JP2699927B2 - Taping equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device taping device, and more particularly to a semiconductor device taping device for attaching a large number of semiconductor devices to a paper tape at equal intervals.

[0002]

2. Description of the Related Art FIG. 11 shows an appearance of a semiconductor device. Generally, the semiconductor device 1 has a resin sealing portion (semiconductor device body).
2, consisting of lead wires 3. One form of shipping the semiconductor device 1 to a user is radial taping. This is a form in which the tip of the lead wire 3 is affixed to a belt-shaped paper tape 4 as shown in FIG. 12 in a semiconductor device in which the lead wire 3 extends in one direction as shown in FIG. The attachment of the lead wire 3 to the paper tape 4 is performed by a cover tape 5. The paper tape 4 is provided with feed holes 6 at equal intervals.

Conventionally, a taping device for a semiconductor device that performs such radial taping uses a rotary drum 15 shown in FIG. Recesses 9 in which the resin sealing portion 2 of the semiconductor device 1 is inserted are provided at equal intervals on the outer periphery of the upper portion of the rotating drum 15, and the paper tape 4 is wound around the lower periphery of the rotating drum 15. As shown in FIG. 14, the semiconductor device 1 supplied by the horizontal feeder 17 has the resin sealing portion 2 inserted into the concave portion 9 of the rotating drum 15, and the lead wire 3 is a paper tape 4 wound around the lower portion of the rotating drum 15.
Located above. The lead wire 3 of the semiconductor device 1 supplied to the rotating drum 15 is bent by the lead bending unit 18 as the rotating drum rotates.

[0004] Next, the cover tape 5 is supplied onto the lead wire 3, and the cover tape 5 is supplied by the tape thermocompression unit 16.
Is adhered to the paper tape 4 to attach the lead wire 3 to the paper tape 4. The cover tape 5 contains an adhesive, and the adhesive is melted by heating and pressing, and the lead wire 3 and the paper tape 4 under the cover tape 5 are melted.
And glue them together.

[0005]

In this conventional semiconductor device taping device, since the rotary drum 15 is used, various functional units such as a lead bending unit 18 and a tape thermocompression unit 16 arranged on the outer periphery of the rotary drum 15 are used. Needs to be aligned perpendicular to the direction of the tangent to the outer periphery of the rotating drum 15, and there has been a problem that position adjustment is difficult.

In order to perform various operations on the semiconductor device 1 on the outer periphery of the rotating drum 15, the size of the rotating drum 15 needs to be as large as possible (for example, a structure in which the paper tape 4 is wound around the rotating drum 15). Therefore, when the rotating drum 15 is made small, the lead wire 3 of the semiconductor device 1 stuck to the paper tape 4 is bent), and there is a problem that the taping device becomes large.

[0007] Further, at present, facilities are being combined to streamline the taping process of semiconductor devices. However, in the case of combining the process of performing taping and the characteristic classification process which is the preceding process, taping is performed. In the part to be performed, separate taping must be performed on each of the semiconductor devices classified into a plurality. However, since a conventional semiconductor device taping device uses a rotating drum, the device becomes large, and it is very difficult to supply a plurality of divided semiconductor devices to the corresponding rotating drums. It was impossible.

[0008]

A semiconductor device taping device according to the present invention is a semiconductor device taping device for attaching a paper tape to the leads of a semiconductor device from which leads are led out in one direction. A transport system having a chain structure for linearly transporting the semiconductor device while holding a sealing portion, a mechanism for supplying a cover tape over the lead, and a mechanism for moving the lead between the paper tape and the cover tape. And a thermocompression bonding mechanism. The transfer system has a chain structure in which a plurality of metal blocks are connected, and transfers a semiconductor device linearly at a constant pitch. The block has a concave portion into which the semiconductor device body is inserted and a hole for positioning. The block constituting the chain structure of the transport system,
When the feed pawl of the sprocket roller is fitted into the hole, it is intermittently driven at a constant pitch. It is preferable that a first positioning pin is provided at a position where the semiconductor device main body is inserted so as to be able to protrude and retract into the hole of the block that is intermittently stopped at this position. On the other hand, it is preferable that a second positioning pin is provided at a position where the paper tape is attached so as to be able to protrude and retract into the hole of the block that is intermittently stopped at this position. Further, a spring member is provided at a position where the paper tape is to be attached, to engage with a part of the semiconductor device main body inserted into the concave portion as the semiconductor device main body moves and to push the semiconductor device main body to a predetermined position in the concave portion. Is arranged.

[0009]

Next, the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a taping device for a semiconductor device according to the present invention. In FIG. 1, the carrier belt 7 is intermittently rotated at a constant pitch by two sprocket rollers 8a and 8b. The carrier belt 7 is provided with concave portions 9 at equal intervals, and has a structure in which the resin sealing portion 2 of the semiconductor device 1 is accommodated in the concave portion 9. Carrier belt 7
Has a structure in which a plurality of carrier pieces 10 shown in FIGS. 2 and 3 are connected in a belt shape. At the center of the carrier piece 10, there is a concave portion 9 in which the resin sealing portion 2 of the semiconductor device 1 enters. Further, in order to connect adjacent carrier pieces 10, one end in the connection direction has a convex portion, and the other end has a concave portion into which the convex portion of the adjacent carrier piece can be fitted. A connection hole 11 is provided in each of the portions forming these convex portions and concave portions. The carrier piece 10 is further formed with a stepped portion such that one end side in a direction perpendicular to the connecting direction is lowered, and the lowered stepped portion is provided with a positioning hole 12 for determining the position of the carrier piece 10. . The reason for providing such a step will be described later.

As shown in FIG. 4, a plurality of carrier pieces 10 are connected to a chain structure by inserting a pin into a connecting hole 11 after fitting a convex portion into a concave portion, thereby forming a carrier belt 7. . As shown in FIG. 5, the carrier belt 7 is intermittently rotated at a constant pitch by two sprocket rollers 8a and 8b. Sprocket roller 8
Reference numerals a and 8b denote rollers having a plurality of feed claws 13, and the sprocket rollers 8a and 8b are provided when the feed claws 13 enter the positioning holes 12 of the carrier piece 10.
The carrier belt 7 is driven by the rotation of.

As shown in FIG. 6, the semiconductor device 1 is moved onto the carrier belt 7 in a state where the upper surface of the resin sealing portion 2 is vacuum-sucked by the suction nozzle 20. By descending, the resin sealing portion 2 of the semiconductor device 1 is placed in the concave portion 9 of the carrier belt 7, and the lead wire 3 is placed on the paper tape 4.

Returning to FIG. 1, the semiconductor device 1 inserted into the concave portion 9 of the carrier belt 7 by the suction nozzle 20 shown in FIG. 6 is horizontally and intermittently conveyed as the carrier belt 7 rotates. . Then, the cover tape 5 is supplied onto the lead wire 3, and the lead wire 3 of the semiconductor device 1 is connected to the paper tape 4 and the cover tape 5 by the tape thermocompression unit 16.
Is thermocompression-bonded. The feed of the carrier belt 7 and the feed of the paper tape 4 are performed synchronously at the same pitch. When the semiconductor device 1 is placed in the concave portion 9 and when the cover tape 5 is thermocompression-bonded, the position of the concave portion 9 with respect to the suction nozzle 20 and the relative position of the paper tape 4 and the semiconductor device 1 must be accurately determined.

Referring to the case where the semiconductor device 1 is placed in the concave portion 9, the position where the semiconductor device 1 is placed by the suction nozzle 20 in FIG. 1 is inserted into the positioning hole 12 of the carrier piece 10 which is intermittently stopped at this position. First in and out
(Not shown) are provided. That is,
As soon as the empty concave portion 9 reaches the position where the semiconductor device 1 is placed and stops, the first positioning pin is immediately fitted into the positioning hole 12 of the carrier top 10 having the empty concave portion 9 and the carrier top 10 is inserted. The semiconductor device 1 is placed in the empty recess 9 by the suction nozzle 20 in this state. Immediately thereafter, the first positioning pin is pulled out of the positioning hole 12, and then the carrier belt 7 is driven again by a constant pitch.

On the other hand, in the case where the cover tape 5 is thermocompression-bonded, the second positioning pin 13 '(see FIG. 8) is also provided at this position so as to be able to protrude and retract into the positioning hole 12 of the carrier piece 10 which is intermittently stopped. Is provided. At the position where the cover tape 5 is thermocompression-bonded, a leaf spring which engages with a part of the semiconductor device 1 inserted into the concave portion 9 and pushes the semiconductor device 1 in one direction in the concave portion 9 with the movement of the semiconductor device 1. 14
(See FIG. 7). This is possible because the carrier top 10 is provided with a step so that a part of the semiconductor device 1, that is, the upper surface of the resin sealing portion 2 is exposed. That is, the leaf spring 14 is connected to the carrier belt 7.
When the semiconductor device 1 placed in the recess 9 moves and approaches the position where the cover tape 5 is thermocompression-bonded, the upper surface of the resin sealing portion 2 comes into contact with the leaf spring 14. As a result, the leaf spring 14 pushes the semiconductor device 1 to the right in FIG. 7 to position the semiconductor device 1 in the recess 9. Thereafter, when the carrier top 10 stops at the thermocompression bonding position, the second positioning pins 13 'are immediately fitted into the positioning holes 12 of the carrier top 10 to position the carrier top 10, and in this state, the cover tape 5 is removed. Thermocompression bonding to paper tape 4. When the thermocompression bonding is completed, the second positioning pin 13 'is pulled out of the positioning hole 12, and the carrier belt 7 is driven again by a constant pitch.

In this manner, as shown in FIGS. 7 and 8, at the thermocompression bonding position, the positioning pins 13 'are inserted into the positioning holes 12 of the carrier piece 10 so that the carrier piece 1 is inserted.
0 is fixed, the upper surface of the resin sealing portion 2 of the semiconductor device 1 is pressed by a leaf spring 14, and the resin sealing portion 2 is pressed against one side of the carrier piece 10.
And the relative positional accuracy of the paper tape 4 is ensured.

FIG. 9 is a plan view showing an example in which a plurality of transfer systems are arranged in parallel in a taping device for a semiconductor device according to the present invention. In this embodiment, the carrier belts 7a, 7
b, 7c drive motors 21a, 21b, 2
1c are shifted so that they do not interfere with each other.
FIG. 10 is a view of the arrangement of FIG. 9 as viewed from the traveling direction of the paper tape. Here, the suction nozzle 20 is shared by the three carrier belts 7a, 7b, 7c. The semiconductor devices held by the carrier belts 7a, 7b, 7c may be of the same type or different types.

[0017]

As described above, the present invention has a transport system having a chain structure for linearly transporting a semiconductor device. The transport system has a metal chain structure and has a constant pitch. In addition, the metal chain of the transfer system has a concave portion into which the semiconductor device is inserted and a hole for positioning. What is necessary is just to position the various mechanism function units such as the characteristic measurement unit in the vertical direction, and the adjustment becomes very easy.

Further, since the paper tape and the semiconductor device are also transported horizontally and linearly, the size of the transport system is independent of the physical stress on the semiconductor device.
The entire device can be made compact.

Further, by changing the position of the sprocket roller for driving the carrier belt, a plurality of the present transport systems can be arranged in a small space, and the plurality of divided semiconductor devices can be taped by one device. Therefore, there is an advantage that the work of the previous process (characteristic selection, stamping, etc.) can be taken into the present apparatus, and the TAT can be shortened and the mixing of different types can be prevented.

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic configuration of the present invention.

FIG. 2 is a perspective view of a carrier piece constituting the carrier belt of FIG.

FIG. 3 is a three-sided view of the carrier piece of FIG. 2;

FIG. 4 is a view showing a structure of the carrier belt of FIG. 1;

FIG. 5 is a diagram illustrating a driving method of the carrier belt of FIG. 1;

FIG. 6 is a diagram illustrating an operation of inserting a semiconductor device into a carrier belt in the present invention.

FIG. 7 is a diagram for describing a method of positioning a carrier frame and a method of positioning a semiconductor device in the carrier frame.

FIG. 8 is a diagram illustrating a method of positioning a carrier frame and a method of positioning a semiconductor device in the carrier frame.

FIG. 9 shows a second embodiment of the present invention in which a plurality of carrier belts are arranged.
It is a figure showing an example.

FIG. 10 is a diagram illustrating an operation of inserting a semiconductor device into a plurality of carrier belts in a second embodiment of the present invention.

FIG. 11 is an external view of a semiconductor device to which the present invention is applied.

FIG. 12 is an external view of a radial taping of the semiconductor device of FIG. 11;

FIG. 13 is a configuration diagram of a conventional taping device for a semiconductor device.

FIG. 14 is a sectional view of a rotary drum of a conventional semiconductor device taping device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Resin sealing part 3 Lead wire 4 Paper tape 5 Cover tape 6 Feed hole 7 Carrier belt 8a, 8b Sprocket roller 9 Depression 10 Carrier frame 11 Connecting hole 12 Positioning hole 13 Feeding claw 14 Plate spring 15 Rotating drum 16 Tape thermocompression unit 17 Horizontal feeder 18 Lead bending unit 19 Rotary roller 20 Suction nozzle

Claims (7)

(57) [Claims] 1. A semiconductor device in which leads are led out in one direction.
Wherein the taping device leads to a semiconductor device that performs pasting paper tape, holding the resin sealing portion of the semiconductor device
A transport system having a chain structure for linearly transporting the semiconductor device while holding the semiconductor device, and a cover tape provided on the leads.
Supply mechanism, and the lead is connected to the paper tape and the cover.
A taping device for a semiconductor device having a mechanism for thermocompression bonding with a tape . 2. The taping device for a semiconductor device according to claim 1, wherein said transport system includes a plurality of metal blocks.
A taping device for a semiconductor device, wherein the taping device has a connected chain structure and linearly transports the semiconductor device at a constant pitch. 3. A taping device for a semiconductor device according to claim 2, wherein the block is characterized and Turkey which semiconductor device main body having a the hole for positioning the recess are inserted <br/> input And a taping device for a semiconductor device. 4. The taping device for a semiconductor device according to claim 3, wherein the block constituting the chain structure of the transfer system is intermittently driven at a constant pitch by fitting a feed claw of a sprocket roller into the hole. A taping device for a semiconductor device. Te 5. A taping device odor of a semiconductor device according to claim 4, before SL in a position where the semiconductor device main body is inserted, first retractably into the hole of the block in the intermittent stop state at this position A taping device for a semiconductor device, wherein the positioning pin is provided. 6. The taping apparatus odor of a semiconductor device according to claim 4, wherein Te, the joining is carried out position before Symbol paper tape,
A taping device for a semiconductor device, wherein a second positioning pin is provided so as to be able to protrude and retract into the hole of the block in the intermittent stop state at this position. 7. The taping apparatus odor of a semiconductor device according to claim 3, wherein Te, the joining is carried out position before Symbol paper tape,
A semiconductor device, wherein a spring member that engages with a part of the semiconductor device main body inserted into the concave portion and moves the semiconductor device main body to a predetermined position in the concave portion is arranged. Taping equipment.