001126965A (en) * | 1999-10-29 | 2001-05-11 | Matsushita Electric Ind Co Ltd | Solid electrolytic capacitor and method for manufacturing the same |
EP1536441A1 (en) * | 1999-10-29 | 2005-06-01 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
WO2006118144A1 (en) * | 2005-04-27 | 2006-11-09 | Showa Denko K.K. | Solid state electrolytic capacitor and method for producing the same |
KR100833893B1 (en) * | 2006-10-19 | 2008-06-02 | 주식회사 디지털텍 | Polymer Al Capacitor Manufacturing with improved electric Charateristic |
JPWO2006118144A1 (en) * | 2005-04-27 | 2008-12-18 | 昭和電工株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
WO2021171866A1 (en) * | 2020-02-26 | 2021-09-02 | パナソニックIpマネジメント株式会社 | Capacitor element, electrolytic capacitor, insulating material, and method for manufacturing mounting substrate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5694729A (en) * | 1979-12-28 | 1981-07-31 | Fujitsu Ltd | Method of sheathing resin on sintered circuit component |
JPS60225420A (en) * | 1984-04-24 | 1985-11-09 | 日本電気株式会社 | Method of producing solid electrolytic condenser |
-
1987
- 1987-12-08 JP JP62309831A patent/JP2615712B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5694729A (en) * | 1979-12-28 | 1981-07-31 | Fujitsu Ltd | Method of sheathing resin on sintered circuit component |
JPS60225420A (en) * | 1984-04-24 | 1985-11-09 | 日本電気株式会社 | Method of producing solid electrolytic condenser |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02123724A (en) * | 1988-11-02 | 1990-05-11 | Elna Co Ltd | Manufacture of solid electrolytic capacitor |
JP2001126964A (en) * | 1999-10-29 | 2001-05-11 | Matsushita Electric Ind Co Ltd | Solid electrolytic capacitor and method for manufacturing the same |
JP2001126965A (en) * | 1999-10-29 | 2001-05-11 | Matsushita Electric Ind Co Ltd | Solid electrolytic capacitor and method for manufacturing the same |
EP1536441A1 (en) * | 1999-10-29 | 2005-06-01 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
WO2006118144A1 (en) * | 2005-04-27 | 2006-11-09 | Showa Denko K.K. | Solid state electrolytic capacitor and method for producing the same |
JPWO2006118144A1 (en) * | 2005-04-27 | 2008-12-18 | 昭和電工株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
KR100833893B1 (en) * | 2006-10-19 | 2008-06-02 | 주식회사 디지털텍 | Polymer Al Capacitor Manufacturing with improved electric Charateristic |
WO2021171866A1 (en) * | 2020-02-26 | 2021-09-02 | パナソニックIpマネジメント株式会社 | Capacitor element, electrolytic capacitor, insulating material, and method for manufacturing mounting substrate |
Also Published As
Publication number | Publication date |
---|---|
JP2615712B2 (en) | 1997-06-04 |
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Legal Events
Date | Code | Title | Description |
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LAPS | Cancellation because of no payment of annual fees |