JPH01146529U - - Google Patents
Info
- Publication number
- JPH01146529U JPH01146529U JP1988043011U JP4301188U JPH01146529U JP H01146529 U JPH01146529 U JP H01146529U JP 1988043011 U JP1988043011 U JP 1988043011U JP 4301188 U JP4301188 U JP 4301188U JP H01146529 U JPH01146529 U JP H01146529U
- Authority
- JP
- Japan
- Prior art keywords
- lands
- external connection
- holes
- view
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043011U JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043011U JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01146529U true JPH01146529U (enExample) | 1989-10-09 |
| JPH0625006Y2 JPH0625006Y2 (ja) | 1994-06-29 |
Family
ID=31269412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988043011U Expired - Lifetime JPH0625006Y2 (ja) | 1988-03-31 | 1988-03-31 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625006Y2 (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5769766A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Ship carrier |
| JPS5769765A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Sealed body of semiconductor device |
| JPS57201839U (enExample) * | 1981-06-19 | 1982-12-22 |
-
1988
- 1988-03-31 JP JP1988043011U patent/JPH0625006Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5769766A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Ship carrier |
| JPS5769765A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Sealed body of semiconductor device |
| JPS57201839U (enExample) * | 1981-06-19 | 1982-12-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625006Y2 (ja) | 1994-06-29 |