JPH01150805A - Measuring instrument for groove shape of optical disk substrate - Google Patents
Measuring instrument for groove shape of optical disk substrateInfo
- Publication number
- JPH01150805A JPH01150805A JP31023187A JP31023187A JPH01150805A JP H01150805 A JPH01150805 A JP H01150805A JP 31023187 A JP31023187 A JP 31023187A JP 31023187 A JP31023187 A JP 31023187A JP H01150805 A JPH01150805 A JP H01150805A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- optical disk
- camber angle
- groove shape
- disk substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 230000003287 optical effect Effects 0.000 title claims abstract description 35
- 230000014509 gene expression Effects 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
ら線状あるいは同心円状の信号記録用案内溝を有する光
ディスク基板溝形状測定装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical disc substrate groove shape measuring device having spiral or concentric signal recording guide grooves.
〔従来の技術〕 。[Conventional technology].
次に、従来の光ディスク基板や溝形状測定装置について
、説明する。Next, a conventional optical disk substrate and groove shape measuring device will be explained.
第2図(a)〜(b)は従来の一例を示す模式図および
A部拡大図である。FIGS. 2(a) and 2(b) are a schematic diagram and an enlarged view of part A showing a conventional example.
第2図(a)に示す光ディスク基板溝形状測定装置は、
光ディスク基板1に対し垂直にレーザー光源2で発生し
た平行レーザービームを照射し、レーザー光が前記光デ
ィスク基板1を透過後の各次回折光強度および方向を検
出器3a〜3eにより測定する。The optical disk substrate groove shape measuring device shown in FIG. 2(a) is as follows:
A parallel laser beam generated by a laser light source 2 is irradiated perpendicularly to the optical disk substrate 1, and after the laser beam passes through the optical disk substrate 1, the intensity and direction of each order of diffraction light are measured by detectors 3a to 3e.
回折光強度と回折格子の形状(ここでは、光ディスク基
板の溝形状に相当する)の関係については、回折格子の
各種形状について関係式が導かれているので、前記回折
光を検出器3a〜3eで測定した結果から光ディスク基
板の溝形状を求めることができる。コ)、′
たとえば、前記回併光の測定結果が回折0次光強度工。Regarding the relationship between the intensity of the diffracted light and the shape of the diffraction grating (corresponding to the groove shape of the optical disc substrate), relational expressions have been derived for various shapes of the diffraction grating. The groove shape of the optical disk substrate can be determined from the measurement results. f),' For example, the measurement result of the diffraction light is the 0th order diffraction light intensity measurement.
1回折1次光強度L(I+=I++=■−+)、回折2
次光強度I 2 (I 2= I+2= l−2)。1st diffraction 1st order light intensity L (I+=I++=■-+), diffraction 2
Order light intensity I2 (I2=I+2=l-2).
回折0次光と1次光の成す角がθであり、溝形状が矩形
溝であったとすると、溝のピッチ(P)2幅(W)、深
さ(D)は次式(1)〜(3)式のように求められる。Assuming that the angle formed by the 0th-order diffracted light and the 1st-order light is θ, and the groove shape is a rectangular groove, the pitch (P), width (W), and depth (D) of the groove are determined by the following equation (1) ~ It is obtained as shown in equation (3).
λ
Pニー(1)
sinθ (λ:レーザー光波長)””、 n :
基板ffi折率
ここで5inCX= 、X
〔発明が解決しようとする問題点〕
しかしながら、このような上述した従来の光ディスク基
板溝形状測定装置は、光ディスク基板が完全にフラット
であると仮定し、光ディスク基板の反りの影響を考慮し
てないという欠点があった。λ P knee (1) sin θ (λ: laser light wavelength), n:
Substrate ffi refractive index where 5inCX= , The drawback was that it did not take into account the effects of substrate warpage.
レーザー光の基板入射角は、設計入射角に対し反り角φ
のずれが生ずることになるため、この補正が必要である
。The incident angle of the laser beam on the substrate is the warp angle φ with respect to the designed incident angle.
This correction is necessary because a deviation will occur.
また、実際における光ディスク基板の反りはさけること
ができず、しかも射出成形によって作られた光ディスク
基板では、成形条件により反り量は大きく変わるので、
反りを考慮することは重要である。In addition, warpage of optical disc substrates cannot be avoided in practice, and the amount of warpage in optical disc substrates made by injection molding varies greatly depending on the molding conditions.
It is important to consider warpage.
本発明の光ディスク基板溝形状測定装置は、コリメート
なレーザー光を発生するレーザー光源と、前記レーザー
光源より光ディスク基板にレーザー光を照射した時発生
する回折光の強度および方向を測定する検出器と、前記
光ディスク基板での反射光の方向を測定し測定された反
射光の方向から前記光ディスク基板の反り角φを求めし
かも溝形状算出にあたり前記反り角φだけレーザー光の
入射角を変えた補正式を用いることで、より正確に〔実
施例〕
次に、本発明の実施例について、図面を参照して説明す
る。The optical disc substrate groove shape measuring device of the present invention includes: a laser light source that generates collimated laser light; a detector that measures the intensity and direction of diffracted light generated when the optical disc substrate is irradiated with laser light from the laser light source; The direction of the reflected light on the optical disk substrate is measured, and the warp angle φ of the optical disk substrate is determined from the direction of the measured reflected light. In addition, when calculating the groove shape, a correction formula is used in which the incident angle of the laser beam is changed by the warp angle φ. [Embodiments] Next, embodiments of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例を示す構成図である。FIG. 1 is a block diagram showing an embodiment of the present invention.
第1図に示す光ディスク基板溝形状測定装置は、光ディ
スク基板1に対し垂直にレーザー光源2より発生したコ
リメートレーザー光を入射させる。The optical disk substrate groove shape measuring device shown in FIG. 1 allows collimated laser light generated from a laser light source 2 to enter an optical disk substrate 1 perpendicularly.
このときレーザー光はビームスプリッタ4.十波長板5
を通過して光ディスク基板1に入射する。At this time, the laser beam is transmitted to the beam splitter 4. Ten wavelength plate 5
and enters the optical disc substrate 1.
回折光は回折光検出器3a〜3eにより検出される。ま
た光ディスク基板1の裏面で反射した反射光は再び前記
十波長板5に通過することにより、ビームスプリッタ4
で取り出され、リニアイメージセンサ−6上に照射する
こととなる。The diffracted light is detected by diffracted light detectors 3a to 3e. Further, the reflected light reflected from the back surface of the optical disk substrate 1 passes through the ten-wavelength plate 5 again, and is transmitted to the beam splitter 4.
The light is then taken out and irradiated onto the linear image sensor 6.
従ってレーザー光源へのもどり光はほとんどカットされ
るという利点を有する。Therefore, it has the advantage that most of the light returning to the laser light source is cut off.
上述の構成において、光ディスク基板1が反りを持って
いない状態では、光ディスク基板1の裏ジセンサー6の
中央に照射する。In the above configuration, when the optical disc substrate 1 is not warped, the center of the back sensor 6 of the optical disc substrate 1 is irradiated with light.
これに対し、光ディスク基板が反り角φを持つている場
合には、光ディスク基板1′の裏面で反射された反射光
は、反射光経路7′のようにしてビームスプリッタ4で
取り出され、リニアイメージセンサ6上に照射されるが
このときの反射光が照射する位置は、光ディスク基板1
′の反り角φに比例した距離lだけ中央からずれたとこ
ろとなることかできる。On the other hand, when the optical disk substrate has a warp angle φ, the reflected light reflected from the back surface of the optical disk substrate 1' is taken out by the beam splitter 4 along the reflected light path 7', and the linear image is The reflected light is irradiated onto the sensor 6, but the position where the reflected light is irradiated is the optical disc substrate 1.
' can be shifted from the center by a distance l proportional to the warp angle φ.
また、このように光ディスク基板1が反りを持つ場合に
は入射レーザー光は反り角φだけ基板に対し、斜に入射
することとなる。Further, when the optical disk substrate 1 has a warp in this way, the incident laser beam will be obliquely incident on the substrate by the warp angle φ.
それゆえ、垂直入射を仮定した前に示したピッチ算出式
(1)のかわりに次に示すピッチ算出式(1)′のどと
く反り角φである場合の式を用いることで、より正確に
溝形状を求めることができる。Therefore, by using the pitch calculation formula (1) shown below instead of the pitch calculation formula (1) shown above which assumes normal incidence, it is possible to more accurately groove the groove. You can find the shape.
λ
P= (1)’5in
(θ+φ) −5inφ
〔発明の効果〕
本発明の光ディスク溝形状測定装置は光ディスク基板の
反射光を測定し、これから光ディスク基板の反り角を検
出する機能を有し、しかも、この反り角測定結果を用い
て、ピッチ算出式を補正し、より正確に溝形状を求める
ことができるという効果がある。λ P= (1)'5in
(θ+φ) -5inφ [Effects of the Invention] The optical disk groove shape measuring device of the present invention has a function of measuring the reflected light of the optical disk substrate and detecting the warpage angle of the optical disk substrate from the reflected light, and furthermore, it has the function of measuring the reflected light of the optical disk substrate and detecting the warpage angle of the optical disk substrate from the reflected light. This has the effect of correcting the pitch calculation formula and determining the groove shape more accurately.
第1図は本発明の一実施例を示す模式図、第2図(a)
、 (b)は従来の一例を示す模式およびA部拡大図
である。
l、1′・・・・・・光ディスク基板、2・・・・・・
レーザー光源、3a〜3e・・・・・・回折光検出器、
4・・・・・・ビームスプリッタ、5・・・・・・ 波
長板、6・・・・・・リニアイメージセンサ−17,7
’・・・・・・反射光経路、φ・・・・・・反り角、l
・・・・・・距離。
代理人 弁理士 内 原 音
y:反り角
第 1図Fig. 1 is a schematic diagram showing an embodiment of the present invention, Fig. 2(a)
, (b) is a schematic diagram and an enlarged view of part A showing a conventional example. l, 1'... Optical disc substrate, 2...
Laser light source, 3a to 3e...diffraction light detector,
4... Beam splitter, 5... Wave plate, 6... Linear image sensor-17, 7
'...Reflected light path, φ... Warp angle, l
······distance. Agent Patent Attorney Oto Uchihara: Warp angle Figure 1
Claims (1)
、前記レーザー光源より光ディスク基板にレーザー光を
照射した時発生する回折光の強度および方向を測定する
検出器と、前記レーザー光が光ディスク基板で反射した
反射光の方向を測定し測定された反射光の方向から前記
光ディスク基板の反り角を求め、溝形状算出にあたり、
前記反り角だけ入射角を変えた補正式を用いて溝形状を
測定するための反射光検出器とを含むことを特徴とする
光ディスク基板溝形状測定装置。a laser light source that generates laser light with a small spread angle; a detector that measures the intensity and direction of diffracted light generated when the laser light source irradiates the optical disc substrate with the laser light; Measure the direction of the reflected light, determine the warp angle of the optical disk substrate from the measured direction of the reflected light, and calculate the groove shape.
An optical disk substrate groove shape measuring device comprising: a reflected light detector for measuring the groove shape using a correction formula in which the incident angle is changed by the warpage angle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31023187A JPH01150805A (en) | 1987-12-07 | 1987-12-07 | Measuring instrument for groove shape of optical disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31023187A JPH01150805A (en) | 1987-12-07 | 1987-12-07 | Measuring instrument for groove shape of optical disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01150805A true JPH01150805A (en) | 1989-06-13 |
Family
ID=18002764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31023187A Pending JPH01150805A (en) | 1987-12-07 | 1987-12-07 | Measuring instrument for groove shape of optical disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01150805A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002516984A (en) * | 1998-05-28 | 2002-06-11 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Apparatus and method for measuring properties of a structure |
-
1987
- 1987-12-07 JP JP31023187A patent/JPH01150805A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002516984A (en) * | 1998-05-28 | 2002-06-11 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Apparatus and method for measuring properties of a structure |
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