JPH01145915A - Ic base board transport device - Google Patents

Abstract

PURPOSE:To enhance productivity by attaching an IC chip mounting board onto a band-shaped liner having feeder holes along the two laterals by the use of two-side adhesive sheet, transferring with a sprocket, separating from the linear together with two-side adhesive sheet at the sprocket part, and by receiving with a conveyor belt. CONSTITUTION:A two-side adhesive sheet 1 are fixed in alignment to a band- shaped liner 12 having feeder holes 12a at the two laterals, and a sprocket 14 driven by a pulse motor 15 is moved while engaged with these feeder holes 12a. An IC chip mounting board 5 is attached to the two-side adhesive sheet 1 in the position where it should stop. The liner 12 is moved, and the two-side adhesive sheet 1 and IC chip mounting board 5 are moved. When the linear 12 is bent at the sprocket 14, the two-side adhesive sheet 1 and IC chip mounting board 5 go apart from the liner 12 and transfer onto a conveyor belt 21 through a roller 20. This accomplishes high speed and high precision transportation and enhances productivity.

Description

[Detailed Description of the Invention] [Summary] Regarding a transport device for assembling an IC board, for the purpose of improving productivity, a double-sided adhesive board is provided with feed holes on both sides along the edge and aligned at the center of the surface. a belt-shaped liner to which an IC chip mounting board is attached; a pulse motor interlocking sprocket that fits into the feed hole; and the double-sided adhesive integrated with the IC chip mounting board that has been separated from the liner at the sprocket portion. The plate is comprised of a conveyor belt that moves substantially in the same plane and in the same direction as the liner received by the bridge.

[Industrial application field]

The present invention relates to an IC card manufacturing device, and more particularly to an IC board transport device that improves productivity.

The process of manufacturing an IC card includes the process of bonding and fixing a double-sided adhesive plate to the IC chip mounting board on which a semiconductor chip is mounted, in order to fix and integrate the plastic plate to the IC chip mounting board. It is integrated as part of the continuous manufacturing equipment as a step in the process.

In this process, a tape-shaped liner to which double-sided adhesive plates usually formed into a predetermined shape are attached at regular intervals is moved intermittently, and while the double-sided adhesive plates are stopped at a predetermined position, The IC chip mounting board is placed on the double-sided adhesive board and pressure is applied to adhesively fix the two, and then the double-sided adhesive board integrated with the IC chip mounting board is peeled off from the liner using a special tool and sent to the next process.

In this case, the intermittent movement of the liner is performed by stopping the liner using an optical signal from a feed detection sensor that passes through guide holes provided at both ends of the constantly moving liner, and then making fine adjustments to the stop position using the guide holes. This is done by inserting positioning pins, and a special tool is used to peel off the double-sided adhesive plate integrated with the IC chip mounting board from the liner by an external device while the liner is stopped, so it can be removed at high speed. Since it is difficult to perform highly accurate work, a solution to this problem is strongly desired.

[Conventional technology]

FIG. 2 is a diagram of a device illustrating a conventional work process.

In the figure, 1 is a double-sided adhesive board with one side of the adhesive surface exposed.
2 is a belt-shaped liner provided with a guide hole 2a, 3 is a feed detection sensor, and 3a does not show its light receiving part.

Reference numeral 4 indicates a positioning pin that fits into the guide hole 2a, and reference numeral 5 indicates an IC chip mounting board on which a semiconductor chip 58 and the like are mounted on one side (the lower surface in the figure). Further, numeral 6 is a special peeling tool for removing the double-sided adhesive plate 1 to which the IC chip mounting board 5 is adhered from the liner 2.

To briefly explain the work, a hole 1 is placed in a position avoiding the semiconductor chip 5a of the IC chip mounting board 5''.
A flexible double-sided adhesive board 1 with a thickness of 0.16 mm and a size of about 48 x 25 mm is made of glassine paper or the like with a width of about 67 mm and a thickness of about 0.2 mm in the form of a strip at regular intervals. The liner 2 has guide holes 2a with a diameter of about 5 mm opened at the same distance as the double-sided adhesive plate 1 on both sides thereof. Illustrated by A
Move by being pulled in a direction.

On the other hand, the light emitted from the feed detection sensor 3 is normally blocked by the liner 2, but as shown by the dotted line B in the figure, the light emitted from the guide hole 2
Since the movement of the liner 2 is configured to stop when it passes through the liner 2 and reaches the light receiving section 3a provided on the opposite side, the feed detection sensor 3 operates while the liner 2 is moving, and the movement of the liner 2 is stopped. Stop.

Here, the positioning pin 4, which is movable in the direction C shown in the figure, is operated and its tip is inserted into the guide hole 2a to finely adjust and determine the stopping position of the liner 2, that is, the double-sided adhesive plate 1.

Next, the IC chip mounting board 5 which has been handled at a predetermined position is moved in the direction shown and placed on the double-sided adhesive plate 1 to complete the adhesion.

At this point, the positioning pin 4 is removed from the liner 2 and the liner 2 moves in the incoming direction, but is stopped after one step of movement by the feed detection sensor 3 as described above.

At this point, a special peeling tool 6 movable in the direction E in the figure is operated, and its tip part pushes up the lower surface of the double-sided adhesive plate 1 to peel the double-sided adhesive plate 1 from the liner 2 and convey it to the next process.

In this case, since the adhesive surface is exposed on the lower surface of the peeled double-sided adhesive plate 1, a plastic plate is adhesively fixed to the exposed adhesive surface in the next step after being transported to complete the IC card.

[Problem that the invention seeks to solve]

In conventional transport devices, the intermittent movement of the liner, which is constantly in motion, is controlled by an optical signal from a feed detection sensor using guide holes provided at both ends of the liner, and the fine adjustment of the stop position is further controlled by the above-mentioned method. This is done using a guide pin that fits into the guide hole.

In addition, a special tool is used to peel the double-sided adhesive plate integrated with the IC chip mounting board from the liner.

Therefore, there are problems in that it is difficult to position the double-sided adhesive plate at high speed and with high precision, and the double-sided adhesive plate integrated with the IC chip mounting board is difficult to peel off from the liner.

Furthermore, the position of the guide hole in the liner must be changed every time the type of IC chip mounting board changes, such as the size, making it difficult to smoothly change the type.

[Means for solving problems]

The above problem consists of a belt-shaped liner with feed holes on both sides along the edges and an IC chip mounting board attached to a double-sided adhesive plate aligned in the center of the surface, and a pulse motor that fits into the feed holes. an interlocking sprocket; and the I separated from the liner at the sprocket portion.
The present invention is solved by an IC board transfer device that includes a transfer heald that moves on substantially the same plane and in the same direction as the liner that receives the double-sided adhesive plate integrated with the C chip mounting board via a bridge.

[For production]

Instead of the conventional conveying device that controls the intermittent movement of the liner by adjusting the guide hole spacing of the liner depending on the type of IC chip mounting board or double-sided adhesive board, the present invention provides intermittent movement of the liner on both sides of the liner. It is controlled by a sprocket linked to a pulse motor that fits into the feed holes at intervals.

Therefore, since the frictional force between the guide hole and the positioning pin as in the conventional case does not play a role in accurately positioning the double-sided adhesive plate, the position can be determined with high precision.

Further, since the liner is moved intermittently by a sprocket linked to a pulse motor, high speed can be achieved, and the moving distance of the liner can be arbitrarily and easily changed by changing the rotation angle of the pulse motor.

Furthermore, instead of the conventional method of using a special peeling tool to peel off the double-sided adhesive plate integrated with the IC chip mounting board from the liner, the present invention eliminates the lifting of the double-sided adhesive plate due to sudden curling at the sprocket part of the liner. It is used to achieve separation from the liner.

Therefore, since a special peeling tool is not required, the device can be simplified and its reliability can be improved.

〔Example〕

FIG. 1 is a diagram illustrating a conveying device according to the present invention.

In the figure, feed holes 12a are belt-shaped and equally spaced on both sides.
Double-sided adhesive plates 1 are attached at regular intervals on the liner 12 with one side of the adhesive surface exposed.
The liner 12 is fed into a predetermined position by an idler 13 from a magazine (not shown).

Further, 14 is a sprocket equipped with a projection that fits into a feed hole 12a formed on both sides of the liner 12, and the pulse motor 15 is The structure is such that the rotation is transmitted.

Furthermore, 5 is an IC chip mounting board on which a semiconductor chip 58 and the like similar to that shown in FIG. 2 are mounted on one side (the lower surface in the figure).

Further, 21 indicates two round conveyor belts that receive the double-sided adhesive plate 1 that is being sent while being peeled off at the sprocket 14 portion of the liner 12 near both ends and convey it in the same direction. This is an auxiliary roller provided with a groove for fixing the position of the heald 21, and is disposed close to the outside of the curved portion formed by the sprocket 14 of the liner 12.

Here, to briefly explain the work, the above-mentioned
A double-sided adhesive board 1 similar to FIG. 2 having a thickness of 0.16 mm and a size of about 48 x 25 mm has a strip-like width of about 67 m with equally spaced feed holes 12a on both sides.
m, and are attached at regular intervals on a liner 12 made of glassine paper or the like with a thickness of about 0.2 mm.

On the other hand, the feed hole 12a of the liner 12 is connected to the pulse motor 15.
Since the liner 12 is configured to fit into the sprocket 14 which is interlocked with the liner 12, rotation of the pulse motor 15 in the direction shown in the drawing moves the liner 12 in the direction A'' in the drawing.

Therefore, by applying a preset signal to the pulse motor 15 to cause constant angular rotation and intermittent rotation, the liner 12, that is, the double-sided adhesive plate 1, can be moved a distance and stopped at a predetermined position effectively and accurately. There is.

Next, at the stop position of the double-sided adhesive plate 1, the IC chip mounting board 5, which has been set to be handled, is moved in the direction B in the figure, placed and pressed on the exposed adhesive surface of the double-sided adhesive plate 1, and bonded together as in FIG. Fixing has been completed.

Thereafter, the rotation of the sprocket 14 is started, and the double-sided adhesive plate 1 integrated with the IC chip mounting board 5 moves together with the liner 12. When the double-sided adhesive plate 1 is positioned on the sprocket 14, the liner 12 is attached to the sprocket 14. The liner 12 curves sharply as if being wound up, but since the double-sided adhesive plate 1 is a flat solid integrated with the RC chip mounting board 5, the liner 12 does not curve together with the liner 12 and rises from the tip in the moving direction. It is separated from the sprocket 14 and pushed out in the tangential direction of the sprocket 14 as shown in the circle. In this state, the plastic card is caught by two round conveyor belts 21 made of silicone rubber or the like moving in the direction C in the figure by an auxiliary roller 20, and conveyed to the next step where the plastic card is adhesively fixed.

In this case, the peeled surface of the double-sided adhesive plate 1 that has been peeled off from the liner 12 is the adhesive surface, but since the conveyor heald 21 is composed of two round healds made of silicone rubber, the adhesive force is extremely weak, and the adhesive force is extremely weak in the next process. It has been confirmed that there will be no hindrance to the work of

Incidentally, when changing the type of IC chip mounting board 5, it can be easily done by changing the rotation angle of the pulse motor 15 and thus the sprocket 14.

〔Effect of the invention〕

As described above, using the conveying device according to the present invention, the step of peeling off the transfer double-sided adhesive board, in which the IC chip mounting board is adhesively fixed to one side of the double-sided adhesive board attached to the liner, from the liner is carried out.
It can be carried out at high speed and with high precision, and it is also possible to easily change the product type.

Furthermore, since a dedicated peeling tool is not required when peeling the screen adhesive plate from the liner, the mechanism is simplified and the reliability of the device can be improved.

[Brief explanation of the drawing]

FIG. 1 is a diagram illustrating a conveying device according to the present invention, and FIG. 2 is a diagram illustrating a conventional work process. In the figure, 1 is a double-sided adhesive board, 1a is a hole, 5 is an IC chip mounting board, 5a is a semiconductor chip,

Claims (1)

[Claims] A belt-shaped liner (1) having feed holes (12a) on both sides along the edge and having an IC chip mounting board (5) attached to a double-sided adhesive plate (1) aligned at the center of the surface. 12), and a pulse motor (15) that fits into the feed hole (12a).
The above-mentioned person who receives the interlocking sprocket (14) and the double-sided adhesive plate (1) integrated with the above-mentioned IC chip mounting board (5) separated from the above-mentioned liner (12) at the sprocket (14) portion through a bridge. An IC board transport device comprising: a transport belt (21) that moves on substantially the same plane and in the same direction as the liner (12).