JPH01146474U - - Google Patents
Info
- Publication number
- JPH01146474U JPH01146474U JP1988043013U JP4301388U JPH01146474U JP H01146474 U JPH01146474 U JP H01146474U JP 1988043013 U JP1988043013 U JP 1988043013U JP 4301388 U JP4301388 U JP 4301388U JP H01146474 U JPH01146474 U JP H01146474U
- Authority
- JP
- Japan
- Prior art keywords
- clip
- lead
- piece
- holds
- tie bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988043013U JPH0615418Y2 (ja) | 1988-03-31 | 1988-03-31 | 電子部品のクリップリード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988043013U JPH0615418Y2 (ja) | 1988-03-31 | 1988-03-31 | 電子部品のクリップリード |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01146474U true JPH01146474U (US06566495-20030520-M00011.png) | 1989-10-09 |
JPH0615418Y2 JPH0615418Y2 (ja) | 1994-04-20 |
Family
ID=31269414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988043013U Expired - Lifetime JPH0615418Y2 (ja) | 1988-03-31 | 1988-03-31 | 電子部品のクリップリード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0615418Y2 (US06566495-20030520-M00011.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015060958A (ja) * | 2013-09-19 | 2015-03-30 | 日立オートモティブシステムズ株式会社 | リードフレーム、リードフレームを使用した電子制御装置及びリードフレーム搭載方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6073179U (ja) * | 1983-10-24 | 1985-05-23 | ソニー株式会社 | ハイブリツド基板用接続端子構造体 |
-
1988
- 1988-03-31 JP JP1988043013U patent/JPH0615418Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6073179U (ja) * | 1983-10-24 | 1985-05-23 | ソニー株式会社 | ハイブリツド基板用接続端子構造体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015060958A (ja) * | 2013-09-19 | 2015-03-30 | 日立オートモティブシステムズ株式会社 | リードフレーム、リードフレームを使用した電子制御装置及びリードフレーム搭載方法 |
US9780016B2 (en) | 2013-09-19 | 2017-10-03 | Hitachi Automotive Systems, Ltd. | Lead frame, electronic control device using lead frame, and lead-frame mounting method |
Also Published As
Publication number | Publication date |
---|---|
JPH0615418Y2 (ja) | 1994-04-20 |